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    • 3. 发明申请
    • ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT
    • 电子元件的电子元件和制造方法
    • US20100157565A1
    • 2010-06-24
    • US12621194
    • 2009-11-18
    • Makoto YOSHIDAHiroshi KAMIYAMATomonaga NISHIKAWA
    • Makoto YOSHIDAHiroshi KAMIYAMATomonaga NISHIKAWA
    • H05K7/02H05K3/30
    • H01F27/292H01F27/027H01F41/046H01G4/224H01G4/33Y10T29/4913
    • A manufacturing method of electronic components includes forming a first insulation layer on a substrate, forming a plurality of passive elements on the first insulation layer, forming a second insulation layer on the passive elements, forming a plurality of conductor layers electrically connected to the respective passive elements, on the outer side of the second insulation layer to be exposed to an upper surface of each electronic component, and forming grooves between the electronic components including the respective passive elements to expose side surfaces of each electronic component and parts of the conductor layers from the side surfaces of each electronic component. The manufacturing method further including plating a plurality of external electrodes on the respective conductor layers exposed to the upper surface and the side surfaces of each electronic component, and cutting the substrate to completely separate into individual electronic components.
    • 电子部件的制造方法包括在基板上形成第一绝缘层,在所述第一绝缘层上形成多个无源元件,在所述无源元件上形成第二绝缘层,形成与各自被动电连接的多个导体层 元件,在第二绝缘层的外侧暴露于每个电子部件的上表面,以及在包括各个无源元件的电子部件之间形成凹槽,以暴露每个电子部件的侧表面和导体层的部分 每个电子元件的侧面。 该制造方法还包括在暴露于每个电子部件的上表面和侧表面的各个导体层上电镀多个外部电极,并且将基板切割成完全分离为各个电子部件。