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    • 2. 发明专利
    • Light-emitting module, and lighting fixture equipped with this
    • 发光模块,以及与此配套的灯具
    • JP2012014957A
    • 2012-01-19
    • JP2010150418
    • 2010-06-30
    • Toshiba Lighting & Technology Corp東芝ライテック株式会社
    • KOYAIZU TAKESHITAKEI HARUKIKAWASHIMA KIYOKOSAITO AKIKO
    • F21S8/08F21Y101/02H01L33/50H01L33/62
    • Y02B20/72
    • PROBLEM TO BE SOLVED: To provide a light-emitting module with slow degradation of a luminous flux maintenance factor.SOLUTION: The light-emitting module 21 includes a module substrate 22, a wiring pattern 25 for a cathode, a wiring pattern 26 for an anode, a plurality of semiconductor light-emitting elements 45, bonding wires 47 to 52, and translucent sealing resin 57. The semiconductor light-emitting elements 45 are directly mounted on the module substrate 22, and these light-emitting elements 45 and the wiring patterns 25, 26 are electrically connected to the bonding wires 47 to 52. The sealing resin 57, provided on the module substrate 22 with phosphors mixed in, seals the semiconductor light-emitting elements 45, wiring patterns 25, 26, and the bonding wires 47 to 52, and a light-emitting face 57a is formed on the surface of the sealing resin 57. An occupying rate of an area covered with the sealing resin 57 of the wiring patterns 25, 26 to the light-emitting face 57a is to be 5% or more to 40% or less.
    • 要解决的问题:提供具有光通量维持系数的降低的发光模块。 解决方案:发光模块21包括模块基板22,用于阴极的布线图案25,用于阳极的布线图案26,多个半导体发光元件45,接合线47至52,以及 透光性密封树脂57.半导体发光元件45直接安装在模块基板22上,这些发光元件45和布线图案25,26与接合线47〜52电连接。密封树脂57 在配置有荧光体的模块基板22上,密封半导体发光元件45,布线图案25,26以及接合线47〜52,在密封面的表面形成有发光面57a 将布线图案25,26的密封树脂57覆盖到发光面57a的面积的占有率为5%以上且40%以下。 版权所有(C)2012,JPO&INPIT
    • 3. 发明专利
    • Light emitting module and lighting apparatus having the same
    • 发光模块和具有相同功能的照明装置
    • JP2012009781A
    • 2012-01-12
    • JP2010146733
    • 2010-06-28
    • Toshiba Lighting & Technology Corp東芝ライテック株式会社
    • KOYAIZU TSUYOSHITAKEI HARUKISAITO AKIKOKAWASHIMA KIYOKO
    • H01L33/62F21S8/08F21Y101/02H01L33/52
    • Y02B20/72
    • PROBLEM TO BE SOLVED: To provide a light emitting module capable of preventing a wiring pattern from becoming high resistance, hardly disrupting reflection of light at a module substrate side, and improving a light extraction efficiency at low cost.SOLUTION: A wiring pattern 25 for positive electrode and a wiring pattern 26 for negative electrode of a light emitting module 21 are made principally of Ag, and are provided on a module substrate 22 as light reflecting surfaces. A plurality of semiconductor light emitting elements 45 are mounted on the substrate, and these elements and wiring patterns are electrically connected with each other via bonding wires 47 to 52. A sealing resin 57 is provided on the substrate, and seals each of the light emitting elements, each part of wiring patterns and bonding wires. A part of wiring patterns not sealed with the resin, contains a feeding pad part. A protective layer 37 is coated on the unsealed part except the pad part out of the sealing resin so as to be limited as large as a periphery of the part.
    • 解决的问题:提供一种能够防止布线图形变得高电阻的发光模块,难以中断模块基板侧的光的反射,并且以低成本提高光提取效率。 解决方案:作为发光模块21的正极用布线图案25和负极用布线图案26主要由Ag构成,设置在作为光反射面的模块基板22上。 多个半导体发光元件45安装在基板上,并且这些元件和布线图案通过接合线47至52彼此电连接。密封树脂57设置在基板上,并且密封每个发光 元件,各部分布线图案和接合线。 一部分没有用树脂密封的布线图案包含馈电垫部分。 将保护层37涂覆在密封树脂之外的除了焊盘部分之外的未密封部分上,以限制该部分的外围。 版权所有(C)2012,JPO&INPIT
    • 4. 发明专利
    • Light emitting module
    • 发光模块
    • JP2010205775A
    • 2010-09-16
    • JP2009046738
    • 2009-02-27
    • Toshiba Lighting & Technology Corp東芝ライテック株式会社
    • OTANI KIYOSHISAITO AKIKOIZUMI MASAHIROSANPEI TOMOHIROHAYASHIDA YUMIKOMURATA ATSUYA
    • H01L33/48
    • H01L2224/48137
    • PROBLEM TO BE SOLVED: To provide a COB type light emitting module which can form an approximately round light distribution pattern, and can simplify laying of a bonding wire.
      SOLUTION: A plurality of light emitting groups 21-30 on a module substrate 2 include a plurality of LED arrays 31 formed of a plurality of chip-like LEDs 32 fixed on the substrate 2 in line and bonding wires for connecting the LEDs. The number of LEDs included in the respective LED arrays 31 are same. The respective groups 21-30 are arranged to occupy a rectangle region on the substrate 2 by arranging the plurality of LED arrays 31 in a direction orthogonal to a direction the arrays extend. The respective light emitting groups include two different kinds of light emitting groups in which lengths of the arrays 31 included therein in an arrangement direction are different. Lengths in arrangement directions of the LED arrays 31 of the light emitting groups 21, 22, 24, 25, 26, 27, 29, 30, which are arranged on both sides of the light emitting groups 23, 28 having the longest length in the arrangement direction of the LED arrays 31 out of the various light emitting groups, become shorter as the light emitting groups are arranged farther from the light emitting groups having the longest length.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供一种COB型发光模块,其可以形成近似圆形的配光图案,并且可以简化接合线的铺设。 解决方案:模块基板2上的多个发光组21-30包括由固定在基板2上的多个芯片状LED32形成的多个LED阵列31和用于连接LED的接合线 。 LED阵列31中包含的LED的数量相同。 各组21a通过在与阵列延伸的方向正交的方向上布置多个LED阵列31而布置成占据基板2上的矩形区域。 各个发光基团包括其中包括在排列方向上的阵列31的长度不同的两种不同的发光组。 发光组21,22,24,25,26,27,29,30的LED阵列31的配置方向的长度设置在发光组23,28的两侧的长度最长的发光组 各发光组中的LED阵列31的排列方向随着发光组远离具有最长长度的发光体排列而变短。 版权所有(C)2010,JPO&INPIT
    • 5. 发明专利
    • Led bulb and luminaire
    • LED球泡灯
    • JP2009170114A
    • 2009-07-30
    • JP2008003667
    • 2008-01-10
    • Toshiba Lighting & Technology Corp東芝ライテック株式会社
    • TAKENAKA ERIKAOGAWA KOZOSAITO AKIKOIZUMI MASAHIROTANAKA TOSHIYAOSAWA SHIGERUMORIKAWA KAZUTO
    • F21S2/00F21V3/00F21V3/04F21V23/00F21V29/00F21Y101/02
    • PROBLEM TO BE SOLVED: To effectively radiate heat from a plurality of blue LED elements to increase the luminescent efficiency when obtaining white light through a yellow phosphor by using an LED module with the plurality of blue LED elements surface-mounted as a light source.
      SOLUTION: The LED module 11A with the plurality of blue LED elements surface-mounted is attached to a heat radiating part 12 as a base part. The heat radiating part 12 radiates heat from the blue LED elements on the LED module 11A. The yellow phosphor 22 is applied to a globe 14, the LED module 11A is covered with the globe 14 applied with the yellow phosphor 22 and light emitted from the blue LED elements is converted to white light through the yellow phosphor 22 and radiated to the outside. A base 16 is attached to the heat radiating part 12 on the opposite side of the globe 14 and is electrically connected to a lighting circuit for lighting the blue LED elements.
      COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:为了有效地从多个蓝色LED元件辐射热量,以通过使用具有表面安装为多个的蓝色LED元件的LED模块通过黄色荧光体获得白光来提高发光效率 资源。 解决方案:具有表面安装的多个蓝色LED元件的LED模块11A被附接到作为基座的散热部件12。 散热部分12从LED模块11A上的蓝色LED元件辐射热量。 黄色荧光体22被施加到球体14上,LED模块11A被施加有黄色荧光体22的球体14覆盖,并且从蓝色LED元件发射的光通过黄色荧光体22转换为白色光并辐射到外部 。 底座16在灯罩14的相对侧附接到散热部12,并且电连接到照明电路以照亮蓝色LED元件。 版权所有(C)2009,JPO&INPIT
    • 7. 发明专利
    • Illumination apparatus
    • 照明设备
    • JP2008085302A
    • 2008-04-10
    • JP2007184808
    • 2007-07-13
    • Toshiba Lighting & Technology Corp東芝ライテック株式会社
    • SANPEI TOMOHIROIZUMI MASAHIRONOGI SHINJISAITO AKIKO
    • H01L33/06F21S8/04F21Y101/02H01L33/32H01L33/56H01L33/62
    • H01L2224/48091H01L2224/73265H01L2924/00014
    • PROBLEM TO BE SOLVED: To provide an illumination apparatus for easily forming a reflective layer, and for efficiently extracting the rays of light.
      SOLUTION: An illumination apparatus (1) is provided with a plurality of semiconductor light-emitting devices (5), reflective layers (3, 23), a plurality of conductor parts (4c, 25a) and a translucent adhesive layer (6). Each of the semiconductor light-emitting devices (5) has a translucent substrate (11) and a semiconductor light-emitting layer (12) formed on the substrate (11). The reflective layers (3, 23) respectively have a size on which semiconductor light-emitting devices (5) are arranged at intervals. The conductor parts (4c, 25a) are formed on the reflective layers (3, 23), and electrically connected to the semiconductor light-emitting devices (5). The adhesive layer (6) bonds the substrates (11) of the semiconductor light-emitting devices (5) onto the reflective layers (3, 23), and thereby holds the semiconductor light-emitting devices (5) on the reflective layers (3, 23).
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供一种用于容易地形成反射层并有效地提取光线的照明装置。 解决方案:照明装置(1)设置有多个半导体发光器件(5),反射层(3,23),多个导体部分(4c,25a​​)和半透明粘合剂层( 6)。 每个半导体发光器件(5)具有形成在基板(11)上的透光性基板(11)和半导体发光层(12)。 反射层(3,23)分别具有间隔配置有半导体发光元件(5)的尺寸。 导体部分(4c,25a​​)形成在反射层(3,23)上,电连接到半导体发光器件(5)。 粘合剂层(6)将半导体发光元件(5)的基板(11)粘合到反射层(3,23)上,从而将半导体发光元件(5)保持在反射层(3)上 ,23)。 版权所有(C)2008,JPO&INPIT
    • 8. 发明专利
    • Light emitting device
    • 发光装置
    • JP2008084908A
    • 2008-04-10
    • JP2006260111
    • 2006-09-26
    • Toshiba Lighting & Technology Corp東芝ライテック株式会社
    • OTANI KIYOSHISAITO AKIKOIZUMI MASAHIRONISHIMURA KIYOSHISANPEI TOMOHIRO
    • H01L33/32H01L33/50H01L33/56H01L33/60H01L33/62
    • H01L2224/49107H01L2224/73265
    • PROBLEM TO BE SOLVED: To provide a light emitting device in which light take out efficiency can be enhanced while reducing the amount of phosphor used. SOLUTION: The light emitting device comprises a substrate 4 having a plurality of recesses and flat surface portions, a reflective layer 5 formed on the recesses and flat surface portions, a circuit pattern 3 formed on the reflective layer, a semiconductor light emitting element 2 having a translucent element substrate and a light emitting layer and arranged in the recess such that the boundary of the translucent element substrate and the light emitting layer opposes the side face of the circuit pattern 3, a translucent adhesive layer 21 for bonding the translucent element substrate of the semiconductor light emitting element to the reflective layer, and a resin layer 9 containing phosphor being excited by light emitted from the semiconductor light emitting element to emit light and arranged to cover the semiconductor light emitting element. COPYRIGHT: (C)2008,JPO&INPIT
    • 解决的问题:提供一种可以在减少所使用的荧光体的量的同时提高光取出效率的发光装置。 解决方案:发光器件包括具有多个凹部和平坦表面部分的基板4,形成在凹部和平坦表面部分上的反射层5,形成在反射层上的电路图案3,发射 元件2具有半透明元件基板和发光层,并且布置在凹部中,使得半透明元件基板和发光层的边界与电路图案3的侧面相对;半透明粘合剂层21,用于将半透明 半导体发光元件的元件衬底到反射层,以及包含荧光体的树脂层9被从半导体发光元件发射的光激发,并发射并覆盖半导体发光元件。 版权所有(C)2008,JPO&INPIT