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    • 2. 发明授权
    • Semiconductor device and method of fabricating the same
    • 半导体装置及其制造方法
    • US07989896B2
    • 2011-08-02
    • US12612238
    • 2009-11-04
    • Tomonori AoyamaSeiji InumiyaKazuaki NakajimaTakashi Shimizu
    • Tomonori AoyamaSeiji InumiyaKazuaki NakajimaTakashi Shimizu
    • H01L27/11
    • H01L21/823462H01L21/823412H01L21/823807H01L21/823857H01L27/0629H01L29/517
    • A method of fabricating a semiconductor device according to one embodiment includes: laying out a first region, a second region, a third region and a fourth region on a semiconductor substrate by forming an element isolation region in the semiconductor substrate; forming a first insulating film on the first region and the second region; forming a first semiconductor film on the first insulating film; forming a second insulating film and an aluminum oxide film thereon on the fourth region after forming of the first semiconductor film; forming a third insulating film and a lanthanum oxide film thereon on the third region after forming of the first semiconductor film; forming a high dielectric constant film on the aluminum oxide film and the lanthanum oxide film; forming a metal film on the high dielectric constant film; forming a second semiconductor film on the first semiconductor film and the metal film; and patterning the first insulating film, the first semiconductor film, the second insulating film, the aluminum oxide film, the third insulating film, the lanthanum oxide film, the high dielectric constant film, the metal film and the second semiconductor film.
    • 根据一个实施例的制造半导体器件的方法包括:通过在半导体衬底中形成元件隔离区,在半导体衬底上铺设第一区域,第二区域,第三区域和第四区域; 在所述第一区域和所述第二区域上形成第一绝缘膜; 在所述第一绝缘膜上形成第一半导体膜; 在形成第一半导体膜之后的第四区域上形成第二绝缘膜和氧化铝膜; 在形成第一半导体膜之后,在第三区域上形成第三绝缘膜和氧化镧膜; 在氧化铝膜和氧化镧膜上形成高介电常数膜; 在高介电常数膜上形成金属膜; 在所述第一半导体膜和所述金属膜上形成第二半导体膜; 以及图案化第一绝缘膜,第一半导体膜,第二绝缘膜,氧化铝膜,第三绝缘膜,氧化镧膜,高介电常数膜,金属膜和第二半导体膜。
    • 3. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
    • 半导体器件及其制造方法
    • US20100133626A1
    • 2010-06-03
    • US12612238
    • 2009-11-04
    • Tomonori AoyamaSeiji InumiyaKazuaki NakajimaTakashi Shimizu
    • Tomonori AoyamaSeiji InumiyaKazuaki NakajimaTakashi Shimizu
    • H01L27/06H01L21/28H01L21/8236
    • H01L21/823462H01L21/823412H01L21/823807H01L21/823857H01L27/0629H01L29/517
    • A method of fabricating a semiconductor device according to one embodiment includes: laying out a first region, a second region, a third region and a fourth region on a semiconductor substrate by forming an element isolation region in the semiconductor substrate; forming a first insulating film on the first region and the second region; forming a first semiconductor film on the first insulating film; forming a second insulating film and an aluminum oxide film thereon on the fourth region after forming of the first semiconductor film; forming a third insulating film and a lanthanum oxide film thereon on the third region after forming of the first semiconductor film; forming a high dielectric constant film on the aluminum oxide film and the lanthanum oxide film; forming a metal film on the high dielectric constant film; forming a second semiconductor film on the first semiconductor film and the metal film; and patterning the first insulating film, the first semiconductor film, the second insulating film, the aluminum oxide film, the third insulating film, the lanthanum oxide film, the high dielectric constant film, the metal film and the second semiconductor film.
    • 根据一个实施例的制造半导体器件的方法包括:通过在半导体衬底中形成元件隔离区,在半导体衬底上铺设第一区域,第二区域,第三区域和第四区域; 在所述第一区域和所述第二区域上形成第一绝缘膜; 在所述第一绝缘膜上形成第一半导体膜; 在形成第一半导体膜之后的第四区域上形成第二绝缘膜和氧化铝膜; 在形成第一半导体膜之后,在第三区域上形成第三绝缘膜和氧化镧膜; 在氧化铝膜和氧化镧膜上形成高介电常数膜; 在高介电常数膜上形成金属膜; 在所述第一半导体膜和所述金属膜上形成第二半导体膜; 以及图案化第一绝缘膜,第一半导体膜,第二绝缘膜,氧化铝膜,第三绝缘膜,氧化镧膜,高介电常数膜,金属膜和第二半导体膜。
    • 4. 发明授权
    • Semiconductor device and method of manufacturing the same
    • 半导体装置及其制造方法
    • US08198155B2
    • 2012-06-12
    • US12693985
    • 2010-01-26
    • Daisuke IkenoTomonori AoyamaKazuaki NakajimaSeiji InumiyaTakashi ShimizuTakuya Kobayashi
    • Daisuke IkenoTomonori AoyamaKazuaki NakajimaSeiji InumiyaTakashi ShimizuTakuya Kobayashi
    • H01L21/8234H01L21/8238H01L29/51
    • H01L21/823842H01L21/28088H01L21/823807H01L21/82385H01L29/1054H01L29/4966H01L29/513H01L29/517H01L29/6659
    • A semiconductor device according to an embodiment of the present invention includes an N-type transistor formed in a first region on a substrate, and a P-type transistor formed in a second region on the substrate. The device includes the substrate, a first gate insulation film formed on the substrate in the first and second regions, and containing silicon, a second gate insulation film formed on the first gate insulation film in the first region, and containing first metal and oxygen, a third gate insulation film formed on the first gate insulation film in the second region, and containing second metal different from the first metal and oxygen, a fourth gate insulation film formed on the second and third gate insulation films in the first and second regions, and containing hafnium, and a gate electrode layer formed on the fourth gate insulation film in the first and second regions, and containing metal and nitrogen, a thickness of the gate electrode layer formed in the second region being greater than a thickness of the gate electrode layer formed in the first region.
    • 根据本发明的实施例的半导体器件包括形成在衬底上的第一区域中的N型晶体管和形成在衬底上的第二区域中的P型晶体管。 该器件包括衬底,形成在第一和第二区域的衬底上并含有硅的第一栅极绝缘膜,形成在第一区域中的第一栅极绝缘膜上并且包含第一金属和氧的第二栅极绝缘膜, 形成在所述第二区域中的所述第一栅极绝缘膜上并且包含不同于所述第一金属和氧的第二金属的第三栅极绝缘膜,形成在所述第一和第二区域中的所述第二和第三栅极绝缘膜上的第四栅极绝缘膜, 并且含有铪,以及形成在第一和第二区域中的第四栅极绝缘膜上并且包含金属和氮的栅极电极层,在第二区域中形成的栅电极层的厚度大于栅电极的厚度 层形成在第一区域中。
    • 5. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • US20100187612A1
    • 2010-07-29
    • US12693985
    • 2010-01-26
    • Daisuke IKENOTomonori AoyamaKazuaki NakajimaSeiji InumiyaTakashi ShimizuTakuya Kobayashi
    • Daisuke IKENOTomonori AoyamaKazuaki NakajimaSeiji InumiyaTakashi ShimizuTakuya Kobayashi
    • H01L27/092H01L21/8238
    • H01L21/823842H01L21/28088H01L21/823807H01L21/82385H01L29/1054H01L29/4966H01L29/513H01L29/517H01L29/6659
    • A semiconductor device according to an embodiment of the present invention includes an N-type transistor formed in a first region on a substrate, and a P-type transistor formed in a second region on the substrate. The device includes the substrate, a first gate insulation film formed on the substrate in the first and second regions, and containing silicon, a second gate insulation film formed on the first gate insulation film in the first region, and containing first metal and oxygen, a third gate insulation film formed on the first gate insulation film in the second region, and containing second metal different from the first metal and oxygen, a fourth gate insulation film formed on the second and third gate insulation films in the first and second regions, and containing hafnium, and a gate electrode layer formed on the fourth gate insulation film in the first and second regions, and containing metal and nitrogen, a thickness of the gate electrode layer formed in the second region being greater than a thickness of the gate electrode layer formed in the first region.
    • 根据本发明的实施例的半导体器件包括形成在衬底上的第一区域中的N型晶体管和形成在衬底上的第二区域中的P型晶体管。 该器件包括衬底,形成在第一和第二区域的衬底上并含有硅的第一栅极绝缘膜,形成在第一区域中的第一栅极绝缘膜上并且包含第一金属和氧的第二栅极绝缘膜, 形成在所述第二区域中的所述第一栅极绝缘膜上并且包含不同于所述第一金属和氧的第二金属的第三栅极绝缘膜,形成在所述第一和第二区域中的所述第二和第三栅极绝缘膜上的第四栅极绝缘膜, 并且含有铪,以及形成在第一和第二区域中的第四栅极绝缘膜上并且包含金属和氮的栅极电极层,在第二区域中形成的栅电极层的厚度大于栅电极的厚度 层形成在第一区域中。
    • 7. 发明授权
    • Cartridge configured of two units and image forming apparatus that accommodates the cartridge
    • 由两个单元构成的盒和容纳盒的图像形成装置
    • US09141084B2
    • 2015-09-22
    • US14141863
    • 2013-12-27
    • Takashi Shimizu
    • Takashi Shimizu
    • G03G15/00G03G21/18
    • G03G21/1839G03G21/1817G03G21/1875G03G21/1896G03G2221/1892
    • A cartridge mountable in an image forming apparatus includes a first unit that stores developer and a second unit that accommodates the first unit. The first unit includes a first detected part configured to be displaced irreversibly from a first-unit new-product position to a first-unit used position upon receipt of a driving force from the image forming apparatus, the first detected part contacting a detector provided in the image forming apparatus while being displaced from the first-unit new-product position to the first-unit used position to be detected by the detector. The second unit includes a second detected part configured to be displaced irreversibly from a second-unit new-product position to a second-unit used position upon receipt of a driving force from the image forming apparatus, the second detected part contacting the detector while being displaced from the second-unit new-product position to the second-unit used position to be detected by the detector.
    • 可安装在图像形成装置中的盒式存储器包括存储显影剂的第一单元和容纳第一单元的第二单元。 第一单元包括第一检测部件,其被配置为在接收到来自图像形成装置的驱动力时从第一单元新产品位置不可逆地移位到第一单元使用位置,第一检测部件接触设置在 图像形成装置从第一单元新产品位置移动到由检测器检测的第一单元使用位置。 第二单元包括被接收来自图像形成装置的驱动力而不可逆地从第二单元新产品位置移动到第二单元使用位置的第二检测部件,第二检测部件与第二检测部件接触检测器,同时 从第二单元新产品位置移动到由检测器检测到的第二单元使用位置。
    • 8. 发明授权
    • Process unit and image-forming device using process unit
    • 处理单元和成像装置使用处理单元
    • US08768212B2
    • 2014-07-01
    • US13305926
    • 2011-11-29
    • Junichi HashimotoTakashi Shimizu
    • Junichi HashimotoTakashi Shimizu
    • G03G15/04G03G15/08
    • G03G15/0813G03G21/1821G03G2215/0636
    • A process unit includes an image bearing member, a first frame, a developing unit, a pressing assembly, and a pressing-force adjusting assembly. The first frame supports the image bearing member. The developing unit includes a developing roller and a second frame supporting the developing roller. The pressing assembly generates a first pressing force acting on the developing unit such that the developing roller is in pressure contact with the image bearing member. The pressing-force adjusting assembly contacts one of the first frame and the developing unit and generates a second pressing force acting on the developing unit against the first pressing force. The second pressing force is smaller than the first pressing force.
    • 处理单元包括图像承载部件,第一框架,显影单元,按压组件和按压力调节组件。 第一框架支撑图像承载构件。 显影单元包括显影辊和支撑显影辊的第二框架。 按压组件产生作用在显影单元上的第一按压力,使得显影辊与图像承载部件压力接触。 按压力调节组件接触第一框架和显影单元中的一个,并产生抵抗第一按压力作用在显影单元上的第二按压力。 第二按压力小于第一按压力。
    • 9. 发明申请
    • POWER TRANSMISSION SYSTEM FOR VEHICLE
    • 车辆动力传动系统
    • US20140135158A1
    • 2014-05-15
    • US14131728
    • 2011-07-11
    • Naoki TamuraTakashi Shimizu
    • Naoki TamuraTakashi Shimizu
    • F16H57/03
    • F16H57/03F16H9/18F16H57/028F16H57/035
    • A power transmission system for a vehicle includes a bowl-shaped peripheral wall for housing a power transmission member and a structure is provided to inhibit a circular standing wave mode that is generated in the bowl-shaped peripheral wall during power transmission. A resonance frequency [f] is increased in a surface of a bowl-shaped peripheral wall that is provided with a rib while the resonance frequency [f] is reduced in a surface of the bowl-shaped peripheral wall that is provided with a mass. It is possible to inhibit excitation of the circular standing wave mode generated in the bowl-shaped peripheral wall by changing the resonance frequency [f] between a peripheral wall surface of the housing that is provided with the rib and a peripheral wall surface thereof that is provided with the mass.
    • 一种用于车辆的动力传递系统包括用于容纳动力传递构件的碗状周壁,并且设置用于抑制在动力传递期间在碗状周壁中产生的圆形驻波模式的结构。 在设置有肋的碗状周壁的表面中,在设置有质量的碗状周壁的表面中的共振频率[f]减小时,共振频率[f]增加。 可以通过改变设置有肋的壳体的周壁面与其周壁面之间的共振频率[f]来抑制在碗形周壁中产生的圆形驻波模式的激发, 提供与群众。
    • 10. 发明授权
    • Input device and display apparatus including the same
    • 输入装置和包括其的显示装置
    • US08659560B2
    • 2014-02-25
    • US12892600
    • 2010-09-28
    • Yasunari NagataTakashi ShimizuNatsuko YamagataAkinori SatouTakashi MinamiYoshio Miyazaki
    • Yasunari NagataTakashi ShimizuNatsuko YamagataAkinori SatouTakashi MinamiYoshio Miyazaki
    • G06F3/041
    • G06F3/044G06F2203/04111
    • An input device includes a substrate including a first principal surface and a second principal surface opposite the first principal surface; a plurality of first detecting electrodes disposed on the second principal surface of the substrate; a plurality of second detecting electrodes disposed on the second principal surface of the substrate; at least one first connecting electrode disposed on the second principal surface of the substrate, the first connecting electrode being configured to connect adjacent first detecting electrodes to each other; at least one second connecting electrode including an intersection that is spaced from the second principal surface of the substrate and crosses the first connecting electrode, the second connecting electrode being configured to connect adjacent second detecting electrodes to each other; and a light diffusing member disposed at least in an area corresponding to the intersection.
    • 输入装置包括:基板,包括第一主表面和与第一主表面相对的第二主表面; 设置在所述基板的所述第二主面上的多个第一检测电极; 多个第二检测电极,设置在基板的第二主表面上; 至少一个第一连接电极,设置在所述基板的第二主表面上,所述第一连接电极被配置为将相邻的第一检测电极彼此连接; 至少一个第二连接电极,包括与所述基板的所述第二主表面间隔开并与所述第一连接电极相交的交点,所述第二连接电极被配置为将相邻的第二检测电极彼此连接; 以及至少设置在与交叉点对应的区域中的光漫射构件。