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    • 5. 发明申请
    • CARRIER PARTICLES FOR FORMING WIRING CIRCUIT PATTERN AND DEVELOPER
    • 用于形成电路图形和开发商的载体颗粒
    • US20090246670A1
    • 2009-10-01
    • US12399217
    • 2009-03-06
    • Koji AGAAtsushi NII
    • Koji AGAAtsushi NII
    • G03G9/113G03G9/107G03G9/08
    • G03G9/09708G03G9/0819G03G9/0902G03G9/1133G03G15/225G03G15/6585H05K3/1266H05K2203/0517
    • Carrier particles for forming a wiring circuit pattern by an electrophotographic developing method which are used for directly forming a circuit shape on an insulating layer, with any of a metal powder, an inorganic compound powder, or a mixed raw material powder thereof used as a toner powder for forming a circuit, the toner powder for forming a circuit being adhered to a surface of the carrier particles by electrostatic force and then transported to a surface of the insulating layer, wherein the carrier particles include a resin coated layer of an acrylic resin composition containing an amino-group-containing polymer on the surface of the carrier core material particles, the coating amount of the acrylic resin composition is 0.3 to 3.0% by weight based on a carrier core material weight of 100% by weight, and a shape factor SF-1 of the carrier core material particles is 100 to 110.
    • 用于通过电子照相显影方法形成布线电路图案的载体颗粒,其用作在绝缘层上直接形成电路形状的任何金属粉末,无机化合物粉末或其混合原料粉末用作调色剂 用于形成电路的粉末,用于形成电路的调色剂粉末通过静电力粘附到载体颗粒的表面上,然后传输到绝缘层的表面,其中载体颗粒包括丙烯酸树脂组合物的树脂涂层 在载体芯材颗粒的表面含有含氨基的聚合物,丙烯酸树脂组合物的涂布量基于载体芯材重量为100重量%为0.3〜3.0重量%,形状因子 载体芯材颗粒的SF-1为100〜110。