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    • 9. 发明授权
    • Method of making a nonvolatile semiconductor memory apparatus with a
floating gate
    • 制造具有浮动栅极的非易失性半导体存储装置的方法
    • US5017505A
    • 1991-05-21
    • US313898
    • 1989-02-23
    • Tetsuo FujiiToshio SakakibaraNobuyoshi Sakakibara
    • Tetsuo FujiiToshio SakakibaraNobuyoshi Sakakibara
    • H01L29/788
    • H01L29/7883Y10S438/964
    • A first polysilicon film serving as an erase gate is deposited on the major surface of a semiconductor substrate on which a field oxide film is formed, so that the surface of the first polysilicon film is roughened. The surface of the first polysilicon film is thermally oxidized to form a first thermal oxide film thereon. During the oxidation, the roughened surface of the first polysilicon film is flattened, and is duplicated by the surface of the first thermal oxide film. A second polysilicon film is deposited on the roughened surface of the first thermal oxide film. The back surface of the second polysilicon film is roughened by the roughened surface of the first thermal oxide film. In this case, the surface of the second polysilicon film is also roughened. The roughened surface of the second polysilicon film is thermally oxidized in the same manner as described above to flatten its surface and to form a second thermal oxide film, the surface of which is roughened. A third polysilicon film serving as a write gate is formed on the second thermal oxide film.
    • 用作擦除栅极的第一多晶硅膜沉积在其上形成有场氧化膜的半导体衬底的主表面上,使得第一多晶硅膜的表面被粗糙化。 第一多晶硅膜的表面被热氧化以在其上形成第一热氧化膜。 在氧化期间,第一多晶硅膜的粗糙化表面变平,并被第一热氧化膜的表面复制。 在第一热氧化膜的粗糙化表面上沉积第二多晶硅膜。 第二多晶硅膜的背面被第一热氧化膜的粗糙化表面粗糙化。 在这种情况下,第二多晶硅膜的表面也被粗糙化。 第二多晶硅膜的粗糙化表面以与上述相同的方式被热氧化以使其表面变平,并形成第二热氧化膜,其表面被粗糙化。 在第二热氧化膜上形成用作写入栅极的第三多晶硅膜。