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1. 发明专利

JP2005153010A Lead-free solder alloy 审中-公开
标题翻译：无铅焊接合金
公开(公告)号：JP2005153010A
公开(公告)日：2005-06-16
申请号：JP2004149930
申请日：2004-05-20
申请人： Nippon Firaa Metals:Kk , Topy Ind Ltd , トピー工業株式会社 , 株式会社日本フィラーメタルズ
发明人： YAMADA SEIJI , SUGIMORI KENICHIRO , MATSUKI HARUO , AKUSAWA TATSUO
IPC分类号： B23K35/26 , C22C13/00
摘要： PROBLEM TO BE SOLVED: To provide Sn-Cu based lead-free solder alloy which has excellent erosion resistance against copper equal to or greater than that of conventional Sn-Pb based solder and is used at a temperature of 300-350°C.
SOLUTION: A trace of Co is contained in Sn-based lead-free solder alloy consisting mainly of Sn and Cu to suppress elution of Cu. In addition, by containing Ge and/or Ga, oxidation-resistant characteristic of the solder and suppression of elution of Co can be enhanced.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供对于等于或大于常规Sn-Pb基焊料的铜具有优异耐侵蚀性的Sn-Cu基无铅焊料合金，并且在300-350℃的温度下使用 C。
解决方案：主要由Sn和Cu组成的Sn基无铅焊料合金中含有痕量Co，以抑制Cu的洗脱。此外，通过含有Ge和/或Ga，可以提高焊料的耐氧化特性和抑制Co的洗脱。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2010024517A System and method for refining tin 审中-公开
标题翻译：用于精炼锡的系统和方法
公开(公告)号：JP2010024517A
公开(公告)日：2010-02-04
申请号：JP2008189606
申请日：2008-07-23
申请人： Nippon Firaa Metals:Kk , Topy Ind Ltd , トピー工業株式会社 , 株式会社日本フィラーメタルズ
发明人： CHO SUSUMU , HAMASHIMA YOSHIO , YAMADA SEIJI , ISOTANI MITSUTOSHI
IPC分类号： C22B25/06 , C22B7/00 , C22B9/02
CPC分类号： Y02P10/234
摘要： PROBLEM TO BE SOLVED: To provide a system and a method for refining tin by which tin is recovered from a solder containing lead, and the lead can be removed as a result. SOLUTION: The system for refining tin is provided with a refining apparatus (10) for tin and a cooling medium supplying mechanism (cooling medium circulating mechanism 50) for supplying a cooling medium (for example, a liquid-phase cooling medium such as cooling water) to the refining apparatus (10). The refining apparatus (10) is provided with a melting furnace (8) for storing the molten solder (while holding the temperature), and a rotary cooling body (1) which is dipped into the molten solder and on the surface of which tin is crystallized, wherein the side surface part (2a) of the rotary cooling body (1) is processed into such a shape (2c) that the crystallized nucleus of the tin to be crystallized can remain and the stress concentration does not occur on the rotary cooling body (1). COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于精炼锡的系统和方法，通过其从含铅焊料回收锡，结果可以除去铅。解决方案：用于精炼锡的系统设置有用于锡的精炼装置（10）和用于供应冷却介质（例如，液相冷却介质等）的冷却介质供给机构（冷却介质循环机构50）作为冷却水）供给精炼装置（10）。精炼装置（10）设置有用于储存熔融焊料（同时保持温度）的熔炉（8）和浸入熔融焊料中的旋转冷却体（1），锡的表面上结晶化，其中旋转冷却体（1）的侧表面部分（2a）被加工成这样的形状（2c），使待结晶的锡的结晶化的核保留，并且在旋转冷却时不会发生应力集中身体（1）。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2009082986A Lead-free solder alloy for manual soldering 审中-公开
标题翻译：无铅焊接合金用于手动焊接
公开(公告)号：JP2009082986A
公开(公告)日：2009-04-23
申请号：JP2008223211
申请日：2008-09-01
申请人： Nippon Firaa Metals:Kk , Topy Ind Ltd , トピー工業株式会社 , 株式会社日本フィラーメタルズ
发明人： YAMADA SEIJI , SUGIMORI KENICHIRO
IPC分类号： B23K35/26 , C22C13/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide an SnAgCu based lead-free solder alloy for manual soldering which has resistance to soldering iron tip thinning on a level same as that of Sn37Pb (eutectic alloy) and excellent copper thinning resistance, and having a stable componential composition, can be produced.
SOLUTION: The lead-free solder alloy for manual soldering comprises, by weight, 0.2 to 1.2% Cu, 1.0 to 5.0% Ag, 0.005 to 0.03% Co, 0.001 to 0.01% Ge and 0.01 to 0.05% Fe, and the balance Sn, and solder simultaneously having resistance to soldering iron tip thinning and excellent copper thinning resistance can be produced, and having a stable componential composition. Further, by incorporating a transition metal or a mischmetal as the mixture thereof therein by 0.001 to 0.05%, excellent resistance to soldering iron tip thinning and copper thinning resistance can be complemented.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种用于手工焊接的SnAgCu基无铅焊料合金，其具有与Sn37Pb（共晶合金）相同的级别的抗烙铁头薄化性和优异的耐铜变薄性，并且具有稳定的组成成分，可以生产。解决方案：用于手工焊接的无铅焊料合金包括重量比为0.2-1.2％的Cu，1.0-5.0％的Ag，0.005-0.03％的Co，0.001到0.01％的Ge和0.01到0.05％的Fe，以及可以制造平衡Sn，同时具有耐铁烙铁头变薄和优异的耐铜变薄性的焊料，并且具有稳定的组分组成。此外，通过将过渡金属或混合物的混合物掺入其中0.001〜0.05％，可以补充优异的耐烙铁头薄化和耐铜变薄性。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2004330260A LEAD-FREE SnAgCu SOLDER ALLOY 有权
公开(公告)号：JP2004330260A
公开(公告)日：2004-11-25
申请号：JP2003131132
申请日：2003-05-09
申请人： Nippon Firaa Metals:Kk , Topy Ind Ltd , トピー工業株式会社 , 株式会社日本フィラーメタルズ
发明人： YAMADA SEIJI , WAIDE NOBORU , SUGIMORI KENICHIRO , AKUSAWA TATSUO , MATSUKI HARUO
IPC分类号： B23K35/26 , C22C13/00
摘要： PROBLEM TO BE SOLVED: To provide lead-free SnAgCu solder alloy with Cu erosion resistance and oxidation resistance. SOLUTION: The solder alloy has the composition consisting of, by weight, 0.2-2.0% Cu, 1.0-5.0% Ag, 0.05-0.03% Co, 0.005-0.03% Ge, and the balance Sn, and Cu elution is suppressed, and production of oxides is reduced. COPYRIGHT: (C)2005,JPO&NCIPI

5. 发明专利

JP2008188672A Manual soldering lead-free solder alloy 有权
标题翻译：手动焊接无铅焊接合金
公开(公告)号：JP2008188672A
公开(公告)日：2008-08-21
申请号：JP2007297501
申请日：2007-11-16
申请人： Nippon Firaa Metals:Kk , Topy Ind Ltd , トピー工業株式会社 , 株式会社日本フィラーメタルズ
发明人： YAMADA SEIJI , SUGIMORI KENICHIRO , ISOTANI MITSUTOSHI
IPC分类号： B23K35/26 , C22C13/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide an SnCu based lead-free solder alloy for manual soldering that enables production of a solder of stable composition with resistance to soldering iron tip thinning nearly equivalent to that of Sn37Pb (eutectic alloy).
SOLUTION: The SnCu based lead-free solder alloy is one comprising 0.1 to 1.5 wt.% Cu and 0.05 to 0.5 wt.% Ag, and further comprising 0.1 to 1.5 wt.% Cu and 0.01 to 0.05 wt.% Fe, with the balance consisting of Sn. Accordingly, there is obtained a solder simultaneously having excellent iron thinning resistance and composition stability. Not only enhancement of iron thinning inhibition but also copper thinning inhibition can be attained by still further comprising 0.001 to 0.05 wt.% transition metal or misch metal being a mixture thereof.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于手工焊接的SnCu基无铅焊料合金，其能够生产具有几乎相当于Sn37Pb（共晶合金）的烙铁头薄化的稳定组成的焊料。解决方案：SnCu型无铅焊料合金是一种包含0.1至1.5重量％的Cu和0.05至0.5重量％的Ag，还包含0.1至1.5重量％的Cu和0.01至0.05重量％的Fe ，其余由Sn组成。因此，获得了同时具有优异的耐铁稀化性和组成稳定性的焊料。不仅通过进一步包含0.001至0.05重量％的过渡金属或混合稀土金属可以实现铁减薄抑制的增强，而且可以获得铜变薄抑制。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2006097132A Solder erosion resistant member 有权
标题翻译：焊接耐腐蚀成员
公开(公告)号：JP2006097132A
公开(公告)日：2006-04-13
申请号：JP2005255020
申请日：2005-09-02
申请人： Tohoku Univ , Topy Ind Ltd , トピー工業株式会社 , 国立大学法人東北大学
发明人： SUGIYAMA MASAHARU , IGARASHI TAKANORI , YAMADA SEIJI , TAKAHASHI KENICHI , MOCHIZUKI ATSUO , KIMURA HISAMICHI , INOUE AKIHISA
IPC分类号： C22C45/02 , B23K3/02 , C22C13/00 , C22C45/00 , C22C45/04 , C22C45/10
摘要： PROBLEM TO BE SOLVED: To provide a solder erosion resistant member which exhibits high erosion resistance even to lead-free solder and realizes a long life.
SOLUTION: A dense amorphous metal (alloy) film is formed as a contact surface with molten solder or as a ground layer of the contact surface with molten solder. It is preferable that the thickness of the film is 0.01 mm or thicker. The amorphous metal (alloy) preferably contains 30 to 80 atm% of ferrous substance, particularly preferably metallic glass. The film can be formed by high-speed flame spray. Because of the highly erosion-resistant amorphous film densely formed on the contact surface of with molten solder, even when used in lead-free solder, the member suffers from only very little attack at a high temperature and can therefore achieves a markedly prolonged life.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供即使对无铅焊料也具有高耐冲蚀性并且实现长寿命的耐焊接材料。解决方案：致密的非晶金属（合金）膜形成为与熔融焊料的接触表面或作为与熔融焊料的接触表面的接地层。优选膜的厚度为0.01mm以上。无定形金属（合金）优选含有30〜80atm％的铁质物质，特别优选为金属玻璃。该膜可以通过高速火焰喷涂形成。由于在熔融焊料的接触表面上密集地形成高度耐腐蚀的非晶膜，所以即使在无铅焊料中使用时，该部件在高温下仅受到很小的冲击，因此可以实现显着延长的寿命。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2006188637A Lubricant for hot plastic working 审中-公开
标题翻译：润滑剂热塑性工作
公开(公告)号：JP2006188637A
公开(公告)日：2006-07-20
申请号：JP2005002929
申请日：2005-01-07
申请人： Topy Ind Ltd , トピー工業株式会社
发明人： YAMADA SEIJI , OTA SHUNICHI , MOCHIZUKI ATSUO
IPC分类号： C10M173/02 , C10M103/02 , C10M103/06 , C10M105/24 , C10M125/28 , C10M125/30 , C10M129/16 , C10M129/76 , C10M145/04 , C10M145/28 , C10M145/30 , C10M145/40 , C10M149/06 , C10M149/10 , C10N10/02 , C10N10/12 , C10N20/00 , C10N30/06 , C10N30/08 , C10N40/24
摘要： PROBLEM TO BE SOLVED: To obtain a lubricant having excellent formability and usability in hot plastic working, especially an aqueous lubricant having a high coefficient of friction during biting in hot rolling processing and a low coefficient of friction during plate threading and exhibiting lubricating effects such as slip prevention effect and seizing prevention effect even in high-pressure rolling.
SOLUTION: The lubricant for hot plastic working comprises an expansive clay compound, a water-soluble glass and a nonionic water-soluble polymer in an aqueous medium containing water. The coefficient of friction of the lubricant has the maximum value at 200°C-500°C, the maximum value is ≥0.3 and the coefficient of friction at 800°C is 2 O, Li
2 O)-(P
2 O
5 -B
2 O
3 )-based water-soluble glass is preferably used as the water-soluble glass and the amount of Na
2 O and/or Li
2 O is preferably 10-40% by mass calculated as oxide. The lubricant is further mixed with a solid lubricant.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了获得在热塑性加工中具有优异的成形性和可用性的润滑剂，特别是在热轧加工中咬入期间具有高摩擦系数的水性润滑剂，以及在板穿孔期间具有低摩擦系数并且具有润滑性即使在高压轧制中也具有防滑效果和防止卡住效果的效果。解决方案：用于热塑性加工的润滑剂包括在含水的水性介质中的膨胀粘土化合物，水溶性玻璃和非离子水溶性聚合物。润滑剂的摩擦系数在200℃-500℃时具有最大值，最大值为≥0.3，800℃下的摩擦系数<0.3。 A（Na 2 O，Li 2 O） - （P 2 5 优选使用基于水溶性玻璃作为水溶性玻璃，并且Na 2 O和/或Li 优选O 2以氧化物计算为10〜40质量％。润滑剂进一步与固体润滑剂混合。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2004122227A Leadless solder alloy 审中-公开
公开(公告)号：JP2004122227A
公开(公告)日：2004-04-22
申请号：JP2002364587
申请日：2002-12-17
申请人： Topy Ind Ltd , トピー工業株式会社
发明人： YAMADA SEIJI , WAIDE NOBORU , SUGIMORI KENICHIRO , SUGATA MASAO , AKUSAWA TATSUO
IPC分类号： B23K35/26 , C22C13/00
摘要： PROBLEM TO BE SOLVED: To provide Sn based leadless solder which has excellent erosion resistance to copper equal to that of the conventional Sn-Pb solder and has no reduction of strength and toughness in the soldered part when used at a high temperature.
SOLUTION: For suppressing the elution of Cu, Co is incorporated into an Sn based leadless solder alloy essentially consisting of Sn and Cu. Further, Ge, P or Ga is incorporated therein, so that the oxidation resistance of the solder can be improved.
COPYRIGHT: (C)2004,JPO

9. 发明专利

JP2004330259A LEAD-FREE SnCu SOLDER ALLOY 有权
标题翻译：无铅SnCu焊锡合金
公开(公告)号：JP2004330259A
公开(公告)日：2004-11-25
申请号：JP2003130996
申请日：2003-05-09
申请人： Nippon Firaa Metals:Kk , Topy Ind Ltd , トピー工業株式会社 , 株式会社日本フィラーメタルズ
发明人： YAMADA SEIJI , WAIDE NOBORU , SUGIMORI KENICHIRO , AKUSAWA TATSUO , MATSUKI HARUO
IPC分类号： B23K35/26 , C22C13/00
摘要： PROBLEM TO BE SOLVED: To provide lead-free SnCu solder alloy which is free from any defective soldering such as icicle formation, having excellent erosion resistance of Cu, excellent wettability, and creep characteristic, and capable of satisfying all required characteristics for practical applications.
SOLUTION: The solder alloy contains, by weight, 0.1-3.0% Cu, ≥ 0.01% and
摘要翻译：要解决的问题：提供无铅SnCu焊料合金，其不存在诸如冰柱形成的任何有缺陷的焊接，具有优异的耐Cu腐蚀性，优异的润湿性和蠕变特性，并且能够满足所有要求的特性实际应用。解决方案：焊料合金含有重量百分比为0.1-3.0％的Cu，≥0.01％和<0.05％的Co，以及从0.05-1.0％Ag，0.01-0.05％Ni，和0.005-0.05％Ge，余量为Sn。焊料合金没有诸如冰柱形成的任何有缺陷的焊接，具有优异的耐Cu，润湿性和蠕变特性，并且满足实际应用的所有要求的特性。版权所有（C）2005，JPO＆NCIPI

10. 发明专利

JP2003010996A Lead-free soldering paste 审中-公开
标题翻译：无铅焊膏
公开(公告)号：JP2003010996A
公开(公告)日：2003-01-15
申请号：JP2001194286
申请日：2001-06-27
申请人： Nippon Filler Metals Co Ltd , Topy Ind Ltd , トピー工業株式会社 , 株式会社日本フイラ−メタルズ
发明人： WATANABE KAIICHI , MORI KIMIAKI , SEKIGUCHI TSUTOMU , YAMADA SEIJI
IPC分类号： B23K35/363 , B23K35/26 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a copper-free soldering paste spreading uniformly up to the end part of a copper pad of a printed circuit surface.
SOLUTION: In the lead-free soldering paste having flux and lead-free solder powder, stannous chloride and/or zinc chloride are contained by dissolution as an active agent.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供均匀地扩展到印刷电路表面的铜焊盘的端部的无铜焊膏。解决方案：在具有焊剂和无铅焊料粉末的无铅焊膏中，通过作为活性剂的溶解而含有氯化亚锡和/或氯化锌。

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