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1. 发明授权

US07123996B2 Thermal management set-temperature correction for individual system 有权
标题翻译：个别系统的热管理设定温度校正
公开(公告)号：US07123996B2
公开(公告)日：2006-10-17
申请号：US10863684
申请日：2004-06-08
申请人： Toshiaki Fukushima , Taichiroh Nomura , Shigeru Ohshita , Jun Tanaka
发明人： Toshiaki Fukushima , Taichiroh Nomura , Shigeru Ohshita , Jun Tanaka
IPC分类号： G05D23/19 , G06F1/20
CPC分类号： G06F1/20 , G05D23/1931 , G06F1/206
摘要： A system includes a CPU, a stor for storing a process executed for lowering the temperature of the CPU in association with a set temperature, a first temperature sensor for measuring a measurement temperature of a measurement position in the CPU, a second temperature sensor for detecting that a detection position in the CPU has reached a detection temperature, an offset calculator for calculating an offset as a difference between the detection temperature and the measurement temperature, a set temperature corrector for calculating a correction value of the set temperature stored by the temperature control information stor based on the offset, and a temperature control executor for executing the temperature control process in association with the set temperature in the case where the measurement temperature has reached the correction value of the set temperature. System specific thermal management data is stored in a nonvolatile memory for retrieval following system initialization.
摘要翻译：一种系统，包括CPU，用于存储与设定温度相关联地降低CPU的温度的处理的存储器，用于测量CPU中的测量位置的测量温度的第一温度传感器，用于检测CPU的测量位置的测量温度的第一温度传感器 CPU中的检测位置已达到检测温度，偏移计算器用于计算检测温度和测量温度之间的差异的偏移量，设定温度校正器，用于计算由温度控制存储的设定温度的校正值基于偏移量的信息存储，以及温度控制执行器，用于在测量温度达到设定温度的校正值的情况下，与设定温度相关联地执行温度控制处理。系统特定的热管理数据存储在非易失性存储器中，用于在系统初始化之后进行检索。

2. 发明申请

US20050004717A1 Thermal management set-temperature correction for individual system 有权
标题翻译：个别系统的热管理设定温度校正
公开(公告)号：US20050004717A1
公开(公告)日：2005-01-06
申请号：US10863684
申请日：2004-06-08
申请人： Toshiaki Fukushima , Taichiroh Nomura , Shigeru Ohshita , Jun Tanaka
发明人： Toshiaki Fukushima , Taichiroh Nomura , Shigeru Ohshita , Jun Tanaka
IPC分类号： G05D23/19 , G06F1/20 , G05D23/00
CPC分类号： G06F1/20 , G05D23/1931 , G06F1/206
摘要： A system includes a CPU, a stor for storing a process executed for lowering the temperature of the CPU in association with a set temperature, a first temperature sensor for measuring a measurement temperature of a measurement position in the CPU, a second temperature sensor for detecting that a detection position in the CPU has reached a detection temperature, an offset calculator for calculating an offset as a difference between the detection temperature and the measurement temperature, a set temperature corrector for calculating a correction value of the set temperature stored by the temperature control information stor based on the offset, and a temperature control executor for executing the temperature control process in association with the set temperature in the case where the measurement temperature has reached the correction value of the set temperature. System specific thermal management data is stored in a nonvolatile memory for retrieval following system initialization.
摘要翻译：一种系统，包括CPU，用于存储与设定温度相关联地降低CPU的温度的处理的存储器，用于测量CPU中的测量位置的测量温度的第一温度传感器，用于检测CPU的测量位置的测量温度的第一温度传感器 CPU中的检测位置已达到检测温度，偏移计算器用于计算检测温度和测量温度之间的差异的偏移量，设定温度校正器，用于计算由温度控制存储的设定温度的校正值基于偏移量的信息存储，以及温度控制执行器，用于在测量温度达到设定温度的校正值的情况下，与设定温度相关联地执行温度控制处理。系统特定的热管理数据存储在非易失性存储器中，用于在系统初始化之后进行检索。

3. 发明授权

US07461182B2 Setting device program and method for setting a memory control 有权
标题翻译：设置设备程序和设置存储器控制的方法
公开(公告)号：US07461182B2
公开(公告)日：2008-12-02
申请号：US10730321
申请日：2003-12-08
申请人： Toshiaki Fukushima , Yohichi Matsui , Taichiroh Nomura
发明人： Toshiaki Fukushima , Yohichi Matsui , Taichiroh Nomura
IPC分类号： G06F3/00
CPC分类号： G11C29/028 , G06F13/1694 , G11C7/04 , G11C29/50012 , G11C2029/4402 , G11C2029/5002
摘要： A program for a setting device for setting a memory control device which, in part, acquires memory attribute information indicating an attribute of the memory module, a data transfer rate setting value as a rate of an upper limit value of a data transfer rate relative to a maximum data transfer rate, an upper limit value of the data transfer rate being at which the memory control device accesses the memory module, and the maximum data transfer rate being at which the memory control device is able to access the memory module. The setting device can appropriately control the heating value and the upper limit temperature for each of the plurality of memory modules mutually different in type though mutually compatible.
摘要翻译：一种用于设置存储器控制装置的程序，该存储器控制装置部分地获取指示存储器模块的属性的存储器属性信息，数据传送速率设置值作为相对于数据传输速率的上限值的速率最大数据传输速率，存储器控制设备访问存储器模块的数据传输速率的上限值以及存储器控制设备能够访问存储器模块的最大数据传输速率。设定装置可以适当地控制各种不同类型的多个存储器模块中的每一个的发热值和上限温度，尽管相互兼容。

4. 发明申请

US20090116194A1 Circuit Module and Manufacturing Method Thereof 有权
标题翻译：电路模块及其制造方法
公开(公告)号：US20090116194A1
公开(公告)日：2009-05-07
申请号：US12263558
申请日：2008-11-03
申请人： Takuji Matsushiba , Aya Minami , Yohichi Miwa , Taichiroh Nomura , Kenji Tsuboi , Takeshi Wagatsuma , Masatake Yamamoto
发明人： Takuji Matsushiba , Aya Minami , Yohichi Miwa , Taichiroh Nomura , Kenji Tsuboi , Takeshi Wagatsuma , Masatake Yamamoto
IPC分类号： H05K7/20 , H01R43/00
CPC分类号： H01L23/3677 , H01L23/13 , H01L23/4006 , H01L23/433 , H01L2023/405 , H01L2023/4062 , H01L2023/4087 , H01L2224/16 , H01L2224/73253 , H01L2924/1433 , Y10T29/49117
摘要： A circuit module includes: a thermally conductive board forming a part of a housing; a circuit board disposed above the thermally conductive board; a semiconductor chip connected to a plurality of electrode pads on a upper surface of the circuit board through solder; a heat sink connected to a upper surface of the semiconductor chip; a thermally conductive member thermally connecting the thermally conductive board to the semiconductor chip; and a plurality of fasteners passing through the thickness of the circuit board in an area surrounding the semiconductor chip to attach the heat sink to the thermally conductive board.
摘要翻译：电路模块包括：形成壳体的一部分的导热板; 布置在导热板上方的电路板; 半导体芯片，其通过焊料与所述电路板的上表面上的多个电极焊盘连接; 连接到所述半导体芯片的上表面的散热器; 将所述导热板热连接到所述半导体芯片的导热构件; 以及多个紧固件，其穿过半导体芯片周围的区域中的电路板的厚度，以将散热器附接到导热板。

5. 发明申请

US20060056151A1 System for cooling interior and external housing surfaces of an electronic apparatus 失效
公开(公告)号：US20060056151A1
公开(公告)日：2006-03-16
申请号：US11225291
申请日：2005-09-13
申请人： Chikashi Hara , Kazuyo Hayakawa , Satoru Kumai , Taichiroh Nomura , Toshio Sakurai , Hiroyuki Takenoshita
发明人： Chikashi Hara , Kazuyo Hayakawa , Satoru Kumai , Taichiroh Nomura , Toshio Sakurai , Hiroyuki Takenoshita
IPC分类号： H05K7/20
CPC分类号： H05K7/20145
摘要： A system for cooling interior and external housing surfaces of an electronic apparatus. The apparatus includes at least one electronic component, a heat transfer mechanism for transferring to an external surface of the apparatus heat generated by the electronic component, and a cooling mechanism for cooling the external surface of the apparatus. The cooling mechanism also includes an airflow generation device and an opening that enables airflow to simultaneously flow over at least one electronic component within the apparatus and over the external surface to dissipate the heat generated by the at least one electronic component.

6. 发明授权

US07782621B2 Circuit module and manufacturing method thereof 有权
标题翻译：电路模块及其制造方法
公开(公告)号：US07782621B2
公开(公告)日：2010-08-24
申请号：US12263558
申请日：2008-11-03
申请人： Takuji Matsushiba , Aya Minami , Yohichi Miwa , Taichiroh Nomura , Kenji Tsuboi , Takeshi Wagatsuma , Masatake Yamamoto
发明人： Takuji Matsushiba , Aya Minami , Yohichi Miwa , Taichiroh Nomura , Kenji Tsuboi , Takeshi Wagatsuma , Masatake Yamamoto
IPC分类号： H05K7/20
CPC分类号： H01L23/3677 , H01L23/13 , H01L23/4006 , H01L23/433 , H01L2023/405 , H01L2023/4062 , H01L2023/4087 , H01L2224/16 , H01L2224/73253 , H01L2924/1433 , Y10T29/49117
摘要： A circuit module includes: a thermally conductive board forming a part of a housing; a circuit board disposed above the thermally conductive board; a semiconductor chip connected to a plurality of electrode pads on a upper surface of the circuit board through solder; a heat sink connected to a upper surface of the semiconductor chip; a thermally conductive member thermally connecting the thermally conductive board to the semiconductor chip; and a plurality of fasteners passing through the thickness of the circuit board in an area surrounding the semiconductor chip to attach the heat sink to the thermally conductive board.
摘要翻译：电路模块包括：形成壳体的一部分的导热板; 布置在导热板上方的电路板; 半导体芯片，其通过焊料与所述电路板的上表面上的多个电极焊盘连接; 连接到所述半导体芯片的上表面的散热器; 将所述导热板热连接到所述半导体芯片的导热构件; 以及多个紧固件，其穿过半导体芯片周围的区域中的电路板的厚度，以将散热器附接到导热板。

7. 发明授权

US07480140B2 System for cooling interior and external housing surfaces of an electronic apparatus 失效
标题翻译：用于冷却电子设备的内部和外部外壳表面的系统
公开(公告)号：US07480140B2
公开(公告)日：2009-01-20
申请号：US11225291
申请日：2005-09-13
申请人： Chikashi Hara , Kazuyo Hayakawa , Satoru Kumai , Taichiroh Nomura , Toshio Sakurai , Hiroyuki Takenoshita
发明人： Chikashi Hara , Kazuyo Hayakawa , Satoru Kumai , Taichiroh Nomura , Toshio Sakurai , Hiroyuki Takenoshita
IPC分类号： H05K7/20 , H05K5/00 , A47B81/00 , A47B97/00
CPC分类号： H05K7/20145
摘要： A system for cooling interior and external housing surfaces of an electronic apparatus. The apparatus includes at least one electronic component, a heat transfer mechanism for transferring to an external surface of the apparatus heat generated by the electronic component, and a cooling mechanism for cooling the external surface of the apparatus. The cooling mechanism also includes an airflow generation device and an opening that enables airflow to simultaneously flow over at least one electronic component within the apparatus and over the external surface to dissipate the heat generated by the at least one electronic component.
摘要翻译：一种用于冷却电子设备的内部和外部壳体表面的系统。该装置包括至少一个电子部件，用于传送到由电子部件产生的装置的外表面的传热机构，以及用于冷却装置的外表面的冷却机构。冷却机构还包括气流产生装置和开口，其使得气流能够同时流过装置内的至少一个电子部件并在外表面上流动以消散由至少一个电子部件产生的热量。

8. 发明授权

US06657860B2 Heat dissipating device and computer 有权
标题翻译：散热装置和电脑
公开(公告)号：US06657860B2
公开(公告)日：2003-12-02
申请号：US10153959
申请日：2002-05-23
申请人： Yohichi Matsui , Taichiroh Nomura , Takuroh Kamimura
发明人： Yohichi Matsui , Taichiroh Nomura , Takuroh Kamimura
IPC分类号： H05K720
CPC分类号： G06F1/203 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink, cooling member, semi-conductor substrate cooling system, computer and method for providing sufficient cooling performance through a heat sink is provided. In part, there is provided a heat sink having a radiating portion for diffusing the heat conducted from a heat source and a blasting fan for blasting air to a duct-like structure formed by the radiating portion. Moreover, rates of airflows in the duct-like structure are averaged so that air circulates through all portions in the duct-like structure by forming a high-wind-pressure portion and a low-wind-pressure portion having wind pressures different from each other when air is blasted by the blasting fan in the duct-like structure and using the high-wind-pressure portion as a high-density area having a high arrangement density of radiating fins compared to the low-wind-pressure portion.
摘要翻译：提供散热器，冷却构件，半导体衬底冷却系统，通过散热器提供足够的冷却性能的计算机和方法。一方面，提供一种散热器，其具有用于将从热源传播的热量和用于喷射空气的喷砂风扇扩散到由辐射部形成的管状结构的散热部。此外，通过形成具有彼此不同的风压的高风压部分和低风压部分，使管道状结构中的气流速率平均，使得空气通过管状结构中的所有部分循环当风管状结构中的喷砂风扇吹出空气时，与低风压部分相比，使用高风压部分作为散热片布置密度高的高密度区域。

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