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1. 发明专利

JPH0382061A SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JPH0382061A
公开(公告)日：1991-04-08
申请号：JP21931989
申请日：1989-08-24
申请人： TOSHIBA CORP
发明人： ENDO MITSUYOSHI , NAKAI TOSHIO , HATANO TAKESHI , NAKAGAWA NORIKO
IPC分类号： H01L23/34 , H01L23/50
摘要： PURPOSE:To form a higher density wiring pattern and obtain higher heat dissipation and an improved working property by comprising an insulating substrate on which a semiconductor chip is mounted and a wiring pattern is formed, a heat sink member bonded to the rear surface thereof and a lead pin provided through the heat sink member. CONSTITUTION:There are provided an insulating substrate 31 on whose main surface 31a a semiconductor chip 32 is mounted and a wiring pattern 33 electrically connected to the semiconductor chip 32 is formed, a heat sink member 36 bonded to the rear surface 31b of the insulating substrate 31 on the opposite side of the main surface 31a and a lead pin 38 provided through the heat sink member 36 so that one end thereof can be electrically connected to the semiconductor chip 32 via a through hole 39 provided in the insulating substrate 31. For example, the semiconductor chip 32 is fixed and bonded to one surface 31a side of the ceramic substrate 31 consisting of aluminum nitride, and the semiconductor chip 32 and a thin film circuit 33 are connected via a TAB lead 34. Further, a cover member 35 is bonded to the outside of the thin film circuit 33 so that it covers the semiconductor chip 32 and the thin film circuit 33 to seal them airtightly.

2. 发明专利

JPH02181459A CERAMIC CIRCUIT BOARD 失效
公开(公告)号：JPH02181459A
公开(公告)日：1990-07-16
申请号：JP53589
申请日：1989-01-06
申请人： TOSHIBA CORP
发明人： NAKAI TOSHIO
IPC分类号： H01L23/12 , H01L23/15 , H05K3/38
摘要： PURPOSE:To increase contact areas between aluminum nitride layers adjacent through a grounding layer, and to augment bond strength by forming a void section into the grounding layer shaped into the board of ceramics made of aluminum nitride. CONSTITUTION:A ceramic circuit board is composed of an AlN ceramic layer 11 to which a meshy grounding layer 12 is shaped, an AlN ceramic layer 13 to which a metallized layer 14 is formed, an AlN ceramic layer 15 to which a semiconductor-element housing section 16 and an internal wiring layer 17 are shaped, and an AlN ceramic layer 18 as the protective layer of the layer 17, and the layers 11-18 are baked simultaneously and changed into multilayers. Void sections 12a are formed in a meshy pattern in the grounding layer 12, and contact areas between the layer 11 and the layer 13 are increased.

3. 发明专利

JPS6479895A PERSONAL CERTIFICATION DEVICE 失效
公开(公告)号：JPS6479895A
公开(公告)日：1989-03-24
申请号：JP23613387
申请日：1987-09-22
申请人： TOSHIBA CORP
发明人： NAKAI TOSHIO
IPC分类号： G06K17/00 , G06T7/00
摘要： PURPOSE:To obtain a personal certification device which does not certify a person other than the body part of a certified right owner by providing the device with a means for measuring the temperature of a bodily part and a means for inhibiting certification when a measured result is other than a preliminarily set temperature range. CONSTITUTION:The device is provided with a means for measuring the temperature of the bodily part to be used for certification, and when the measured result is other than the preliminarily set up temperature range, inhibiting its certification. Even if an examinee depresses the photograph of the finger print of the certified right owner or the cut finger of the owner to a finger print reading part or puts on a face mask, the temperature of the photograph, the cut finger or the face mask is measured and certification is not executed because of low temperature by setting up the temperature range close to the body temperature of the owner.

4. 发明专利

JPS6425496A CIRCUIT SUBSTRATE 失效
公开(公告)号：JPS6425496A
公开(公告)日：1989-01-27
申请号：JP18094387
申请日：1987-07-22
申请人： TOSHIBA CORP
发明人： NAKAI TOSHIO , MIYAGI TAKESHI
IPC分类号： H05K1/02
摘要： PURPOSE:To obtain a circuit substrate which has predetermined characteristic impedance even at any part of a signal line by forming a mesh-like grounding line on a flat surface parallel to the flat surface formed with the signal line. CONSTITUTION:Photosensitive polyimide coats, is prebaked, exposed, developed and postbaked to form uneven patterns higher in the order of C, B and A. Then, the metal is patterned with resist to form a mesh-like grounding line 2. Then, the whole surface is coated with the polyimide, baked to flatten the surface. Thereafter, metal is deposited on the whole surface, patterned with resist, and X-direction wirings 3 are so formed as t pass the top of the part A. Then, an insulating layer between the X-direction signal line and the Y- direction signal line and a through hole are formed. Subsequently, the deposited metal is patterned to form Y-direction wirings 4 to pass over the top of the part C, and X-Y direction wirings are contacted. Similarly, an uneven patterns are formed higher in the order of C', B', A' with the polyimide, and a mesh-like grounding line 5 is formed thereon.

5. 发明专利

JPS63310182A MANUFACTURE OF SUPERCONDUCTIVE WIRING 失效
公开(公告)号：JPS63310182A
公开(公告)日：1988-12-19
申请号：JP14663387
申请日：1987-06-12
申请人： TOSHIBA CORP
发明人： NAKAI TOSHIO , SAITO MASAYUKI
IPC分类号： H01L39/24 , H01B12/06 , H01B13/00 , H01L21/3205 , H01L23/52 , H01L39/06 , H05K3/10 , H05K3/46
摘要： PURPOSE:To enable the easy forming of a superconductive wiring in an arbitrary pattern, by forming a desired multi-component oxide superconductive material film on a substrate and radiating energy beams on a wiring pattern region of this material film. CONSTITUTION:An yttrium stabilized zirconia (YZT) is used to form a substrate 1, and a mixed film of Y, Ba, Cu oxides or a laminated film composed of their oxide films is formed as an oxide superconductive material film 2 on the substrate 1 by an electron beam evaporation method. Laser beams 3 from an YAG laser are selectively radiated in the atmosphere of 80% concentration of oxygen on a wiring pattern region of the oxide superconductive material film 2 formed on the whole surface of the substrate 1 in this way, so that a superconductive wiring 4 is formed of a Y-Ba-Cu-O group oxide superconductor in a prescribed pattern. Hence, a wiring with a desired superconductive characteristic can be easily formed.

6. 发明专利

JPS6171759A Adhesion type color image sensor 失效
标题翻译：粘合型彩色图像传感器
公开(公告)号：JPS6171759A
公开(公告)日：1986-04-12
申请号：JP19322184
申请日：1984-09-14
申请人： Toshiba Corp
发明人： NAKAI TOSHIO , SAITO TAMIO
IPC分类号： H01L27/14 , H04N1/028
摘要： PURPOSE: To increase the output level and also to facilitate positioning of a filter by setting the specific numerical relation between the number of picture element electrodes set in the primary scan direction and the pitch width in the secondary scan direction ad providing and the pitch width in the secondary scan direction and providing a delay register to a reading circuit after forming a color filter on a transparent substrate.
CONSTITUTION: The (n) pieces of picture element electrodes 2 are arrayed in the primary scan direction X together with four rows arranged in the secondary scan direction Y respectively. The leading directions and the disposition of leader electrodes 3a∼3d are set as shown in the figure. Therefore, the areas of electrodes 2a and 2d are reduced by the amount equal to the spaces of electrodes 3c and 3d compared with electrodes 2b and 2c. While the pitch of the electrodes 2 of the direction Y is set (k) times as much as that of the electrodes of the direction X (k, n: natural numbers, k>1), e.g., two times in this example. Color filters 7a∼7c are set opposite to electrodes 2a∼2c respectively and at the lower side of a transparent substrate 10. In this case, the allowable range of positioning error of the filter is set at about 1/2 length of the electrode in the direction Y. In addition, an amorphous semiconductor film 4 is formed on the electrode 2. Then delay registers 15, 16 and 17 of kn, 2kn and 3kn stages respectively are set on a common output line 13 to secure matching of the timing of output signals.
COPYRIGHT: (C)1986,JPO&Japio
摘要翻译：目的：为了提高输出电平，并且通过设定在主扫描方向上设置的像素电极的数量与辅助扫描方向上的间距宽度和提供的间距宽度之间的特定数值关系来增加滤光器的定位，二次扫描方向，并且在透明基板上形成滤色器之后，向读取电路提供延迟寄存器。构成：（n）个像素电极2分别与副扫描方向Y上排列的四行一起排列在主扫描方向X上。引导电极3a-3d的引导方向和布置如图所示设置。因此，与电极2b和2c相比，电极2a和2d的面积减小等于电极3c和3d的空间的量。尽管在该示例中，方向Y的电极2的间距被设置为方向X（k，n：自然数，k> 1）的电极的倍数的两倍（例如两倍）。滤色器7a-7c分别与透明基板10的下侧相对设置电极2a-2c。在这种情况下，将滤光器的定位误差的允许范围设定为电极的约1/2长度方向Y.此外，在电极2上形成非晶半导体膜4.然后，在公共输出线13上分别设置kn，2kn和3kn级的延迟寄存器15,16和17，以确保输出信号。

7. 发明专利

JPS6152061A Close-adhering-type color image sensor 失效
标题翻译：贴合式彩色图像传感器
公开(公告)号：JPS6152061A
公开(公告)日：1986-03-14
申请号：JP17438684
申请日：1984-08-22
申请人： Toshiba Corp
发明人： NAKAI TOSHIO , SAITO TAMIO
IPC分类号： H01L27/146 , H04N1/028 , H04N1/48
CPC分类号： H01L27/14667 , H04N1/486
摘要： PURPOSE: To enlarge a photographic area and to improve S/N of a reading output by using an amorphous semiconductor film as a photoelectric converting element and setting a pitch of a sub-scanning direction of a picture element electrode to (k) times of the pitch in the main scanning direction.
CONSTITUTION: A picture element electrode 2 and its leading-out electrode 3 are formed on a substrate 1 of glass, etc. A pitch of a picture element electrode 2 in the sub-scanning direction becomes (k) times (natural number of n>1) as much as the pitch of the picture element electrode 2 in the main scanning direction. A color filter 7 is composed of three kinds of color light filters 7a, 7b and 7c and respectively arranged to a position corresponding to 2a, 2b and 2c out of the picture element electrode 2. An amorphous semiconductor film 4 is uniformly formed by adhering as a photoelectric converting film on the picture element electrode 2. A common transparent electrode 5 is uniformly formed on the semiconductor film 4. The color filter 7 is formed through a transparent protective film 6 on the transparent electrode 5.
COPYRIGHT: (C)1986,JPO&Japio
摘要翻译：目的：通过使用非晶半导体膜作为光电转换元件来扩大照相区域并提高读出输出的S / N，并将像素电极的副扫描方向的间距设定为（k）倍在主扫描方向上的间距。构成：在玻璃等的基板1上形成有像素电极2及其引出电极3.副扫描方向上的像素电极2的间距为（k）倍（自然数n> 1）像素元件电极2在主扫描方向上的间距一样多。滤色器7由三种彩色滤光片7a，7b和7c组成，分别设置在与像素电极2的2a，2b和2c相对应的位置。非晶半导体膜4通过粘附成均匀形成在像素电极2上形成光电转换膜。在半导体膜4上均匀地形成公共透明电极5.滤色器7通过透明电极5上的透明保护膜6形成。

8. 发明专利

JPH0750741A IMAGE SENSOR 失效
公开(公告)号：JPH0750741A
公开(公告)日：1995-02-21
申请号：JP10742794
申请日：1994-04-25
申请人： TOSHIBA CORP
发明人： SAITO TAMIO , NAKAI TOSHIO , MORI KENICHI , SUZUKI KOHEI , SUDA YOSHIYUKI , TAKAYAMA AKIRA
IPC分类号： H04N1/028
摘要： PURPOSE:To provide the high-speed reading image sensor by taking out a signal of a photoelectric conversion element which is amplified by an amplifier by a switching means and reducing the noise. CONSTITUTION:An amplifier Pn is interposed between a photoelectric conversion element An (n=1-N) and a switching means Bn. A reset switching means B'n is interposed between a photoelectric conversion element An and the amplifier Pn. Thus, the S/N is improved by performing amplification in the former step of the switching means Bn being the noise generation source. More amplifier may be provided at the final stage of a common output line. If such an amplifier Pn is provided, a means which returns the photoelectric conversion element An to the initial state temporarily is required after reading signals. This operation can return, for example, the earth potential after reading signals by the reset switching means B'n. The reset switching means B'n can be driven by using a shift register selecting the switching means Bn.

9. 发明专利

JPH03104190A MULTI-LAYER WIRING BOARD AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH03104190A
公开(公告)日：1991-05-01
申请号：JP24150389
申请日：1989-09-18
申请人： TOSHIBA CORP
发明人： NAKAGAWA NORIKO , NAKAI TOSHIO
IPC分类号： H05K3/46 , H01L21/3205
摘要： PURPOSE:To realize a multi-layer structure without any disconnection by setting the width of an uppermost layer film constituting a lower conductor layer narrower than a lower metal film in a multi-layer wiring board. CONSTITUTION:There are successively deposited on an AlN ceramics board 31 Ti 32, Ni 33, and Au 34. The Au 34 is etched along the side surface thereof by applying a mask of the resist 35 and using KI. An eaves of the resist 35 hangs down by its weight and covers the side surface of the Au 34. The Ni 33 is etched up to the end of the mask 35 using an FeCl3 solution and then the Ti 32 is etched up to the mask 35 using a dimethyl amine tetraacetic acid etching solution to form a first conduction layer M1. The mask 35 is removed and a left part is covered with photosensitive polyimide 36. The same metal film as the conductor layer M1 is laminated on an insulating film 36. A second conductor layer M2 is formed and superimposed by etching using a predeter mined resist. The insulating film formed on the conductor layer exhibits an easy slope without producing film disconnection and hence a multi-layer thin film can satisfactorily be formed without intervention of complicated processes to improve the reliability of a multi-layer wiring board.

10. 发明专利

JPH0379064A SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JPH0379064A
公开(公告)日：1991-04-04
申请号：JP21691289
申请日：1989-08-22
申请人： TOSHIBA CORP
发明人： HATANO TAKESHI , NAKAI TOSHIO , TAKAGI EIJI
IPC分类号： H01L23/373
摘要： PURPOSE:To obtain a favorable radiation effect and prevent an operational failure originated from noise or the like by forming a ceramic board and a radiator with ceramics which mainly comprises either aluminum nitride or silicon carbide. CONSTITUTION:This semiconductor package comprises a ceramic board 31 mounted with a ceramic chip 32, a sealer 35 which seals the semiconductor chip 32, and a radiator 37 connected with the ceramic board 31. Here, the ceramic board 31 and the radiator 37 are formed of ceramics which mainly comprises either aluminum nitride or silicon carbide. The application of high conductivity ceramics as a material of the radiator in this manner, prevents an adverse effect upon the electric characteristics of the semiconductor device and inhibits an operational failure, thereby enhancing the discharging performance more satisfactorily.

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