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1. 发明专利

JP2004107123A Method for manufacturing vacuum silica glass parts and cutting apparatus for vacuum silica glass member to be used for the same 审中-公开
公开(公告)号：JP2004107123A
公开(公告)日：2004-04-08
申请号：JP2002270692
申请日：2002-09-17
申请人： Toshiba Ceramics Co Ltd , 東芝セラミックス株式会社
发明人： KONDO SHINSUKE , TSUZUKI SHINJI , YOSHITOME HIROSHI , EBINA MAKOTO
IPC分类号： C03B23/217 , C03B29/02 , C03B33/06
CPC分类号： C03B33/06 , C03B29/02
摘要： PROBLEM TO BE SOLVED: To provide a method for automating the process of cutting and removing a pipe for reduced pressure, the process which is conventionally a manual process so as to stabilize the quality of vacuum silica glass parts and to avoid hazardous works.
SOLUTION: A pipe to be connected to an evacuation apparatus is attached by welding to the housing of vacuum silica glass parts made of silica glass, the pipe is connected to the evacuation apparatus to reduce the pressure in the silica glass housing, then the pipe is closed to seal the silica glass housing, and the tube of the obtained structure is cut to manufacture the vacuum silica glass parts. The method includes a process of scratching the pipe by using a swing and rotation cutting apparatus having a cutting tool and a process of cutting the pipe at the scratched part by applying bending force or hitting force on the scratched part of the pipe. The cut flaw remaining in the housing by the above method can be heated to soften and shaped by pressing to obtain a smooth outer surface.
COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2003273049A Vacuum bonding device of wafer 审中-公开
标题翻译：真空真空连接装置
公开(公告)号：JP2003273049A
公开(公告)日：2003-09-26
申请号：JP2002074220
申请日：2002-03-18
申请人： Toshiba Ceramics Co Ltd , 東芝セラミックス株式会社
发明人： TSUZUKI SHINJI
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a vacuum bonding device of a wafer for making an adhesion layer to be uniform in film thickness and tightly bonding a wafer to a carrier plate with high planarity by uniformly depressing the wafer onto a carrier plate face and fully removing bubbles in the adhesion layer.
SOLUTION: The device is provided with a stand 3, on which the carrier plate 2 to which the wafer 1 is bonded temporarily with an adhesive is placed, a pressure plate 4 pressing the wafer 1 which is temporarily bonded to the carrier plate 2, a spherical bearing 5 disposed at the center part of an upper face of the pressure plate 4, a chamber 6 which stores them in a sealing system and in which pressure can be reduced and an air cylinder 7 as a pressurizing mechanism for pressing the spherical bearing 5 via a spherical axis 9b.
COPYRIGHT: (C)2003,JPO
摘要翻译：解决的问题：提供一种晶片的真空接合装置，其用于使粘合层的膜厚均匀，并且通过将晶片均匀地压在承载板表面上将晶片紧密地粘合到具有高平坦度的载体板上并且完全去除粘附层中的气泡。解决方案：该装置设置有支架3，其上晶片1用粘合剂暂时粘合到其上的载体板2，压板4，将晶片1暂时地接合到承载板如图2所示，设置在压力板4的上表面的中心部分的球面轴承5，将其存储在密封系统中并且可以减小压力的腔室6和作为用于按压压力的压力机构的气缸7 球面轴承5经球面轴线9b。版权所有（C）2003，JPO

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