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1. 发明专利

JPS61131369A Fuel cell 失效
标题翻译：燃料电池
公开(公告)号：JPS61131369A
公开(公告)日：1986-06-19
申请号：JP25304984
申请日：1984-11-30
申请人： Toshiba Ceramics Co Ltd , Toshiba Chem Corp , Toshiba Corp
发明人： SEKI TOSHIAKI , TSUSHIMA MASAMITSU , KOJIMA SUSUMU , OKAWA MASAYUKI , UESHIMA NOBUYUKI , NAGATA TSUTOMU , ITO MITSUO
IPC分类号： H01M4/96
CPC分类号： H01M4/96
摘要： PURPOSE:To prevent the increase of contact resistance and the lowering of conductivity to maintain the stable performance through a long time without causing the lowering of strength and the buckling by using carbon fibers which are made high purity by the processing of chlorine gas at high temperatures as the material of electrodes with ribs. CONSTITUTION:A unit cell is constituted by laminating a matrix 1 impregnating electrolyte, electrodes 2, 3 with ribs which have flow passages 4, 5 for fluid fuel and fluid oxidizing agent and to which catalyst is added and a separator 6. Carbon fibers which are made high purity are used as the material of electrodes 2, 3 with ribs. Carbon fibers which is reduced in impurity content are obtained by raising the temperature of the carbon fibers by the use of a graphitization furnace, and blowing chlorine gas at the temperature of 1,500 deg.C, and raising the temperature of it to 2,300 deg.C to scatter and eliminate impurities as chloride. A carbon porous plate of the electrode with ribs is obtained by carrying out the hot press forming of the mixture of the obtained carbon fibers and phenol series resin, and carrying out the processing of hardening, and carrying out the processing of carbonization for the resin, and carrying out the processing of graphitization.
摘要翻译：目的：为了防止接触电阻的增加和导电性的降低，长时间保持稳定的性能，而不会通过使用通过在高温下处理氯气而制成高纯度的碳纤维而导致强度降低和翘曲作为具有肋的电极的材料。构成：单元电池通过将基体1浸渍电解质，电极2,3与具有用于流体燃料和流体氧化剂的流动通道4,5和添加有催化剂的隔离物6和隔离物6层压而构成。碳纤维使用高纯度作为具有肋的电极2,3的材料。杂质含量降低的碳纤维是通过使用石墨化炉升高碳纤维的温度，在1500℃的温度下吹入氯气，将其升温至2300℃而获得的。以氯化物分散和消除杂质。通过进行所得到的碳纤维和酚系树脂的混合物的热压成形，进行硬化处理，进行树脂的碳化处理，得到具有肋的电极的碳多孔板，并进行石墨化处理。

2. 发明专利

JPS63280723A RESIN COMPOSITION FOR SEALING AND PRODUCTION THEREOF 失效
公开(公告)号：JPS63280723A
公开(公告)日：1988-11-17
申请号：JP11477687
申请日：1987-05-13
申请人： TOSHIBA CHEM CORP , TOSHIBA CORP
发明人： NAGATA TSUTOMU , SAWAI KAZUHIRO , KOKUBO MASANORI , YOSHIZUMI AKIRA
IPC分类号： H01L23/29 , C08G59/00 , C08G59/18 , C08G59/62 , C08L63/00 , H01L23/31
摘要： PURPOSE:To obtain the titled composition free from variation in low stress characteristics capable of giving electrical parts, etc. of high moisture resistance and reliability, by blending an epoxy resin in which a specific copolymer has been homogeneously dispersed, novolak type phenolic resin and inorganic filler. CONSTITUTION:First, (A) an epoxy resin is, for example, melted, being incorpo rated with (B) pref. 0.1-60wt.% based on the total amount of the components A and B, of acrylonitrile-butadiene-styrene copolymer followed by agitating the resultant system pref. at >=150 deg.C for >=20min to effect homogeneous disper sion. Thence, pref. 1-50wt.% of the resulting mixed resin, (C) a novolak type phenolic resin, and (D) pref. 25-95wt.% of inorganic filler (e.g., silica powder) are blended to obtain the objective composition. The molar ratio of the epoxy group in the resin A to the phenolic hydroxyl group in the resin C is pref. 0.1-10.

3. 发明专利

JPS63225618A SEALING RESIN COMPOSITION AND ITS PRODUCTION 失效
公开(公告)号：JPS63225618A
公开(公告)日：1988-09-20
申请号：JP5795487
申请日：1987-03-14
申请人： TOSHIBA CHEM CORP , TOSHIBA CORP
发明人： NAGATA TSUTOMU , SAWAI KAZUHIRO , KOCHIYAMA MASAYUKI , YOSHIZUMI AKIRA
IPC分类号： H01L23/29 , C08G59/00 , C08G59/18 , C08G59/62 , C08L63/00 , H01L23/31
摘要： PURPOSE:To obtain the title composition which is low in stress and excellent in moisture resistance, by grinding a specified polymer mixture and an epoxy resin, adding an inorganic filler to the product of grinding, heat-kneading the resulting mixture, solidifying the melt by cooling and grinding the solid. CONSTITUTION:A resin mixture is obtained by adding 0.1-60wt.% methyl methacrylate/butadiene/styrene copolymer (B) of a butadiene content >=70wt.% and a methyl methacrylate content >=15wt.%, to a melt (A) of a novolac phenolic resin and uniformly dispersing the mixture by stirring at 150 deg.C or higher for at least 20min. A mixture of 1-30wt.% this mixture with an epoxy resin (C) having at least two epoxy groups in the molecule, in an amount to give a molar ratio of the epoxy groups of component C to the phenolic hydroxyl groups of component A, of 0.1-10 is ground. To this product of grinding, 25-90wt.% inorganic filler (D) and, optionally, a mold release, a flame retardant, a silane coupling agent, a cure accelerator, etc. are added, and the resulting mixture is heat-kneaded, and the melt is solidified by cooling, and the solid is ground.

4. 发明专利

JPS63280722A RESIN COMPOSITION FOR SEALING AND PRODUCTION THEREOF 失效
公开(公告)号：JPS63280722A
公开(公告)日：1988-11-17
申请号：JP11477587
申请日：1987-05-13
申请人： TOSHIBA CHEM CORP , TOSHIBA CORP
发明人： NAGATA TSUTOMU , SAWAI KAZUHIRO , MURAKAMI SHINJI , YOSHIZUMI AKIRA
IPC分类号： H01L23/29 , C08G59/00 , C08G59/18 , C08G59/62 , C08L63/00 , H01L23/31
摘要： PURPOSE:To obtain the titled composition free from variation in low stress characteristics, capable of giving electrical parts, etc. of high moisture resistance and reliability, by blending a novolak type phenolic resin in which a specific copolymer has been homogeneously dispersed, epoxy resin and inorganic filler. CONSTITUTION:First, (A) a novolak type phenolic resin is, for example, melted, being incorporated with (B) pref. 0.1-90wt.% based on the total amount of the component A and B, of acrylonitrile-butadiene-styrene copolymer followed by agitating the resultant system pref. at >=150 deg.C for >=20min to effect homogeneous dispersion. Thence, pref. 1-30wt.% of the resulting mixed resin, (C) an epoxy resin, and (D) pref. 25-90wt.% of inorganic filler (e.g., silica powder) are blended to obtain the objective composition. Preferably, the molar ratio of the epoxy group in the resin C to the phenolic hydroxyl group in the resin A is 0.1-10.

5. 发明专利

JPS63225617A SEALING RESIN COMPOSITION AND ITS PRODUCTION 失效
公开(公告)号：JPS63225617A
公开(公告)日：1988-09-20
申请号：JP5795387
申请日：1987-03-14
申请人： TOSHIBA CHEM CORP , TOSHIBA CORP
发明人： NAGATA TSUTOMU , SAWAI KAZUHIRO , KOCHIYAMA MASAYUKI , YOSHIZUMI AKIRA
IPC分类号： H01L23/29 , C08G59/00 , C08G59/18 , C08G59/24 , C08G59/62 , C08L63/00 , H01L23/31
摘要： PURPOSE:To obtain the title composition which is low in stress and excellent in moisture resistance and whose characteristics do not disperse, by grinding a specified polymer mixture and a novolac phenolic resin, adding an inorganic filler to the product of grinding, heat-kneading the resulting mixture, solidifying the melt by cooling and grinding the solid. CONSTITUTION:A resin composition is obtained by adding 0.1-60wt.% methyl methacrylate/butadiene/styrene copolymer (B) of a butadiene content >=70wt.% and a methyl methacrylate content >=15wt.% to a melt (A) of an epoxy resin having at least two epoxy groups in the molecule, and uniformly dispersing the mixture by stirring at 150 deg.C or higher for at least 20min. 1-50wt.% this mixture is mixed with a novolac phenolic resin (C) in an amount to give a molar ratio of the epoxy groups of component A to the phenolic group of component C, of 0.1-10, the obtained mixture is ground. To this product of grinding 25-90wt.% inorganic filler (D) and, optionally, a mold release, a flame retardant, a silane coupling agent, etc. (E) are added, and the resulting mixture is heat-kneaded, and the melt is solidified by cooling, and the solid is ground.

6. 发明专利

JPS61158668A FUEL CELL 失效
公开(公告)号：JPS61158668A
公开(公告)日：1986-07-18
申请号：JP27606384
申请日：1984-12-28
申请人： TOSHIBA CORP , TOSHIBA CHEM CORP , TOSHIBA CERAMICS CO
发明人： SEKI TOSHIAKI , KOJIMA SUSUMU , TSUSHIMA MASAMITSU , NAGATA TSUTOMU , ITO MITSUO , OKAWA MASAYUKI , UESHIMA NOBUYUKI
IPC分类号： H01M4/86 , H01M4/96
摘要： PURPOSE:To enable performance to be maintained stably over the long period by injection-processing chlorine gas during a graphite-processing and using a rib-equipped electrode, which has less amount of staying impurity. CONSTITUTION:A rib-equipped electrode, which has functions of diffusion into a reactive field of a flow fuel and liquid oxidizing agent, are formed injection- processing chlorine gas during a graphite-processing of a rib-equipped electrode material. This rib-equipped electrode is formed, for example, as follows; a mixture of carbon fiber material with phenol resin is arranged having uniform thickness on the flat surface, and this material is hot-pressed and molded in an assigned thickness at the temperature 160-170 deg.C and then hardened- processed. Thereafter, a carbonized process of resin part is performed at the temperature of 1,100 deg.C, and an assigned flow-rate of chlorine gas is blown at an assigned time to obtain a carbon porous plate of the rib-equipped electrode 21, at the same time when the resin part is graphite-processed at the temperature of 1,500-2,500 deg.C, e.g., about 2,100 deg.C. Thus, an increase of contact resistance and drop of conductivity can be prevented without strength drop and buckling being generated even under operating conditions of high temperature and pressure, with performance being maintained stably over the long period.

7. 发明专利

DE3889315T2 未知
公开(公告)号：DE3889315T2
公开(公告)日：1994-09-08
申请号：DE3889315
申请日：1988-09-12
申请人： TOSHIBA KAWASAKI KK , TOSHIBA CHEM CORP
发明人： YOSHIZUMI AKIRA C O PATENT DIV , FUJIEDA SHINETSU C O PATENT DI , UCHIDA KEN C O PATENT DIVISION , KIHARA NAOKO C O PATENT DIVISI , SAWAI KAZUHIRO TOSHIBA-CHEMICA , NAGATA TSUTOMU , MURAKAMI SHINJI TOSHIBA-CHEMIC , KOUCHIYAMA SHIGEYUKI
IPC分类号： C08L9/00 , C08L61/10 , C08L51/04 , C08L55/02 , C08L61/04 , C08L61/06 , C08L63/00 , H01B3/40
摘要： A rubber-modified phenolic resin composition contains a novolak-type phenolic resin in which at least one modifying agent selected from the group consisting of an ABS resin and an MBS resin is homogeneously dispersed. The composition has good impact resistance and thermal shock resistance. The composition is prepared by adding at least one modifying agent described above to a novolak-type phenolic resin which is heated and melted at its softening point or more, so that the modifying agent is homogeneous dispersed in the resin. The resin composition is suitably used as a curing agent for an epoxy resin encapsulant for sealing electronic devices.

8. 发明专利

DE3889315D1 未知
公开(公告)号：DE3889315D1
公开(公告)日：1994-06-01
申请号：DE3889315
申请日：1988-09-12
申请人： TOSHIBA KAWASAKI KK , TOSHIBA CHEM CORP
发明人： YOSHIZUMI AKIRA C O PATENT DIV , FUJIEDA SHINETSU C O PATENT DI , UCHIDA KEN C O PATENT DIVISION , KIHARA NAOKO C O PATENT DIVISI , SAWAI KAZUHIRO TOSHIBA-CHEMICA , NAGATA TSUTOMU , MURAKAMI SHINJI TOSHIBA-CHEMIC , KOUCHIYAMA SHIGEYUKI
IPC分类号： C08L9/00 , C08L61/10 , C08L51/04 , C08L55/02 , C08L61/04 , C08L61/06 , C08L63/00 , H01B3/40
摘要： A rubber-modified phenolic resin composition contains a novolak-type phenolic resin in which at least one modifying agent selected from the group consisting of an ABS resin and an MBS resin is homogeneously dispersed. The composition has good impact resistance and thermal shock resistance. The composition is prepared by adding at least one modifying agent described above to a novolak-type phenolic resin which is heated and melted at its softening point or more, so that the modifying agent is homogeneous dispersed in the resin. The resin composition is suitably used as a curing agent for an epoxy resin encapsulant for sealing electronic devices.

9. 发明专利

JPH04120127A RESIN COMPOSITION FOR SEALING AND SEALED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH04120127A
公开(公告)日：1992-04-21
申请号：JP24053290
申请日：1990-09-11
申请人： TOSHIBA CHEM CORP
发明人： NAGATA TSUTOMU , SAWAI KAZUHIRO , KOKUBO MASANORI , SASAKI TOSHIHIKO
IPC分类号： C08G59/62 , C08G59/00 , C08G59/40 , C08G59/50 , C08L63/00 , H01L23/29 , H01L23/31
摘要： PURPOSE:To obtain the subject composition keeping excellent moisture-resistance after solder-dipping treatment and having excellent soldering-temperature resistance and long-term reliability by using a cresol-novolak epoxy resin, a specific polyfunctional phenolic resin, a specific cure accelerator and silica powder as essential components. CONSTITUTION:The objective composition contains (A) an o-cresol novolak epoxy resin, (B) a polyfunctional phenolic resin of formula I or II (n is 0 or integer of >=1; R is CmH2m+1; m is n), (C) a dialkylamino-1,8- diazabicyclo[5.0.4]undecene cure accelerator of formula III (R and R are CnH2n+1) and (D) silica powder as essential components. The amount of the component C is 0.01-5wt.% based on the resin composition. The composition can be used as a molding material by compounding the components A, B, C and D, homogeneously mixing with a mixer, etc., kneading with a hot roll under melting, solidifying the mixture by cooling and crushing the solidified product.

10. 发明专利

JPH0465420A SEALING RESIN COMPOSITION AND SEALED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0465420A
公开(公告)日：1992-03-02
申请号：JP17867690
申请日：1990-07-06
申请人： TOSHIBA CHEM CORP
发明人： NAGATA TSUTOMU , SAWAI KAZUHIRO , KOKUBO MASANORI , AMAYA YUICHI
IPC分类号： C08G59/62 , C08G59/00 , C08G59/20 , C08G59/22 , C08G59/40 , C08G59/56 , C08L63/00 , H01L23/29 , H01L23/31
摘要： PURPOSE:To obtain the subject composition having excellent moisture resistance, soldering heat-resistance, etc., and giving a sealed semiconductor device having high reliability by using an epoxy resin, a polyfunctional phenolic resin, silica powder and a specific amount of a specific cure accelerator as essential components. CONSTITUTION:The objective composition is produced by compounding (A) an epoxy resin of formula I, (B) polyfunctional phenolic resin of formula II or formula III [n is 0 or 1; R is group of formula CmH2m+1 (m is 0 or 1)] (C) 0.01-5 wt.% of a dialkylamino-1,8-diazabicyclo [5,0,4] undecene cure accelerator of formula IV [R and R are CnH2n+1 (n is 0 or 1)], (D) silica powder having an average particle diameter of preferably

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