专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2012146995A Method of manufacturing electronic apparatus, electronic component, and electronic apparatus 有权
标题翻译：制造电子设备，电子元件和电子设备的方法
公开(公告)号：JP2012146995A
公开(公告)日：2012-08-02
申请号：JP2012049742
申请日：2012-03-06
申请人： Toshiba Corp , 株式会社東芝
发明人： YAMAMOTO NOBUHIRO , FUNAYAMA TAKAHISA
IPC分类号： H05K3/34 , H01L21/56 , H01L21/60 , H05K3/28
CPC分类号： H01L24/29 , H01L2224/16225 , H01L2224/29036 , H01L2224/29082 , H01L2224/32225 , H01L2224/73103 , H01L2224/73104 , H01L2224/73204 , H01L2224/81191 , H01L2224/83191 , H01L2224/83192 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic apparatus capable of strongly reinforcing the connection between an electronic component and a substrate by using resin.SOLUTION: The electronic apparatus includes a substrate, a plurality of pads provided to the substrate, a component body having a bottom surface that faces the substrate, and an electronic component containing a plurality of terminals arranged on the bottom surface of the component body and the thermo-setting resin which is arranged on the bottom surface of the component body and is heated to remove an oxide film. The electronic component is placed on the substrate. The electronic component placed on the substrate is heated to soften the resin. The softened resin is caused to flow to push out the gas present between the electronic component and the substrate to the outside, and the resin is packed between the electronic component and the substrate. The electronic component is further heated so that the resin packed between the electronic component and substrate is cured.
摘要翻译：要解决的问题：提供一种能够通过使用树脂强化电子部件和基板之间的连接的电子设备的制造方法。解决方案：电子设备包括基板，设置在基板上的多个焊盘，具有面向基板的底面的部件主体和包含布置在部件的底面上的多个端子的电子部件主体和热固树脂，其被布置在组件主体的底表面上并被加热以除去氧化膜。将电子部件放置在基板上。将放置在基板上的电子部件加热以软化树脂。使软化的树脂流动以将存在于电子部件和基板之间的气体推出到外部，并且树脂被包装在电子部件和基板之间。电子部件被进一步加热，使得包装在电子部件和基板之间的树脂固化。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2012015507A Television apparatus and electronic device 有权
标题翻译：电视设备和电子设备
公开(公告)号：JP2012015507A
公开(公告)日：2012-01-19
申请号：JP2011138601
申请日：2011-06-22
申请人： Toshiba Corp , 株式会社東芝
发明人： YAMAMOTO NOBUHIRO , KOZAI TAKESHI , FUNAYAMA TAKAHISA
IPC分类号： H05K3/24 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To provide a television apparatus and an electronic device having a covering layer provided on a surface of a pad where a pressure welding terminal is welded, without a plating processing.SOLUTION: A television apparatus is provided with a substrate, a pad, a receiving part, a covering layer and an electric component. The pad is provided on a surface of the substrate. An electrical conductive material arranged on the pad flows into the receiving part in a flowable state. The covering layer is composed of at least the electrical conductive material solidified in a state where the surface of the pad is covered, and is formed by the electric conductive material flowing into the receiving part. The electric component has a pressure welding terminal welded onto the covering layer. The pad has a set area where the electric conductive material before flowing is set and an extended area which is extended in a planer state outside of the set area, and the receiving part is the extended area.
摘要翻译：要解决的问题：提供一种电视设备和电子设备，其具有设置在焊接表面上的覆盖层，其中焊接焊接端子，而不进行电镀处理。解决方案：电视设备设置有基板，焊盘，接收部分，覆盖层和电气部件。衬垫设置在衬底的表面上。布置在垫上的导电材料以可流动状态流入接收部。覆盖层至少由导电材料固化而形成，该导电材料在被覆盖的表面的状态下被固化，并且由导电材料流入接收部分而形成。电气部件具有焊接到覆盖层上的压焊端子。垫具有设置在流动之前的导电材料的设置区域和在设置区域外的平面状态下延伸的延伸区域，并且接收部分是延伸区域。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2011112405A Electronic device 审中-公开
标题翻译：电子设备
公开(公告)号：JP2011112405A
公开(公告)日：2011-06-09
申请号：JP2009266816
申请日：2009-11-24
申请人： Toshiba Corp , 株式会社東芝
发明人： YAMAMOTO NOBUHIRO
IPC分类号： G01R31/02 , H05K3/00
CPC分类号： G06F1/203 , G06F1/1615 , G06F1/182
摘要： PROBLEM TO BE SOLVED: To provide an electronic device preventing a startup of the electronic device from being ended irrespective of its user's intention, when occurrence of a short circuit is detected on the occasion of starting up the electronic device. SOLUTION: In the case of starting up a portable computer 1, when an electrical value of a separated portion which a conductor has is measured to show that the measured electrical value is a previously-set electrical value, occurrence of a short circuit in the conductor is detected, and the user is notified of the occurrence of the short circuit. When the occurrence of the short circuit in the conductor is detected, the user is notified of the occurrence of the short circuit. When the user is notified of the occurrence of the short circuit in the conductor, the user selectively performs the startup or stopping of the portable computer 1. Since the right whether to select start up of the portable computer 1 is given to the user, when the occurrence of the short circuit due to dew condensation, ion migration, etc., is detected, the startup of the portable computer 1 is prevented from being ened irrespective of the user's intention. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供防止电子设备启动的电子设备，无论其用户的意图如何，在启动电子设备时检测到发生短路。
解决方案：在启动便携式计算机1的情况下，当测量导体具有的分离部分的电气值以示出测量的电气值是预先设定的电气值时，发生短路检测到导体，并向用户通知短路的发生。当检测到导体中短路的发生时，向用户通知短路的发生。当用户被通知导体中短路的发生时，用户选择性地执行便携式计算机1的启动或停止。由于是否向用户提供了是否选择便携式计算机1的启动的权利，当检测到由于结露，离子迁移等引起的短路的发生，便可防止便携式计算机1的启动而不考虑用户的意图。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2008066541A Inspection system 审中-公开
标题翻译：检查系统
公开(公告)号：JP2008066541A
公开(公告)日：2008-03-21
申请号：JP2006243406
申请日：2006-09-07
申请人： Toshiba Corp , 株式会社東芝
发明人： YAMAMOTO NOBUHIRO
IPC分类号： H05K3/34 , G01N21/956 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide an inspection system by which several inspections can be conducted by one system and can be applied to manufacturing processes of printed circuit boards.
SOLUTION: The inspection system 1 has a transfer rail device 20 which carries and transfers a target printed circuit board α for inspection, a solder state inspection device 30 which is placed above the transfer rail device 20 and inspects the solder state of the printed circuit board α and a warpage inspection device 40 which is placed under the transfer rail device 20 and inspects the state of the warpage of the printed circuit board α. Further, the inspection system 1 has a transfer rail control part 50 which controls the transfer of the transfer rail device 20 when it receives information indicating that the inspections are completed from the solder state inspection device 30 and the warpage inspection device 40, respectively.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以通过一个系统进行多次检查的检查系统，并且可以应用于印刷电路板的制造工艺。
解决方案：检查系统1具有传送轨道装置20，该传送轨道装置20承载并传送目标印刷电路板α用于检查，焊料状态检查装置30设置在传送轨道装置20上方并检查焊接状态印刷电路板α和翘曲检查装置40，其设置在传送轨道装置20的下方，并检查印刷电路板α的翘曲状态。此外，检查系统1具有传送轨道控制部50，当传送轨道装置20从焊料状态检查装置30和翘曲检查装置40接收到表示检查结束的信息时，控制传送轨道装置20的传送。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2011254120A Printed wiring board 审中-公开
标题翻译：印刷线路板
公开(公告)号：JP2011254120A
公开(公告)日：2011-12-15
申请号：JP2011207743
申请日：2011-09-22
申请人： Toshiba Corp , 株式会社東芝
发明人： YAMAMOTO NOBUHIRO , FUNAYAMA TAKAHISA
IPC分类号： H05K1/02 , H05K1/11
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board in which reliability can be enhanced.SOLUTION: An electronic apparatus comprises a housing 12, a printed wiring board which is contained in the housing 12 and provided with a through hole 21, a shaft 16A which is passed through the through hole 21, a head 16B provided at one end of the shaft 16A, and a fixing member 16 which fixes the printed wiring board and the housing 12. The electronic apparatus further comprises a copper foil 23 provided on the printed wiring board, a cover film 24 which is provided, at a part covered with the head 16B, with an opening 25 for exposing a part of the copper foil 23 and covers the copper foil 23 at a part other than the opening 25, and a conductive material provided on the copper foil 23 on the inside of the opening 25 and connecting the head 16B and the copper foil 23 electrically.
摘要翻译：要解决的问题：提供可提高可靠性的印刷电路板。解决方案：一种电子设备，包括外壳12，容纳在外壳12中并具有通孔21的印刷电路板，穿过通孔21的轴16A，设置在其上的头16B 轴16A的端部以及固定构件16，其固定印刷线路板和壳体12.电子设备还包括设置在印刷线路板上的铜箔23，覆盖膜24设置在覆盖的部分头部16B具有用于露出铜箔23的一部分并且在开口25以外的部分覆盖铜箔23的开口25以及设置在开口25内侧的铜箔23上的导电材料并且电连接头部16B和铜箔23。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2011210361A Electronic apparatus and hard disk drive 有权
标题翻译：电子设备和硬盘驱动器
公开(公告)号：JP2011210361A
公开(公告)日：2011-10-20
申请号：JP2011106170
申请日：2011-05-11
申请人： Toshiba Corp , 株式会社東芝
发明人： YAMAMOTO NOBUHIRO , FUNAYAMA TAKAHISA
IPC分类号： G11B33/12 , G11B33/14 , H05K7/14
摘要： PROBLEM TO BE SOLVED: To provide an electronic apparatus which can improve reliability.SOLUTION: The electronic apparatus includes: a case 12; a printed circuit board contained in the case 12 and provided with a through-hole 21; and a fixing member 16 including a shaft 16A inserted in the through-hole 21 and a head 16B located at one end of the shaft 16A, and fixing the printed circuit board and the case 12. The electronic apparatus also includes: copper foil 23 provided on the printed circuit board; and a cover film 24 including an opening 25 configured to expose a part of the copper foil 23. The opening 25 is located at a position which is to be covered with the head 16B, and the cover film 24 covers the copper foil 23 at positions other than the position of the opening 25. The electronic apparatus further includes a conductive material provided on the copper foil 23 inside the opening 25 and configured to electrically connect the head 16B and the copper foil 23.
摘要翻译：要解决的问题：提供可提高可靠性的电子设备。解决方案：电子设备包括：壳体12; 包含在壳体12中并具有通孔21的印刷电路板; 以及固定构件16，其包括插入在通孔21中的轴16A和位于轴16A的一端的头16B，并且固定印刷电路板和壳体12.电子设备还包括：铜箔23，其设置有在印刷电路板上; 以及覆盖膜24，其包括被配置为暴露铜箔23的一部分的开口25.开口25位于要被头部16B覆盖的位置处，并且覆盖膜24在位置处覆盖铜箔23的位置除了开口25的位置之外，电子设备还包括设置在开口25内部的铜箔23上的导电材料，并且被配置为电连接头部16B和铜箔23。

7. 发明专利

JP2011209199A Module and electronic apparatus 有权
标题翻译：模块和电子设备
公开(公告)号：JP2011209199A
公开(公告)日：2011-10-20
申请号：JP2010078859
申请日：2010-03-30
申请人： Toshiba Corp , 株式会社東芝
发明人： FUNAYAMA TAKAHISA , YAMAMOTO NOBUHIRO
IPC分类号： G01R31/28 , H05K3/32 , H05K3/34
CPC分类号： H05K7/00 , G01R31/2853 , G01R31/31717
摘要： PROBLEM TO BE SOLVED: To provide a module capable of anticipating failure of a circuit board containing a junction part of an active element by detecting such fractures, corresponding to, for example, a junction part of a bonding material for connecting the active element and a circuit pattern, as caused by Kirkendall voids and electromigration.SOLUTION: In the module including a circuit board containing a circuit pattern formed of a first conductor, a bonding material formed of a second conductor which is different from the first conductor, a passive element and an active element joined to the circuit pattern by the bonding material, and a detection circuit provided separately from a signal circuit to the circuit board, the detection circuit includes a detector which is provided to the circuit board for connecting the first conductor electrically to the second conductor, a power supply part which feeds a current to the detector, and a measurment part which is sandwiched between one conductor of the detector and the power supply, for measuring electrical characteristics between the first and second conductors.
摘要翻译：要解决的问题：提供一种能够通过检测这样的断裂来预测包含有源元件的接合部分的电路板的故障的模块，对应于例如用于连接有源元件的接合材料的接合部分和电路图案，由Kirkendall空隙和电迁移引起。解决方案：在包括包含由第一导体形成的电路图案的电路板的模块中，由与第一导体不同的第二导体形成的接合材料，无源元件和通过所述接合材料接合到所述电路图案的有源元件以及与所述电路板的信号电路分开设置的检测电路，所述检测电路包括检测器，所述检测器设置在所述电路板上，用于将所述第一导体电连接到所述第二导体导体，将电流馈送到检测器的电源部分和夹在一个公共部件之间的测量部件检测器和电源的电感，用于测量第一和第二导体之间的电气特性。

8. 发明专利

JP2010267988A Electronic apparatus 审中-公开
标题翻译：电子设备
公开(公告)号：JP2010267988A
公开(公告)日：2010-11-25
申请号：JP2010159980
申请日：2010-07-14
申请人： Toshiba Corp , 株式会社東芝
发明人： YAMAMOTO NOBUHIRO , TAKIZAWA MINORU
IPC分类号： H05K7/14
摘要： PROBLEM TO BE SOLVED: To provide an electronic apparatus for suppressing oxidation of a metal.
SOLUTION: The electronic apparatus includes: a conductive member; a printed circuit board 21 having an insulative base material 27 and a metal foil 28 provided on one surface of the base material 27; a fixing member 23 for fixing the printed circuit board 21 to the conductive member; and a conductive adhesive 24 for covering a surface of the metal foil 28 and electrically connecting the metal foil 28 and the fixing member 23.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于抑制金属氧化的电子设备。电子设备包括：导电部件; 具有设置在母材27的一个表面上的绝缘基材27和金属箔28的印刷电路板21; 用于将印刷电路板21固定到导电构件的固定构件23; 以及用于覆盖金属箔28的表面并电连接金属箔28和固定构件23的导电粘合剂24.版权所有（C）2011，JPO＆INPIT

9. 发明专利

JP2010177470A Electronic apparatus and circuit board 有权
标题翻译：电子设备和电路板
公开(公告)号：JP2010177470A
公开(公告)日：2010-08-12
申请号：JP2009018759
申请日：2009-01-29
申请人： Toshiba Corp , 株式会社東芝
发明人： YAMAMOTO NOBUHIRO
IPC分类号： H05K3/28 , H05K1/18
CPC分类号： H01L23/3128 , H01L21/563 , H01L23/36 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/19041 , H05K3/0094 , H05K3/28 , H05K3/305 , H05K2201/015 , H05K2201/0959 , H05K2201/10734 , H05K2203/0126 , H05K2203/0545 , H05K2203/1173 , H05K2203/304 , Y02P70/613 , H01L2924/00 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To improve the reliability of products in an electronic apparatus and a circuit board. SOLUTION: The electronic apparatus includes a housing 20A; a circuit board 201 that is housed in the housing 20A a semiconductor package 202, that includes one surface 202b on which solder balls 210 are provided and the other surface 202a opposite to the one surface 202b and electrically connected to the circuit board 201 via the solder balls 210; a protective film 307, that has water repellence and is so applied on the circuit board 201 as to expose around the mounting region of the semiconductor package 202, and a jointing member 204, that is jointed to the semiconductor circuit board 201 and the semiconductor package 202, since it is provided in between the semiconductor package 202 and the mounting region of the semiconductor package. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提高电子设备和电路板中的产品的可靠性。电子设备包括壳体20A; 容纳在壳体20A中的半导体封装202的电路板201，其包括设置有焊球210的一个表面202b和与一个表面202b相对的另一个表面202a，并且经由焊料电连接到电路板201 球210; 具有防水性并且被施加在电路板201上以暴露在半导体封装202的安装区域周围的保护膜307和连接到半导体电路板201和半导体封装的接合构件204 202，因为其设置在半导体封装202和半导体封装的安装区域之间。版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP2006066811A Mask for solder printing, method for mounting component 审中-公开
标题翻译：焊接打印掩模，安装组件的方法
公开(公告)号：JP2006066811A
公开(公告)日：2006-03-09
申请号：JP2004250462
申请日：2004-08-30
申请人： Toshiba Corp , 株式会社東芝
发明人： YAMAMOTO NOBUHIRO
IPC分类号： H05K3/34 , B41N1/24
摘要： PROBLEM TO BE SOLVED: To form solder bumps which are suitable for both types of components, one of which being one where dispersion exists in lead terminals, such as a connector, QFP, SOP and BGA, and the other being one where small components (0.6 mm×0.3 mm, a 0.3 mm pitch CSP or the like) are mixed.
SOLUTION: A mask 1, for solder printing comprising a first metal layer having an opening 110a and an opening 110b, and a second layer having an opening 120a, is arranged on a printed circuit board 2 having an electrode 21, so that the second layer 12 and the printed circuit board 2 may adhere. A solder paste 4 is supplied from the side of the first layer 11, then is squeezed by a squeezing jig, then the solder bump 22a and the solder bump 22b different in height are formed.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了形成适合于两种类型的部件的焊料凸块，其中之一是在诸如连接器，QFP，SOP和BGA的引线端子中存在分散体的一种，另一种是其中小部件（0.6mm×0.3mm，0.3mm间距CSP等）混合。解决方案：具有开口110a和开口110b的第一金属层和具有开口120a的第二层的用于焊料印刷的掩模1布置在具有电极21的印刷电路板2上，使得第二层12和印刷电路板2可以粘附。从第一层11的一侧供给焊膏4，然后用挤压夹具挤压，形成高度不同的焊料凸块22a和焊料凸块22b。版权所有（C）2006，JPO＆NCIPI

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式