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1. 发明申请

US20070093575A1 Anaerobic adhesive compositions and water-blocking treatment of electrical wires with the same compositions 审中-公开
标题翻译：厌氧粘合剂组合物和具有相同组成的电线的阻水处理
公开(公告)号：US20070093575A1
公开(公告)日：2007-04-26
申请号：US10559578
申请日：2004-06-07
申请人： Tomoyasu Murakami , Shigenori Sato
发明人： Tomoyasu Murakami , Shigenori Sato
IPC分类号： C08K5/41
CPC分类号： C09J4/00 , C08F222/1006
摘要： [OBJECTIVE] The present invention provides anaerobic adhesive compositions which can be formulated with increases in both storage stability and speed of cure. [CONSTITUTION]An anaerobic adhesive composition, comprising: a polyacrylic ester capable of radical polymerization at room temperature; an organic peroxide; an anaerobic free radical generator capable of generating a free radical immediately after completion of contact with oxygen gas to facilitate the radical polymerization of the polyacrylic ester; and an organic hydrazide.
摘要翻译： [目的]本发明提供厌氧粘合剂组合物，其可以随着储存稳定性和固化速度的增加而配制。 [组成]厌氧性粘合剂组合物，其包含：能够在室温下自由基聚合的聚丙烯酸酯; 有机过氧化物; 能够在与氧气接触完成后立即产生自由基以促进聚丙烯酸酯的自由基聚合的厌氧自由基发生剂; 和有机酰肼。

2. 发明授权

US07731862B2 Dry etching method, fine structure formation method, mold and mold fabrication method 失效
标题翻译：干蚀刻法，精细结构形成法，模具和模具制造方法
公开(公告)号：US07731862B2
公开(公告)日：2010-06-08
申请号：US11475190
申请日：2006-06-27
申请人： Hideo Nakagawa , Masaru Sasago , Tomoyasu Murakami
发明人： Hideo Nakagawa , Masaru Sasago , Tomoyasu Murakami
IPC分类号： B44C1/22 , C03C15/00 , C03C25/68 , C23F1/00
CPC分类号： C23F4/00 , G02B2006/12166 , G02B2006/12197
摘要： A substance including tungsten and carbon is etched by using plasma. The plasma is generated from a mixed gas of a gas including a fluorine atom, a gas including a nitrogen atom and a gas including a hydrocarbon molecule.
摘要翻译：通过使用等离子体蚀刻包括钨和碳的物质。等离子体由包括氟原子的气体，包括氮原子的气体和包括烃分子的气体的混合气体产生。

3. 发明授权

US07109421B2 Harness holder and harness layout structure thereby 有权
标题翻译：线束架和线束布局结构
公开(公告)号：US07109421B2
公开(公告)日：2006-09-19
申请号：US10937496
申请日：2004-09-10
申请人： Tsukasa Sekino , Mitsunori Tsunoda , Tomoyasu Murakami , Gaku Ito
发明人： Tsukasa Sekino , Mitsunori Tsunoda , Tomoyasu Murakami , Gaku Ito
IPC分类号： H02G1/00
CPC分类号： B60R16/0215 , H02G3/0462 , H02G3/34 , H02G11/006
摘要： For preventing a slack of a wire harness and bending the wire harness more smoothly, a harness holder includes an inner clamp member for supporting the wire harness and an outer clamp member supporting rotatably the inner clamp member. The slack preventing member is formed longer than the harness guide in a harness leading direction. Mounting the harness holder at a vehicle body and disposing a protector for receiving the wire harness at a slide door, the wire harness is wired from the harness holder to the protector. In a partially opened slide door, the slack preventing member supports the wire harness. In a full opened and a completely closed door, the harness guide supports the wire harness.
摘要翻译：为了防止线束松弛并且更平稳地弯曲线束，线束保持器包括用于支撑线束的内部夹紧构件和可旋转地支撑内部夹紧构件的外部夹紧构件。松弛防止构件在线束引导方向上比线束引导件形成得更长。将线束架安装在车身上，并设置用于在滑动门处接收线束的保护器，线束从线束架线缆连接到保护器。在部分打开的滑动门中，防松松构件支撑线束。在完全打开和完全关闭的门中，线束导轨支撑线束。

4. 发明申请

US20060201710A1 Grommet 有权
标题翻译：索环
公开(公告)号：US20060201710A1
公开(公告)日：2006-09-14
申请号：US11353064
申请日：2006-02-14
申请人： Tomoyasu Murakami
发明人： Tomoyasu Murakami
IPC分类号： H02G3/18
CPC分类号： H02G3/22 , B60R16/0222 , Y10T16/05
摘要： A grommet includes a cylindrical portion that operable to fit on an outer circumference of an electric wire which passes through a trough hole in a panel, a panel fitting portion on which an inner circumferential edge of the through hole in the panel is fitted, and a connecting portion that connects the cylindrical portion and the panel fitting portion. The panel fitting portion includes a seal projection that is brought into press contact with the panel, and a seal protection wall is provided on the panel fitting portion for reducing the influence to the panel fitting portion caused by a flow of injected water from external.
摘要翻译：索环包括可操作以装配在通过面板中的槽孔的电线的外圆周上的圆柱形部分，面板装配部分，面板中的通孔的内周边缘在其上装配，以及连接部分，其连接圆柱形部分和面板装配部分。面板装配部分包括与面板压接的密封突起，并且在面板装配部分上设有密封保护壁，用于减少由外部注入的水流引起的对面板装配部分的影响。

5. 发明申请

US20050092511A1 Harness holder and harness layout structure thereby 有权
标题翻译：线束架和线束布局结构
公开(公告)号：US20050092511A1
公开(公告)日：2005-05-05
申请号：US10937496
申请日：2004-09-10
申请人： Tsukasa Sekino , Mitsunori Tsunoda , Tomoyasu Murakami , Gaku Ito
发明人： Tsukasa Sekino , Mitsunori Tsunoda , Tomoyasu Murakami , Gaku Ito
IPC分类号： F16B2/08 , B60R16/02 , H02G3/04 , H02G3/30 , H02G11/00 , H01B7/00
CPC分类号： B60R16/0215 , H02G3/0462 , H02G3/34 , H02G11/006
摘要： For preventing slack of a wire harness and bending the wire harness more smoothly, a harness holder 71 includes an inner clamp member 31 for supporting the wire harness 73 and an outer clamp member 38 supporting rotatably the inner clamp member. The slack preventing member 35 is formed longer than the harness guide 62 in a harness leading direction. Mounting the harness holder 71 at a vehicle body and disposing a protector for receiving the wire harness 73 at a slide door, the wire harness is wired from the harness holder to the protector. In partially opened slide door, the slack preventing member 35 supports the wire harness. In full opened and completely closed door, the harness guide 62 supports the wire harness.
摘要翻译：为了防止线束松弛和线束弯曲更加平滑，线束夹持器71包括用于支撑线束73的内部夹持构件31和可旋转地支撑内侧夹紧构件的外部夹紧构件38。松弛防止构件35在线束引导方向上比线束引导件62形成得更长。将线束保持器71安装在车体处，并且在滑动门处设置用于接收线束73的保护器，线束从线束保持器布线到保护器。在部分打开的滑动门中，防松松构件35支撑线束。在完全打开和完全关闭的门中，线束引导件62支撑线束。

6. 发明授权

US5569628A Semiconductor device fabrication method 失效
标题翻译：半导体器件制造方法
公开(公告)号：US5569628A
公开(公告)日：1996-10-29
申请号：US535323
申请日：1995-09-27
申请人： Kousaku Yano , Tomoyasu Murakami , Masayuki Endo , Noboru Nomura
发明人： Kousaku Yano , Tomoyasu Murakami , Masayuki Endo , Noboru Nomura
IPC分类号： H01L21/28 , H01L21/768 , H01L21/465
CPC分类号： H01L21/76841 , H01L21/76843
摘要： A silicon dioxide film is partly etched away to form an opening thereby exposing a silicon substrate. The surface of the opening, which is almost entirely covered with Si-OH, is coated with hexamethyldisilazane (HMDS) to bring about a silylation reaction. This causes the silicon substrate surface to be covered with a molecular film formed by replacing the hydrogen part in Si-OH with Si((CH.sub.3).sub.3. Atoms of aluminum are ejected by a sputtering process. The ejected aluminum atoms collide with the molecular film. Although some hydrocarbons (CH.sub.x) are sputtered or ejected due to such collision, a SiO.sub.x C.sub.y H.sub.z film 12' transformed from the molecular film is left between an aluminum film deposited and the silicon substrate. This SiO.sub.x C.sub.y H.sub.z film 12' acts as a barrier metal. The presence of the SiO.sub.x C.sub.y H.sub.z film prevents the occurrence of counter diffusion in the Al-Si system. No spikes are formed as a result.
摘要翻译：部分地蚀刻掉二氧化硅膜以形成开口，从而暴露硅衬底。几乎完全用Si-OH覆盖的开口的表面涂覆有六甲基二硅氮烷（HMDS）以进行甲硅烷基化反应。这导致硅衬底表面被用Si（（CH 3）3代替Si-OH中的氢部分而形成的分子膜覆盖，铝的原子通过溅射工艺喷射，喷射的铝原子与分子膜碰撞虽然由于这种碰撞而使一些烃类（CHx）溅射或喷射，但是从分子膜转化的SiO x C y H z膜12'留在沉积的铝膜和硅基板之间，该SiOxCyHz膜12'作为阻挡金属， SiOxCyHz膜的存在防止了在Al-Si系统中产生反向扩散，结果不形成尖峰。

7. 发明授权

US06251000B1 Substrate holder, method for polishing substrate, and method for fabricating semiconductor device 失效
标题翻译：基板支架，基板抛光方法及半导体装置的制造方法
公开(公告)号：US06251000B1
公开(公告)日：2001-06-26
申请号：US09398819
申请日：1999-09-20
申请人： Tomoyasu Murakami , Katsuyuki Ikenouchi , Yuichi Miyoshi
发明人： Tomoyasu Murakami , Katsuyuki Ikenouchi , Yuichi Miyoshi
IPC分类号： B24B4106
CPC分类号： B24B37/30
摘要： A substrate holder for holding a substrate to be polished thereon and pressing the substrate against a polishing pad includes a substrate-holding head for holding the substrate thereon and pressing the substrate against the polishing pad. The substrate-holding head is disposed to be vertically movable toward/away from the polishing pad. A pressing member for pressing a peripheral region of the substrate, except for an outer edge region thereof, against the polishing pad is attached to the substrate-holding head.
摘要翻译：用于保持要在其上抛光的基板并将基板按压在抛光垫上的基板保持器包括用于在其上保持基板并将基板压靠在抛光垫上的基板保持头。基板保持头设置成能够朝向/远离抛光垫垂直移动。将用于将基板的外围区域除外的按压构件压靠在研磨垫上的按压部件安装在基板固定头上。

8. 发明授权

US5866480A Method and apparatus for polishing semiconductor substrate 失效
标题翻译：用于研磨半导体衬底的方法和装置
公开(公告)号：US5866480A
公开(公告)日：1999-02-02
申请号：US697509
申请日：1996-08-26
申请人： Tomoyasu Murakami , Mikio Nishio
发明人： Tomoyasu Murakami , Mikio Nishio
IPC分类号： B24B37/04 , H01L21/304
CPC分类号： B24B37/04 , B24B57/02
摘要： A polishing pad is adhered to the top surface of a flat polishing pad holder of a platen. A substrate holding head for holding and rotating a semiconductor substrate is provided above the platen. The semiconductor substrate is rotated and pressed against the polishing pad on the platen. A slurry is supplied in a prescribed amount from a slurry supply pipe onto the polishing pad. A slat-like slurry pushing member for pushing the slurry to a central portion of the platen is provided slidably over the polishing pad. The slurry pushing member is fixed so that an inner portion thereof in a radial direction of the platen is downstream of an outer portion thereof in the radial direction of the platen in the direction of rotation of the platen during polishing.
摘要翻译：抛光垫粘附到压板的平坦抛光垫保持器的顶表面上。用于保持和旋转半导体衬底的衬底保持头设置在压板上方。将半导体衬底旋转并压靠在压板上的抛光垫上。从浆料供给管将规定量的浆料供给到研磨垫上。用于将浆料推送到压板的中心部分的板条浆料推动构件可滑动地设置在抛光垫上。浆料推动构件被固定，使得其在压板的径向方向上的内部部分在压板的径向方向上在压板的径向方向上在抛光期间在压板的旋转方向上在其下方。

9. 发明授权

US5576247A Thin layer forming method wherein hydrophobic molecular layers preventing a BPSG layer from absorbing moisture 失效
标题翻译：疏水分子层防止BPSG层吸收水分的薄层形成方法
公开(公告)号：US5576247A
公开(公告)日：1996-11-19
申请号：US97231
申请日：1993-07-27
申请人： Kousaku Yano , Masayuki Endo , Yuka Terai , Noboru Nomura , Tomoyasu Murakami , Tetsuya Ueda , Satoshi Ueda
发明人： Kousaku Yano , Masayuki Endo , Yuka Terai , Noboru Nomura , Tomoyasu Murakami , Tetsuya Ueda , Satoshi Ueda
IPC分类号： H01L21/3105 , H01L21/316
CPC分类号： H01L21/3105 , Y10S438/974
摘要： A BPSG layer serving as a silicon oxide layer is formed on a semiconductor substrate 1. Formed on the surface of the BPSG layer is a hydrophobic molecular layer comprising hydrophobic groups such as methyl, ethyl and the like, by a silylation reaction (in which silyl having hydrophobic groups such as methyl groups, ethyl groups and the like, is reacted with OH groups, and in which the hydrophobic groups are substituted with H of the OH groups to generate --O--Si(CH.sub.3).sub.3 or the like). The molecular layer prevents the BPSG layer from absorbing moisture.
摘要翻译：在半导体衬底1上形成用作氧化硅层的BPSG层。在BPSG层的表面上形成疏水性分子层，其通过甲硅烷基化反应（甲基，具有疏水基团如甲基，乙基等与OH基团反应，并且其中疏水基团被H的OH基团取代以产生-O-Si（CH 3）3等）。分子层防止BPSG层吸湿。

10. 发明授权

US5312776A Method of preventing the corrosion of metallic wirings 失效
标题翻译：防止金属布线腐蚀的方法
公开(公告)号：US5312776A
公开(公告)日：1994-05-17
申请号：US977022
申请日：1992-11-16
申请人： Tomoyasu Murakami , Michinari Yamanaka , Kousaku Yano , Masayuki Endo , Noboru Nomura , Staoshi Ueda , Naoto Matsuo , Hiroshi Imai , Masafumi Kubota
发明人： Tomoyasu Murakami , Michinari Yamanaka , Kousaku Yano , Masayuki Endo , Noboru Nomura , Staoshi Ueda , Naoto Matsuo , Hiroshi Imai , Masafumi Kubota
IPC分类号： H01L21/02 , H01L21/3213 , H01L23/532 , H01L71/44
CPC分类号： H01L21/02071 , H01L23/5329 , H01L2924/0002 , Y10S148/131
摘要： According to the method of preventing the corrosion of metallic wirings of the present invention, aluminium alloy wirings are formed on the surface of a substrate with the use of photoresists, and the photoresists are then removed. Thereafter, HMDS (hexamethyl disilazine) serving as a surface-active agent or its derivative is supplied to the aluminium alloy wirings to form hydrophobic molecular layers on the lateral walls of the aluminium alloy wirings.
摘要翻译：根据本发明的防止金属配线的腐蚀的方法，使用光致抗蚀剂在基板的表面上形成铝合金布线，然后除去光致抗蚀剂。此后，将作为表面活性剂或其衍生物的HMDS（六甲基二硅嗪）供给到铝合金布线，以在铝合金布线的侧壁上形成疏水性分子层。

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