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1. 发明授权

US6045318A Lead frame supplying method and apparatus 失效
标题翻译：引线框架供应方法和装置
公开(公告)号：US6045318A
公开(公告)日：2000-04-04
申请号：US978311
申请日：1997-11-25
申请人： Tooru Mochida , Shinichi Baba
发明人： Tooru Mochida , Shinichi Baba
IPC分类号： H01L21/50 , H01L21/677 , B65G65/36
CPC分类号： H01L21/67778
摘要： A lead frame supplying method and apparatus used with, for instance, a wire bonding machine, including a sensor which detects a presence or absence of a lead frame in a frame storing section of a lead frame magazine. The sensor is installed at the level of a frame conveying path or above the level of the frame conveying path of a frame feeder that feeds lead frames to, for instance, the bonding machine and is located so that the lead frame magazine is positioned between the sensor and the frame feeder. In addition, a control unit positions a frame storing section that contains a lead frame at the level of the frame conveying path of the frame feeder when the sensor detects the absence of a lead frame in one frame storing section.
摘要翻译：一种引线框架供给方法和装置，其与例如引线键合机一起使用，该引线框架机器包括检测引线框架的框架存储部分中引线框架的存在或不存在的传感器。传感器安装在框架输送路径的水平面上，或者将引线架的框架输送路径的水平面上方设置在例如粘合机上，并将引线框架定位在传感器和框架进纸器。此外，当传感器在一个帧存储部分中检测到引线框架的不存在时，控制单元将包含引线框架的帧存储部分定位在帧馈送器的帧传送路径的级别。

2. 发明授权

US6033932A Lead frame supplying apparatus 失效
标题翻译：引线框架供应装置
公开(公告)号：US6033932A
公开(公告)日：2000-03-07
申请号：US305078
申请日：1999-05-04
申请人： Tooru Mochida , Shinichi Baba
发明人： Tooru Mochida , Shinichi Baba
IPC分类号： B65G25/08 , H01L21/00 , H01L21/50 , H01L21/677 , H01L21/44
CPC分类号： H01L21/67265 , H01L21/67778 , H01L24/78 , H01L2224/78 , H01L2924/00014
摘要： In a bonding apparatus such as a wire bonding apparatus, die bonding apparatus and the like in which lead frames are supplied from a lead frame magazine to a bonding section via a frame conveying path, when the absence of a lead frame in the frame storing section of a lead frame magazine is detected by a sensor in spite of the fact that a frame pusher for pushing out the lead frame from the magazine has operated, a judgement is made that no more lead frames are contained in the frame magazine, so that a lowermost frame storing section of the next magazine is moved to the level of the frame conveying path.
摘要翻译：在引线框架通过框架输送路径从引线框架供给到接合部的引线接合装置，管芯接合装置等的接合装置中，当在框架存储部中没有引线框架时，由传感器检测到引线框架的情况，尽管用于从引导框推出引线框架的框架推动器已经操作，但是判断在框架架中不再包含引线框架，从而使得下一个盒的最下部框架存放部移动到框架输送路径的高度。

3. 发明授权

US6001670A Lead frame supplying method 失效
标题翻译：引线框供应方式
公开(公告)号：US6001670A
公开(公告)日：1999-12-14
申请号：US959384
申请日：1997-11-18
申请人： Tooru Mochida , Shinichi Baba
发明人： Tooru Mochida , Shinichi Baba
IPC分类号： B65G25/08 , H01L21/00 , H01L21/50 , H01L21/677 , H01L21/44
CPC分类号： H01L21/67265 , H01L21/67778 , H01L24/78 , H01L2224/78 , H01L2924/00014
摘要： In a bonding apparatus such as a wire bonding apparatus, die bonding apparatus and the like in which lead frames are supplied from a lead frame magazine to a bonding section via a frame conveying path, when the absence of a lead frame in the frame storing section of a lead frame magazine is detected by a sensor in spite of the fact that a frame pusher for pushing out the lead frame from the magazine has operated, a judgement is made that no more lead frames are contained in the frame magazine, so that a lowermost frame storing section of the next magazine is moved to the level of the frame conveying path.
摘要翻译：在引线框架通过框架输送路径从引线框架供给到接合部的引线接合装置，管芯接合装置等的接合装置中，当在框架存储部中没有引线框架时，由传感器检测到引线框架的情况，尽管用于从引导框推出引线框架的框架推动器已经操作，但是判断在框架架中不再包含引线框架，从而使得下一个盒的最下部框架存放部移动到框架输送路径的高度。

4. 发明授权

US06595400B2 Wire bonding apparatus 失效
标题翻译：接线装置
公开(公告)号：US06595400B2
公开(公告)日：2003-07-22
申请号：US09934890
申请日：2001-08-22
申请人： Yoshimitsu Terakado , Tooru Mochida , Tatsunari Mii , Shigeru Shiozawa
发明人： Yoshimitsu Terakado , Tooru Mochida , Tatsunari Mii , Shigeru Shiozawa
IPC分类号： B23K3700
CPC分类号： H01L24/85 , B23K20/005 , H01L24/48 , H01L24/78 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/78301 , H01L2224/786 , H01L2224/851 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2924/01051 , H01L2924/01082 , H01L2924/00 , H01L2224/45099
摘要： In a wire bonding apparatus in which a wire is passed through a capillary that is provided at one end of a bonding arm and a clamper that holds the wire is disposed directly above the capillary, the distance between the upper surface of the capillary and the undersurface of the clamper is set as a very short distance as 1.5 mm or less.
摘要翻译：在导线通过设置在接合臂的一端的毛细管的线接合装置中，并且保持线的夹持器直接设置在毛细管的上方，毛细管的上表面与下表面之间的距离的夹持器设置为1.5mm或更小的非常短的距离。

5. 发明授权

US6080651A Wire bonding method 失效
标题翻译：接线方式
公开(公告)号：US6080651A
公开(公告)日：2000-06-27
申请号：US42842
申请日：1998-03-17
申请人： Kuniyuki Takahashi , Tooru Mochida , Tatsunari Mii , Nobuto Yamazaki
发明人： Kuniyuki Takahashi , Tooru Mochida , Tatsunari Mii , Nobuto Yamazaki
IPC分类号： H01L21/60 , H01L21/447
CPC分类号： H01L24/85 , H01L24/49 , H01L24/78 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/78301 , H01L2224/85181 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , Y10S228/904 , Y10S438/907
摘要： A wire bonding method in the manufacture of, for instance, a semiconductor device in which first bonding points or pads of a chip and second bonding points or leads of a lead frame are connected by wires, and the bonding by wires is initiated from one end of the row of the first bonding points (pads) and is successively performed in one direction toward a center of the row, and after bonding has been performed up to an approximate center of the row, then bonding is initiated from another end of the row in the opposite direction toward the center of the row.
摘要翻译：在制造例如半导体器件中的引线接合方法，其中第一接合点或芯片的焊盘和引线框架的第二接合点或引线通过电线连接，并且通过电线的接合从一端开始的第一接合点（焊盘）的列，并且在朝向行的中心的一个方向上连续执行，并且在接合之后已经被执行到行的大致中心，然后从行的另一端开始接合在朝向行的中心的相反方向。

6. 发明授权

US06467678B2 Wire bonding method and apparatus 失效
标题翻译：引线接合方法和装置
公开(公告)号：US06467678B2
公开(公告)日：2002-10-22
申请号：US09750544
申请日：2000-12-28
申请人： Tooru Mochida , Tatsunari Mii , Nobuaki Hirai
发明人： Tooru Mochida , Tatsunari Mii , Nobuaki Hirai
IPC分类号： B23K3100
CPC分类号： H01L24/85 , B23K20/007 , H01L24/48 , H01L24/78 , H01L2224/45015 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/78268 , H01L2224/78301 , H01L2224/85045 , H01L2224/85181 , H01L2224/85205 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01065 , H01L2924/01073 , H01L2924/01075 , H01L2924/01082 , H01L2924/00 , H01L2224/45099 , H01L2924/20753
摘要： A wire bonding method and apparatus, in which after the tail of a wire extends out of a capillary, the capillary moves to a measurement position above a tail length measuring member; the capillary descends so that the end of the tail contacts the tail length measuring member; a position of the capillary or a distance by which the capillary is lowered at the time that electrical continuity is established with the tail length measuring member is detected; and the tail length is calculated based upon a height level of the tail length measuring member, the position of the capillary before being lowered for measuring the tail, and the position of the capillary when the wire contacts the tail length measuring member, or upon the height of the capillary above the tail length measuring member before lowering the capillary for measuring the tail, and a distance the capillary is lowered.
摘要翻译：一种引线接合方法和装置，其中，在所述导线的尾部延伸出毛细管之后，毛细管移动到尾长测量构件上方的测量位置; 毛细管下降使得尾部的端部接触尾部测量构件; 检测毛细管的位置或毛细管在与尾部长度测量部件建立电连接的时间下降的距离; 并且根据尾长测量构件的高度水平，毛细管在下降之前用于测量尾部的位置以及毛细管当接触尾部测量构件时的位置，或者在尾部长度测量构件在降低用于测量尾部的毛细管之前毛细管上方的尾部长度测量部件的高度以及毛细管下降的距离。

7. 发明授权

US5989995A Semiconductor device and wire bonding method therefor 失效
标题翻译：半导体装置及其引线接合方法
公开(公告)号：US5989995A
公开(公告)日：1999-11-23
申请号：US998914
申请日：1997-12-29
申请人： Shinichi Nishiura , Tooru Mochida
发明人： Shinichi Nishiura , Tooru Mochida
IPC分类号： H01L21/60 , H01L21/44
CPC分类号： H01L24/85 , H01L24/48 , H01L2224/05599 , H01L2224/4809 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48245 , H01L2224/48247 , H01L2224/48465 , H01L2224/78301 , H01L2224/85181 , H01L2224/85205 , H01L24/78 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082
摘要： A semiconductor device including a bonded wire that connects a first bonding point and a second bonding point and has a linear portion in the top area thereof, the linear portion being bent or depressed down, thus having a high shape-retaining strength.
摘要翻译：一种半导体器件，包括：接合线，其连接第一接合点和第二接合点，并且在其顶部区域具有直线部分，所述直线部分被弯曲或压下，从而具有高的形状保持强度。

8. 发明授权

US5524811A Wire bonding method 失效
标题翻译：接线方式
公开(公告)号：US5524811A
公开(公告)日：1996-06-11
申请号：US309937
申请日：1994-09-21
申请人： Yoshimitsu Terakado , Kazuo Sugiura , Tooru Mochida , Tatsunari Mii
发明人： Yoshimitsu Terakado , Kazuo Sugiura , Tooru Mochida , Tatsunari Mii
IPC分类号： H01L21/60 , B23K20/00 , H01L21/607
CPC分类号： H01L24/85 , B23K20/007 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/78301 , H01L2224/85045 , H01L2224/85181 , H01L2224/85205 , H01L24/78 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082
摘要： In a bonding method for bonding with a wire a first bonding point and then a second bonding point, a capillary that carries the wire is moved in a direction which is opposite from the first bonding point at the same time that an ultrasonic vibration is applied to the capillary during bonding to the second bonding point. Such a movement of the opposite direction can occur 10-20 ms after the application of the ultrasonic vibration at the second bonding point.
摘要翻译：在与导线接合第一接合点和第二接合点的接合方法中，携带导线的毛细管在与第一接合点相反的方向上移动，同时将超声波振动施加到在接合到第二接合点期间的毛细管。在第二接合点施加超声波振动之后10-20ms可能发生相反方向的这种运动。

9. 发明授权

US06502738B2 Wire bonding apparatus 失效
标题翻译：接线装置
公开(公告)号：US06502738B2
公开(公告)日：2003-01-07
申请号：US09727000
申请日：2000-11-30
申请人： Tooru Mochida , Yoshimitsu Terakado , Koichi Takahashi
发明人： Tooru Mochida , Yoshimitsu Terakado , Koichi Takahashi
IPC分类号： B23Q15007
CPC分类号： H01L24/78 , B23K20/004 , G05B2219/45033 , H01L2224/78301 , H01L2224/786 , H01L2224/851 , H01L2924/00014 , H01L2924/01004 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2224/48 , H01L2224/45099
摘要： A wire bonding apparatus comprising: a spool motor rotates a spool around which a wire is wound, a tension-applying device that is disposed beneath the spool, a wire pay-out sensor disposed away from a gas-jet-out side of the tension-applying device so as to sense that the supply of the wire is insufficient, a wire-end detection sensor disposed on the gas-jet-out side of the tension-applying device so as to sense that the supply of the wire from the spool has stopped, and a control device controls so that the spool motor is rotated by a predetermined fixed amount when the wire is sensed by the wire pay-out sensor.
摘要翻译：一种引线接合装置，其特征在于，包括：卷轴电动机使卷绕有线的线圈旋转，布置在卷轴下方的张力施加装置，布置在远离张力的喷出侧的布线传感器传感器用于感测线材的供给不足的布线装置，设置在张力施加装置的气体喷射侧的线端检测传感器，以便感测到来自线轴的电线的供应已经停止，并且控制装置进行控制，使得当线由电线支付传感器感测时，线轴电动机旋转预定的固定量。

10. 发明授权

US5967401A Wire bonding method 失效
标题翻译：接线方式
公开(公告)号：US5967401A
公开(公告)日：1999-10-19
申请号：US998903
申请日：1997-12-29
申请人： Shinichi Nishiura , Tooru Mochida
发明人： Shinichi Nishiura , Tooru Mochida
IPC分类号： H01L21/60 , B23K20/00
CPC分类号： H01L24/85 , B23K20/007 , H01L24/48 , H01L2224/05599 , H01L2224/4809 , H01L2224/48095 , H01L2224/48227 , H01L2224/48465 , H01L2224/78301 , H01L2224/851 , H01L2224/85181 , H01L2224/85205 , H01L24/78 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082
摘要： A method for moving a capillary so as to connect wire to a first bonding point and then to a second bonding point in manufacturing, for instance, semiconductor devices, including the steps of moving the capillary in a opposite direction from the second bonding point after moving the capillary away from the first bonding point, and then moving the capillary slightly towards the first bonding point so as to form a firm kink in the wire, and after which the capillary is further moved away from the first bonding point delivering the wire, and then the capillary is moved towards the second bonding point to connect the wire to the second bonding point.
摘要翻译：一种在制造例如半导体器件中移动毛细管以将线连接到第一接合点然后连接到第二接合点的方法，包括以下步骤：在移动之后将毛细管沿相反方向从第二接合点移动毛细管远离第一结合点，然后稍微朝着第一粘结点移动毛细管，以在线中形成牢固的扭结，此后毛细管进一步远离传递线的第一接合点，以及然后毛细管朝向第二接合点移动以将线连接到第二接合点。

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