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1. 发明申请

US20130154103A1 SEMICONDUCTOR PACKAGE HAVING MULTI PITCH BALL LAND 有权
标题翻译：具有多个脚踏球土地的半导体包装
公开(公告)号：US20130154103A1
公开(公告)日：2013-06-20
申请号：US13767144
申请日：2013-02-14
申请人： Tong-Suk KIM , Heung-Kyu KWON , Jeong-Oh HA , Hyun-A KIM
发明人： Tong-Suk KIM , Heung-Kyu KWON , Jeong-Oh HA , Hyun-A KIM
IPC分类号： H01L23/488
CPC分类号： H01L23/488 , H01L23/49816 , H01L24/73 , H01L25/105 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48225 , H01L2224/48227 , H01L2224/73265 , H01L2225/06572 , H01L2225/1023 , H01L2225/1058 , H01L2924/14 , H01L2924/15311 , H01L2924/15321 , H01L2924/15331 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device having a printed circuit board and a semiconductor chip. The printed circuit board includes a chip region, a plurality of first ball lands adjacent to the chip region, and at least one second ball land adjacent to the first ball lands. The semiconductor chip is mounted on the chip region. The first ball lands are arranged to have a first pitch. One of the first ball lands which is nearest to the second ball land, and the second ball land have a second pitch greater than the first pitch.
摘要翻译：一种具有印刷电路板和半导体芯片的半导体器件。印刷电路板包括芯片区域，与芯片区域相邻的多个第一球区域和与第一球区相邻的至少一个第二球区域。半导体芯片安装在芯片区域上。第一个球场布置成具有第一个球场。最靠近第二球区的第一球场之一，而第二球场具有大于第一球距的第二球距。

2. 发明申请

US20100135292A1 APPARATUS AND METHOD FOR SUPPORTING NAT TRAVERSAL IN VOICE OVER INTERNET PROTOCOL SYSTEM 有权
标题翻译：通过互联网协议系统支持语音NAT设备和方法
公开(公告)号：US20100135292A1
公开(公告)日：2010-06-03
申请号：US12627388
申请日：2009-11-30
申请人： Si-Nam WOO , Hyun-A KIM , Pyung-Bin LIM , Sang-Il CHOI
发明人： Si-Nam WOO , Hyun-A KIM , Pyung-Bin LIM , Sang-Il CHOI
IPC分类号： H04L12/56
CPC分类号： H04L65/1069 , H04L12/2865 , H04L29/125 , H04L61/2564 , H04L61/2589 , H04L65/1053
摘要： An apparatus and a method for operating an exchange in order to support Network Address Translation (NAT) traversal in a Voice over Internet Protocol (VoIP) system are provided. In the method, when a setup request signal is received from a calling Internet phone, first mapping of an IP address and a User Datagram Protocol (UDP) port of the calling Internet phone to first embedded Media Proxy Solution (eMPS) IP address and UDP port is performed. A setup request of the calling Internet phone including the first eMPS IP address and UDP port information is relayed to a called Internet phone. A response signal including an IP address and an UDP port of the called Internet phone is received from the called Internet phone in response to the setup request. Second mapping of the IP address and UDP port of the called Internet phone to second eMPS address and UDP port is performed. A response signal including the second eMPS IP address and UDP port information is relayed to the calling Internet phone in response to the setup request.
摘要翻译：提供了一种用于操作交换机以便在互联网语音协议（VoIP）系统中支持网络地址转换（NAT）遍历的装置和方法。在该方法中，当从主叫互联网电话接收到建立请求信号时，首先将呼叫因特网电话的IP地址和用户数据报协议（UDP）端口映射到第一嵌入式媒体代理解决方案（eMPS）IP地址和UDP 端口被执行。包括第一eMPS IP地址和UDP端口信息的呼叫Internet电话的设置请求被中继到被叫网络电话。响应于设置请求，从被叫互联网电话接收包括被叫Internet电话的IP地址和UDP端口的响应信号。被叫Internet电话的IP地址和UDP端口映射到第二个eMPS地址和UDP端口。包括第二eMPS IP地址和UDP端口信息的响应信号被响应于设置请求被中继到主叫因特网电话。

3. 发明申请

US20080088008A1 SEMICONDUCTOR PACKAGE HAVING PAD ARRANGEMENT 审中-公开
标题翻译：具有扁平布置的半导体封装
公开(公告)号：US20080088008A1
公开(公告)日：2008-04-17
申请号：US11858244
申请日：2007-09-20
申请人： Hyun-A KIM , Dong-Han KIM
发明人： Hyun-A KIM , Dong-Han KIM
IPC分类号： H01L23/52
CPC分类号： H01L23/50 , H01L23/4985 , H01L24/06 , H01L24/41 , H01L2224/05554 , H01L2224/06154 , H01L2224/41175 , H01L2924/00014 , H01L2924/14 , H01L2224/37099
摘要： A semiconductor package includes a semiconductor chip, multiple first outer connection pads positioned along a first edge of the semiconductor chip in a first direction, and multiple first outer connection leads electrically connected to the first outer connection pads. Multiple first power pads extend from the first edge of the semiconductor chip in a second direction substantially perpendicular to the first direction. A first power lead is electrically connected to the first power pads.
摘要翻译：半导体封装包括半导体芯片，沿着第一方向沿着半导体芯片的第一边缘定位的多个第一外部连接焊盘以及电连接到第一外部连接焊盘的多个第一外部连接引线。多个第一电源焊盘从基本上垂直于第一方向的第二方向从半导体芯片的第一边缘延伸。第一电源引线电连接到第一电源焊盘。

4. 发明申请

US20100172346A1 METHOD AND APPARATUS FOR TRANSMITTING GROUPCAST TO SUPPORT VOICE PAGING SERVICE IN VOICE OVER INTERNET PROTOCOL SYSTEM 有权
标题翻译：用于在互联网协议系统中传输支持语音通话服务的方法和装置
公开(公告)号：US20100172346A1
公开(公告)日：2010-07-08
申请号：US12652182
申请日：2010-01-05
申请人： Si-Nam WOO , Hyun-A KIM , Pyung-Bin LIM , Sang-Il CHOI
发明人： Si-Nam WOO , Hyun-A KIM , Pyung-Bin LIM , Sang-Il CHOI
IPC分类号： H04L12/66
CPC分类号： H04L65/40 , H04L12/1836
摘要： A method and apparatus for transmitting a groupcast to support a voice paging service in a VoIP system are provided. In the method, a voice paging message is received from a voice paging transmitting terminal and one or more voice paging messages are reproduced from the received voice paging message. A group table is used to change the destination address and port of each of the reproduced voice paging messages into the IP address and port of each of one or more voice paging receiving terminals. Each of the reproduced voice paging messages is unicast on the basis of the changed IP address and port.
摘要翻译：提供了一种用于发送组播以支持VoIP系统中的语音寻呼业务的方法和装置。在该方法中，从语音寻呼发送终端接收到语音寻呼消息，并从接收的语音寻呼消息中再现一个或多个语音寻呼消息。使用组表将每个再现的语音寻呼消息的目的地地址和端口改变为一个或多个语音寻呼接收终端中的每一个的IP地址和端口。基于改变的IP地址和端口，每个再现的语音寻呼消息是单播的。

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