专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07907093B2 Electronic device and method for manufacturing same 有权
标题翻译：电子装置及其制造方法
公开(公告)号：US07907093B2
公开(公告)日：2011-03-15
申请号：US12133410
申请日：2008-06-05
申请人： Satoru Honda , Tomoko Honda , Nobuyoshi Kuroiwa , Masaomi Nakahata , Jun Morimoto , Yoshikazu Hata , Koichi Sato , Akihiro Tsujimura , Makoto Tabata , Minoru Sakurai , Shoji Kato
发明人： Satoru Honda , Tomoko Honda , Nobuyoshi Kuroiwa , Masaomi Nakahata , Jun Morimoto , Yoshikazu Hata , Koichi Sato , Akihiro Tsujimura , Makoto Tabata , Minoru Sakurai , Shoji Kato
IPC分类号： H01Q1/24
CPC分类号： H01Q9/0407 , H01Q1/42 , Y10T29/49016
摘要： An electronic device includes a first molded body having a first frame, the first molded body being provided with a conductive pattern on its outer surface, a second molded body having a second frame, the second molded body being joined to the first molded body, a wiring sheet made of an insulative sheet provided with an interconnection pattern, a circuit board having a feed point, and a feed line having a first end extended to a mating surface of the first frame opposed to the second frame and a second end connected to the conductive pattern. The interconnection pattern has a first end connected to the one end of the feed line. The interconnection pattern has a second end connected to the feed point.
摘要翻译：一种电子设备，包括具有第一框架的第一模制体，所述第一模制体在其外表面上设置有导电图案，具有第二框架的第二模制体，所述第二模制体与所述第一模制体接合，由具有互连图案的绝缘片制成的布线片，具有馈电点的电路板和具有延伸到与第二框架相对的第一框架的配合表面的第一端的馈电线和连接到第二框架的第二端导电图案。互连图案具有连接到馈送线的一端的第一端。互连图案具有连接到馈电点的第二端。

2. 发明申请

US20080150811A1 Electronic apparatus 有权
标题翻译：电子仪器
公开(公告)号：US20080150811A1
公开(公告)日：2008-06-26
申请号：US11902448
申请日：2007-09-21
申请人： Tomoko Honda , Nobuyoshi Kuroiwa , Masaomi Nakahata , Jun Morimoto , Satoru Honda , Yoshikazu Hata , Koichi Sato , Akihiro Tsujimura , Makoto Tabata , Minoru Sakurai , Shoji Kato
发明人： Tomoko Honda , Nobuyoshi Kuroiwa , Masaomi Nakahata , Jun Morimoto , Satoru Honda , Yoshikazu Hata , Koichi Sato , Akihiro Tsujimura , Makoto Tabata , Minoru Sakurai , Shoji Kato
IPC分类号： H01Q1/22
CPC分类号： H01Q9/40 , H01Q9/42 , H01Q21/28 , H05K1/0284 , H05K1/144 , H05K3/325 , H05K2201/048 , H05K2201/0999 , H05K2203/167
摘要： An electronic apparatus includes: a housing provided with a first conductive pattern; a substrate provided with a first wiring layer in a surface thereof and fixed to the housing; and a first conductive member connecting the first conductive pattern and the first wiring layer. The first conductive pattern extends onto an outer surface and an inner surface of the housing. The first conductive member is in contact with each of at least a part of the first conductive pattern extending onto the inner surface and an end of the first wiring layer. Alternatively, an electronic apparatus includes: a housing provided with a conductive pattern and having a through part in a frame portion thereof; and a substrate provided with a wiring layer on a surface thereof and having a protruding part and fixed to the housing. The protruding part and the through part are fit. The conductive pattern extends onto an outer surface of the housing and onto an inner surface of the through part. At least some of the conductive pattern extending onto the inner surface is in contact with an end of the wiring layer.
摘要翻译：电子设备包括：具有第一导电图案的壳体; 基板，其在其表面上设置有第一布线层并固定到所述壳体; 以及连接第一导电图案和第一布线层的第一导电构件。第一导电图案延伸到壳体的外表面和内表面上。第一导电构件与延伸到第一布线层的内表面和端部的第一导电图案的至少一部分中的每一个接触。或者，电子设备包括：壳体，设置有导电图案，并且在其框架部分中具有通孔部分; 以及在其表面上设置有布线层并且具有突出部并固定到壳体的基板。突出部分和贯穿部分是合适的。导电图案延伸到壳体的外表面上并延伸到通孔的内表面上。延伸到内表面上的至少一些导电图案与布线层的端部接触。

3. 发明授权

US08130170B2 Electronic apparatus 有权
标题翻译：电子仪器
公开(公告)号：US08130170B2
公开(公告)日：2012-03-06
申请号：US11902449
申请日：2007-09-21
申请人： Masaomi Nakahata , Tomoko Honda , Yoshikazu Hata , Satoru Honda , Jun Morimoto , Nobuyoshi Kuroiwa , Akihiro Tsujimura , Koichi Sato , Minoru Sakurai , Makoto Tabata , Shoji Kato
发明人： Masaomi Nakahata , Tomoko Honda , Yoshikazu Hata , Satoru Honda , Jun Morimoto , Nobuyoshi Kuroiwa , Akihiro Tsujimura , Koichi Sato , Minoru Sakurai , Makoto Tabata , Shoji Kato
IPC分类号： H01Q1/24
CPC分类号： H01Q1/243
摘要： An electronic apparatus includes: a first molded body; a second molded body which composes a housing with the first molded body; a first conductive pattern provided on an outer surface of the first molded body; a second conductive pattern provided in the housing; and a first conductive pin. The first conductive pin passes through the first molded body and connects the first conductive pattern and the second conductive pattern.
摘要翻译：电子设备包括：第一成型体; 第二成型体，其与第一成型体构成壳体; 设置在第一成型体的外表面上的第一导电图案; 设置在所述壳体中的第二导电图案; 和第一导电引脚。第一导电针穿过第一模制体并连接第一导电图案和第二导电图案。

4. 发明申请

US20080150815A1 Electronic apparatus 有权
标题翻译：电子仪器
公开(公告)号：US20080150815A1
公开(公告)日：2008-06-26
申请号：US11902449
申请日：2007-09-21
申请人： Masaomi Nakahata , Tomoko Honda , Yoshikazu Hata , Satoru Honda , Jun Morimoto , Nobuyoshi Kuroiwa , Akihiro Tsujimura , Koichi Sato , Minoru Sakurai , Makoto Tabata , Shoji Kato
发明人： Masaomi Nakahata , Tomoko Honda , Yoshikazu Hata , Satoru Honda , Jun Morimoto , Nobuyoshi Kuroiwa , Akihiro Tsujimura , Koichi Sato , Minoru Sakurai , Makoto Tabata , Shoji Kato
IPC分类号： H01Q1/12
CPC分类号： H01Q1/243
摘要： An electronic apparatus includes: a first molded body; a second molded body which composes a housing with the first molded body; a first conductive pattern provided on an outer surface of the first molded body; a second conductive pattern provided in the housing; and a first conductive pin. The first conductive pin passes through the first molded body and connects the first conductive pattern and the second conductive pattern.
摘要翻译：电子设备包括：第一成型体; 第二成型体，其与第一成型体构成壳体; 设置在第一成型体的外表面上的第一导电图案; 设置在所述壳体中的第二导电图案; 和第一导电引脚。第一导电针穿过第一模制体并连接第一导电图案和第二导电图案。

5. 发明授权

US08812062B2 Electronic apparatus 有权
标题翻译：电子仪器
公开(公告)号：US08812062B2
公开(公告)日：2014-08-19
申请号：US11902450
申请日：2007-09-21
申请人： Yoshikazu Hata , Tomoko Honda , Satoru Honda , Nobuyoshi Kuroiwa , Masaomi Nakahata , Jun Morimoto , Koichi Sato , Akihiro Tsujimura , Makoto Tabata , Minoru Sakurai , Shoji Kato
发明人： Yoshikazu Hata , Tomoko Honda , Satoru Honda , Nobuyoshi Kuroiwa , Masaomi Nakahata , Jun Morimoto , Koichi Sato , Akihiro Tsujimura , Makoto Tabata , Minoru Sakurai , Shoji Kato
IPC分类号： H04M1/00
CPC分类号： H05K7/06 , H01Q1/22 , H01Q1/243 , H01Q1/40 , H01Q9/0407
摘要： An electronic apparatus includes: a first molded body; a second molded body which composes housing with the first molded body; a first conductive pattern provided in the housing; a second conductive pattern provided on an outer surface of the housing; and a first conductive member. The first conductive member passes through a gap of a mating face between the first molded body and the second molded body. The first conductive member connects the first conductive pattern and the second conductive pattern.
摘要翻译：电子设备包括：第一成型体; 第二成型体，其与第一成型体构成壳体; 设置在所述壳体中的第一导电图案; 设置在所述壳体的外表面上的第二导电图案; 和第一导电构件。第一导电构件穿过第一模制体和第二模制体之间的配合面的间隙。第一导电构件连接第一导电图案和第二导电图案。

6. 发明授权

US08054240B2 Electronic apparatus 有权
标题翻译：电子仪器
公开(公告)号：US08054240B2
公开(公告)日：2011-11-08
申请号：US11902448
申请日：2007-09-21
申请人： Tomoko Honda , Nobuyoshi Kuroiwa , Masaomi Nakahata , Jun Morimoto , Satoru Honda , Yoshikazu Hata , Koichi Sato , Akihiro Tsujimura , Makoto Tabata , Minoru Sakurai , Shoji Kato
发明人： Tomoko Honda , Nobuyoshi Kuroiwa , Masaomi Nakahata , Jun Morimoto , Satoru Honda , Yoshikazu Hata , Koichi Sato , Akihiro Tsujimura , Makoto Tabata , Minoru Sakurai , Shoji Kato
IPC分类号： H01Q1/24 , H01Q1/40
CPC分类号： H01Q9/40 , H01Q9/42 , H01Q21/28 , H05K1/0284 , H05K1/144 , H05K3/325 , H05K2201/048 , H05K2201/0999 , H05K2203/167
摘要： An electronic apparatus includes: a housing provided with a first conductive pattern; a substrate provided with a first wiring layer in a surface thereof and fixed to the housing; and a first conductive member connecting the first conductive pattern and the first wiring layer. The first conductive pattern extends onto an outer surface and an inner surface of the housing. The first conductive member is in contact with each of at least a part of the first conductive pattern extending onto the inner surface and an end of the first wiring layer. Alternatively, an electronic apparatus includes: a housing provided with a conductive pattern and having a through part in a frame portion thereof; and a substrate provided with a wiring layer on a surface thereof and having a protruding part and fixed to the housing. The protruding part and the through part are fit. The conductive pattern extends onto an outer surface of the housing and onto an inner surface of the through part. At least some of the conductive pattern extending onto the inner surface is in contact with an end of the wiring layer.
摘要翻译：电子设备包括：具有第一导电图案的壳体; 基板，其在其表面上设置有第一布线层并固定到所述壳体; 以及连接第一导电图案和第一布线层的第一导电构件。第一导电图案延伸到壳体的外表面和内表面上。第一导电构件与延伸到第一布线层的内表面和端部的第一导电图案的至少一部分中的每一个接触。或者，电子设备包括：壳体，设置有导电图案，并且在其框架部分中具有通孔部分; 以及在其表面上设置有布线层并且具有突出部并固定到壳体的基板。突出部分和贯穿部分是合适的。导电图案延伸到壳体的外表面上并延伸到通孔的内表面上。延伸到内表面上的至少一些导电图案与布线层的端部接触。

7. 发明申请

US20090015490A1 ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME 审中-公开
标题翻译：电子设备及其制造方法
公开(公告)号：US20090015490A1
公开(公告)日：2009-01-15
申请号：US12171592
申请日：2008-07-11
申请人： Satoru HONDA , Tomoko Honda , Nobuyoshi Kuroiwa , Masaomi Nakahata , Jun Morimoto , Yoshikazu Hata , Koichi Sato , Akihiro Tsujimura , Makoto Tabata , Minoru Sakurai , Shoji Kato
发明人： Satoru HONDA , Tomoko Honda , Nobuyoshi Kuroiwa , Masaomi Nakahata , Jun Morimoto , Yoshikazu Hata , Koichi Sato , Akihiro Tsujimura , Makoto Tabata , Minoru Sakurai , Shoji Kato
IPC分类号： H01Q1/24 , H01Q1/40
CPC分类号： H01Q1/243 , H01Q9/0421 , H01Q9/16 , H01Q9/26 , H01Q9/30 , H01Q9/42
摘要： An electronic device includes: a first molded body having a recessed cross section and made of resin; a second molded body having a recessed cross section and made of resin, the second molded body being fitted inside the first molded body; and an antenna pattern sandwiched between the first and second molded body. Among the surfaces of the first molded body, the surface on the side not adjacent to the antenna pattern constitutes an outer surface.
摘要翻译：电子设备包括：第一成型体，其具有凹入的横截面并由树脂制成; 第二成型体，其具有凹入的横截面并由树脂制成，所述第二模制体装配在所述第一模制体内; 以及夹在第一和第二成型体之间的天线图案。在第一成型体的表面中，与天线图案不相邻的一侧的表面构成外表面。

8. 发明申请

US20080182539A1 Electronic apparatus 有权
标题翻译：电子仪器
公开(公告)号：US20080182539A1
公开(公告)日：2008-07-31
申请号：US11902450
申请日：2007-09-21
申请人： Yoshikazu Hata , Tomoko Honda , Satoru Honda , Nobuyoshi Kuroiwa , Masaomi Nakahata , Jun Morimoto , Koichi Sato , Akihiro Tsujimura , Makoto Tabata , Minoru Sakurai , Shoji Kato
发明人： Yoshikazu Hata , Tomoko Honda , Satoru Honda , Nobuyoshi Kuroiwa , Masaomi Nakahata , Jun Morimoto , Koichi Sato , Akihiro Tsujimura , Makoto Tabata , Minoru Sakurai , Shoji Kato
IPC分类号： H04B1/08
CPC分类号： H05K7/06 , H01Q1/22 , H01Q1/243 , H01Q1/40 , H01Q9/0407
摘要： An electronic apparatus includes: a first molded body; a second molded body which composes housing with the first molded body; a first conductive pattern provided in the housing; a second conductive pattern provided on an outer surface of the housing; and a first conductive member. The first conductive member passes through a gap of a mating face between the first molded body and the second molded body. The first conductive member connects the first conductive pattern and the second conductive pattern.
摘要翻译：电子设备包括：第一成型体; 第二成型体，其与第一成型体构成壳体; 设置在所述壳体中的第一导电图案; 设置在所述壳体的外表面上的第二导电图案; 和第一导电构件。第一导电构件穿过第一模制体和第二模制体之间的配合面的间隙。第一导电构件连接第一导电图案和第二导电图案。

9. 发明申请

US20080303737A1 ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：电子设备及其制造方法
公开(公告)号：US20080303737A1
公开(公告)日：2008-12-11
申请号：US12133410
申请日：2008-06-05
申请人： Satoru HONDA , Tomoko Honda , Nobuyoshi Kuroiwa , Masaomi Nakahata , Jun Morimoto , Yoshikazu Hata , Koichi Sato , Akihiro Tsujimura , Makoto Tabata , Minoru Sakurai , Shoji Kato
发明人： Satoru HONDA , Tomoko Honda , Nobuyoshi Kuroiwa , Masaomi Nakahata , Jun Morimoto , Yoshikazu Hata , Koichi Sato , Akihiro Tsujimura , Makoto Tabata , Minoru Sakurai , Shoji Kato
IPC分类号： H01Q1/42 , H01P11/00
CPC分类号： H01Q9/0407 , H01Q1/42 , Y10T29/49016
摘要： An electronic device includes a first molded body having a first frame, the first molded body being provided with a conductive pattern on its outer surface, a second molded body having a second frame, the second molded body being joined to the first molded body, a wiring sheet made of an insulative sheet provided with an interconnection pattern, a circuit board having a feed point, and a feed line having a first end extended to a mating surface of the first frame opposed to the second frame and a second end connected to the conductive pattern. The interconnection pattern has a first end connected to the one end of the feed line. The interconnection pattern has a second end connected to the feed point.
摘要翻译：一种电子设备，包括具有第一框架的第一模制体，所述第一模制体在其外表面上设置有导电图案，第二模制体具有第二框架，所述第二模制体连接到所述第一模制体，由具有互连图案的绝缘片制成的布线片，具有馈电点的电路板和具有延伸到与第二框架相对的第一框架的配合表面的第一端的馈电线和连接到第二框架的第二端导电图案。互连图案具有连接到馈送线的一端的第一端。互连图案具有连接到馈电点的第二端。

10. 发明申请

US20100255893A1 MOBILE COMMUNICATION APPARATUS AND ANTENNA STRUCTURE 审中-公开
标题翻译：移动通信装置和天线结构
公开(公告)号：US20100255893A1
公开(公告)日：2010-10-07
申请号：US12693616
申请日：2010-01-26
申请人： Akio Ihara , Minoru Sakurai , Makoto Tabata
发明人： Akio Ihara , Minoru Sakurai , Makoto Tabata
IPC分类号： H04W88/02 , H01Q1/24
CPC分类号： H01Q1/243 , H01Q21/28 , H04W88/02
摘要： A mobile communication apparatus configured to be provided with an extra antenna has a printed board provided with an antenna feed point, an antenna having a spring-like contact and provided on the printed board, and a housing constituted by a first case and a second case fixed into each other. The printed board and the antenna are arranged between and pressed by the first case and the second case. The antenna feed point and the spring-like contact are in contact with and electrically connected to each other by means of elastic force of the spring-like contact caused upon the first case and the second case being fixed into each other. The housing has a space for containing the extra antenna such that the extra antenna is electrically connected to the antenna feed point by means of the elastic force.
摘要翻译：配置成设置有额外天线的移动通信装置具有设置有天线馈电点的印刷电路板，具有弹簧状接触并设置在印刷电路板上的天线以及由第一壳体和第二壳体构成的壳体相互固定印刷电路板和天线布置在第一壳体和第二壳体之间并被第一壳体和第二壳体按压之间。天线馈电点和弹簧状触点通过在第一壳体上引起的弹簧状接触的弹力彼此接触并彼此电连接，并且第二壳体彼此固定。壳体具有用于容纳额外天线的空间，使得额外的天线通过弹性力电连接到天线馈电点。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式