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    • 1. 发明授权
    • Laminated chip common mode choke coil
    • 叠层芯片共模扼流圈
    • US5250923A
    • 1993-10-05
    • US997393
    • 1992-12-28
    • Tomoaki UshiroToshio KawabataDaiji KonoHisato Oshima
    • Tomoaki UshiroToshio KawabataDaiji KonoHisato Oshima
    • H01F17/00H01F27/32H01F37/00H01F27/30
    • H01F17/0013H01F2017/0093
    • A conductor pattern for forming coils and lead-out electrodes which are led out from the coils are formed on a magnetic substance sheet. Furthermore, said magnetic substance sheet is provided with through-holes for connecting the conductor patterns. The magnetic substance sheets disposed respectively just over and just under the conductor pattern that becomes the lead-out electrodes are coated with non-magnetic material paste. A laminated chip common mode choke coil is produced by laminating these magnetic substance sheets and baking them integrally and thereafter forming external electrodes. The non-magnetic material diffuses into the magnetic substance sheet by baking the lamination of the magnetic substance sheets, and the permeability of that portion becomes low. Therefore, the magnetic reluctance around the lead-out electrode becomes high, thus reducing leakage flux around that portion. Thereby, coupling between two coils formed in the choke coil becomes good.
    • 用于形成从线圈引出的线圈和引出电极的导体图案形成在磁性物质片上。 此外,所述磁性物质片设置有用于连接导体图案的通孔。 分别设置在成为引出电极的导体图案正上方且正好在其下方的磁性物质片被非磁性材料糊涂覆。 通过层叠这些磁性物质片并一体地烘烤它们,然后形成外部电极来制造层叠芯片共模扼流线圈。 非磁性材料通过烘焙磁性物质片的层叠而扩散到磁性物质片中,并且该部分的磁导率变低。 因此,引出电极周围的磁阻变高,从而减少该部分附近的漏磁通。 因此,形成在扼流线圈中的两个线圈之间的耦合变得良好。
    • 2. 发明授权
    • Electronic component
    • 电子元器件
    • US07034637B2
    • 2006-04-25
    • US10828320
    • 2004-04-21
    • Daiji KonoHiroaki Kikuta
    • Daiji KonoHiroaki Kikuta
    • H03H7/01C03C10/00
    • H03H1/0007C03C3/085C03C3/087C03C3/091C03C3/097H03H2001/0085
    • An electronic component including a magnetic member comprising an iron oxide magnetic composition, a nonmagnetic member in contact with the magnetic member and including a glass ceramic composite composition, and an internal conductor portion disposed in at least one of the magnetic member and the nonmagnetic member. The glass ceramic composite composition includes crystallized glass as a main component, and quartz as a sub-component filler. The crystallized glass contains 25 percent by weight to 55 percent by weight of SiO2, 30 percent by weight to 55 percent by weight of MgO, 5 percent by weight to 30 percent by weight of Al2O3, and 0 percent by weight to 30 percent by weight of B2O3, and the content of the quartz is 5 percent by weight to 30 percent by weight relative to 100 percent by weight of the crystallized glass.
    • 一种电子部件,包括磁性部件,所述磁性部件包括氧化铁磁性组合物,与所述磁性部件接触并包括玻璃陶瓷复合材料组合物的非磁性部件,以及设置在所述磁性部件和所述非磁性部件中的至少一个中的内部导体部分。 玻璃陶瓷复合组合物包括结晶化玻璃作为主要成分,石英作为副成分填料。 结晶玻璃含有25重量%至55重量%的SiO 2,30重量%至55重量%的MgO,5重量%至30重量%的Al 2 O 3, 2 O 3,和0重量%至30重量%的B 2 O 3 3,以及 石英相对于结晶玻璃的100重量%为5重量%至30重量%。