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    • 1. 发明授权
    • Positive photosensitive composition
    • 正光敏组合物
    • US06479209B1
    • 2002-11-12
    • US09075246
    • 1998-05-11
    • Toshiaki AoaiKenichiro SatoMorio Yagihara
    • Toshiaki AoaiKenichiro SatoMorio Yagihara
    • G03C173
    • G03F7/039G03F7/0045Y10S430/106Y10S430/111
    • Disclosed is a positive photosensitive composition capable of giving good sensitivity, resolution and resist pattern and exhibiting sufficiently high dry etching resistance on use of an exposure light source of 250 nm or less, particularly 220 nm or less, which composition comprises (A) a compound generating an acid on irradiation of an active light ray or radiation and (B) a resin having (i) at least one polycyclic-type alicyclic group, (ii) at least one ester group which decomposes by the action of an acid and increases the solubility in an alkali developer and (iii) at least one acetal group which decomposes by the action of an acid and increases the solubility in an alkali developer, or comprises (A) a compound generating an acid on irradiation of an active light ray or radiation, (C) a resin having a polycyclic-type alicyclic group and an ester group which decomposes by the action of an acid and increases the solubility in an alkali developer, and (D) a resin having a polycyclic-type alicyclic group and an acetal group which decomposes by the action of an acid and increases the solubility in an alkali developer.
    • 公开了一种能够提供良好的灵敏度,分辨率和抗蚀剂图案并且在使用250nm或更小,特别是220nm或更小的曝光光源时表现出足够高的耐干蚀刻性的正性光敏组合物,该组合物包含(A)化合物 在活性光线或辐射照射时产生酸,和(B)具有(i)至少一种多环式脂环族基团的树脂,(ii)至少一种通过酸的作用分解并增加酸的酯基 在碱性显影剂中的溶解度和(iii)至少一种通过酸的作用分解并提高其在碱性显影剂中的溶解度的缩醛基,或包含(A)在活性光线或辐射照射时产生酸的化合物 ,(C)具有多环型脂环族基团和酯基的树脂,其通过酸的作用而分解并增加在碱性显影剂中的溶解度,(D)具有多环基的树脂 ype脂环族基团和通过酸的作用而分解并增加在碱性显影剂中的溶解度的缩醛基。
    • 7. 发明授权
    • Positive type photoresist composition
    • 正型光致抗蚀剂组合物
    • US07223516B2
    • 2007-05-29
    • US09729953
    • 2000-12-06
    • Kenichiro SatoToshiaki Aoai
    • Kenichiro SatoToshiaki Aoai
    • G03F7/004
    • G03F7/039G03F7/0045Y10S430/106Y10S430/108Y10S430/111
    • A positive type photoresist composition suitable for light in the wavelength region of 170 nm to 220 nm, high in sensitivity, excellent in adhesion and giving a good resist pattern profile, which comprises a resin having an ester group represented by the following general formula [I] in its molecule and a compound generating an acid by irradiation of an active light ray or radiation: wherein R1 represents a hydrogen atom, an alkyl group or a cycloalkyl group; and R2 and R3, which may be the same or different, each represents a hydrogen atom, an alkyl group, a cycloalkyl group or -A-R4, and R2 and R3 may combine together to form a ring, wherein R4 represents a hydrogen atom, an alkyl group or a cycloalkyl group, R4 and R2 or R3 may combine together to form a ring, and A represents an oxygen atom or a sulfur atom.
    • 一种适用于170nm至220nm波长区域的光的正型光致抗蚀剂组合物,其灵敏度高,粘附性优异,并且具有良好的抗蚀剂图案轮廓,其包含具有由以下通式[I ]和通过活性光线或辐射的照射产生酸的化合物:其中R 1表示氢原子,烷基或环烷基; 和R 2和R 3可以相同或不同,分别表示氢原子,烷基,环烷基或-AR 4, / SUB,R 2和R 3可以结合在一起形成环,其中R 4代表氢原子,烷基 或环烷基,R 4和R 2或R 3可以结合在一起形成环,A表示氧原子或 硫原子。
    • 9. 发明授权
    • Positive-working resist composition
    • 正面抗蚀剂组成
    • US06602646B1
    • 2003-08-05
    • US09684888
    • 2000-10-06
    • Kenichiro SatoKunihiko KodamaToshiaki Aoai
    • Kenichiro SatoKunihiko KodamaToshiaki Aoai
    • G03F7004
    • G03F7/039G03F7/0045Y10S430/106
    • The present invention provides a high sensitivity chemically amplified positive-working resist composition which eliminates edge roughness on pattern and provides an excellent resist pattern profile. A novel positive-working resist composition is provided comprising (A) a resin containing an alkali-soluble group protected by at least one of moieties containing alicyclic hydrocarbon represented by general formulae (pI) to (pVI) and having a monomer component content of 5% or less of the total pattern area as determined by gel permeation chromatography (GPC), which increases in its solution velocity with respect to an alkaline developer by the action of an acid and (B) a compound which is capable of generating an acid by irradiation with an active ray or radiation.
    • 本发明提供一种消除图案上的边缘粗糙度并提供优异的抗蚀剂图案轮廓的高灵敏度化学放大正性抗蚀剂组合物。 提供了一种新型的正性抗蚀剂组合物,其包含(A)含有由至少一个含有由通式(pI)至(pVI)表示的脂环族烃部分并且单体组分含量为5的部分保护的碱溶性基团的树脂 通过凝胶渗透色谱法(GPC)确定的总图案面积的百分比或更少,其通过酸的作用相对于碱性显影剂的溶液速度增加,和(B)能够产生酸的化合物 用活性射线或辐射照射。
    • 10. 发明授权
    • Positive photoresist composition
    • 正光致抗蚀剂组合物
    • US06576392B1
    • 2003-06-10
    • US09456827
    • 1999-12-06
    • Kenichiro SatoKunihiko KodamaToshiaki AoaiHidekazu Ohashi
    • Kenichiro SatoKunihiko KodamaToshiaki AoaiHidekazu Ohashi
    • G03C173
    • G03F7/0045G03F7/0397Y10S430/106Y10S430/111Y10S430/115
    • A positive photoresist composition comprising a photo-acid gererator and a specific resin. The resin contains repeating units each having a group represented by formula (I): —SO2—O—R wherein R represents an optionally substituted alkyl, cycloalkyl, or alkenyl group and comes to have an increased rate of dissolution in an alkaline developing solution by the action of an acid, or contains alkali-soluble groups protected by partial structures containing an alicyclic hydrocarbon and represented by at least one of formulae (pI) to (pVI) defined in the specification and which decomposes by the action of an acid to have enhanced solubility in an alkali. The latter is used in combination with a compound which decomposes by the action of an acid to generate a sulfonic acid.
    • 一种正型光致抗蚀剂组合物,其包含光酸注射器和特定树脂。 树脂含有各自具有由式(I)表示的基团的重复单元:其中R表示任选取代的烷基,环烷基或烯基,并且通过酸的作用使碱显影溶液的溶解速率增加, 或含有由说明书中定义的至少一种式(pI)至(pVI)表示的含有脂环族烃的部分结构保护的碱溶性基团,其通过酸的作用而分解,从而具有增强的在碱中的溶解度。 后者与通过酸的作用分解以产生磺酸的化合物组合使用。