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1. 发明申请

US20070152129A1 METHOD AND APPARATUS FOR INTENSITY CONTROL OF MULTIPLE LIGHT SOURCES 有权
标题翻译：多光源强度控制的方法与装置
公开(公告)号：US20070152129A1
公开(公告)日：2007-07-05
申请号：US11275206
申请日：2005-12-19
申请人： Zili Li , Tomasz Klosowiak , Min-Xian Zhang
发明人： Zili Li , Tomasz Klosowiak , Min-Xian Zhang
IPC分类号： G02B27/40
CPC分类号： G02B27/145 , G02B27/102 , G02B27/104 , H04N9/3155
摘要： Light from a plurality of light sources is combined in a beam combiner. Photo-sensors are used to sense the intensity of each light source. Signals from the photo-sensors may be used to control the intensity of the light sources. The photo-sensors can be located in the beam combiner or located in the fringe of a collimated beam produced by the beam combiner. The illumination system has application in laser-scanning micro-projectors, for example.
摘要翻译：来自多个光源的光在光束组合器中组合。光传感器用于感测每个光源的强度。光传感器的信号可用于控制光源的强度。光传感器可以位于光束组合器中或位于由光束组合器产生的准直光束的边缘中。照明系统例如在激光扫描微型投影机中的应用。

2. 发明申请

US20070138372A1 METHOD AND APPARATUS FOR INTENSITY CONTROL OF MULTIPLE LIGHT SOURCES USING SOURCE TIMING 有权
标题翻译：使用源时间的多光源的强度控制方法与装置
公开(公告)号：US20070138372A1
公开(公告)日：2007-06-21
申请号：US11275204
申请日：2005-12-19
申请人： Tomasz Klosowiak , Zili Li , Min-Xian Zhang
发明人： Tomasz Klosowiak , Zili Li , Min-Xian Zhang
IPC分类号： G01J1/32
CPC分类号： G01J1/32 , H05B37/0281 , Y02B20/42
摘要： A method and apparatus for controlling light intensity from two or more light sources. A timing scheme is used to modulate the light sources. Light from the light sources is combined to form a beam and a photo-sensor senses the beam. In a time interval when only one of the light sources is activated, the signal from the photo-sensor is monitored and used in a feedback control circuit to control the active light source.
摘要翻译：一种用于控制来自两个或更多个光源的光强度的方法和装置。使用时序方案来调制光源。来自光源的光被组合以形成光束，光电传感器感测光束。在只有一个光源被激活的时间间隔中，来自光电传感器的信号被监视并用于反馈控制电路中以控制主动光源。

3. 发明授权

US06859119B2 Meso-microelectromechanical system package 有权
标题翻译：中微机电系统封装
公开(公告)号：US06859119B2
公开(公告)日：2005-02-22
申请号：US10329907
申请日：2002-12-26
申请人： Manes Eliacin , Tomasz Klosowiak , Robert Lempkowski , Ke Lian
发明人： Manes Eliacin , Tomasz Klosowiak , Robert Lempkowski , Ke Lian
IPC分类号： B81B7/00 , H01P1/10
CPC分类号： B81C1/00333 , H01H2001/0073
摘要： A mesoscale microelectromechanical system (MEMS) package for a micro-machine. The mesoscale micro-machine is formed on a printed circuit board (10) at the same time and of the same materials as the mesoscale micro-machine package. Both the micro-machine and the package have a first metal layer (12, 16), an insulating member (22, 26) formed on the first metal layer, and a second metal layer (32, 36) situated on the insulating layer. The package consists of a perimeter wall surrounding the micro-machine and a low-flow capping adhesive layer (40). The first metal layers of both the micro-machine and the package are formed in the same process sequence, and the insulating layers of both the micro-machine and the package are formed in the same process sequence, and the second metal layers of both the micro-machine and the package are formed in the same process sequence. The low-flow capping adhesive secures an optional cover (46) on the package to provide an environmental seal.
摘要翻译：用于微机的中尺度微机电系统（MEMS）封装。中等尺寸的微型机器同时形成在印刷电路板（10）上并且与中等尺寸的微型机器包装材料相同。微机和封装均具有第一金属层（12,16），形成在第一金属层上的绝缘构件（22,26）和位于绝缘层上的第二金属层（32,36）。包装由围绕微机器的周边壁和低流量封盖粘合剂层（40）组成。微机和封装的第一金属层以相同的工艺顺序形成，微机和封装的绝缘层以相同的工艺顺序形成，并且两者的第二金属层微机和封装以相同的工艺顺序形成。低流量封盖粘合剂将可选的盖（46）固定在包装上以提供环境密封。

4. 发明申请

US20080000365A1 Active, printed emissive packaging for promotional products 审中-公开
标题翻译：主动印刷发光包装促销产品
公开(公告)号：US20080000365A1
公开(公告)日：2008-01-03
申请号：US11207856
申请日：2005-08-18
申请人： Krishna Jonnalagadda , Daniel Gamota , Julius Gyorfi , Krishna Kalyanasundaram , Swee Mok , Mansour Toloo , Timothy Collins , Jie Zhang , Tomasz Klosowiak
发明人： Krishna Jonnalagadda , Daniel Gamota , Julius Gyorfi , Krishna Kalyanasundaram , Swee Mok , Mansour Toloo , Timothy Collins , Jie Zhang , Tomasz Klosowiak
IPC分类号： D06F93/00
CPC分类号： B41F17/00 , G09F13/22
摘要： An energizable design image portion (203) of a provided design pattern is printed on a provided substrate (201) using a functional ink comprised of at least one energy emissive material. A passive design image portion (202) of that design pattern is then also printed on that substrate using at least one graphic arts ink. In a preferred embodiment this apparatus may further comprise electrically conductive electrodes (204) on the substrate to permit selective energization of the energy emissive material to thereby induce illumination of the energizable design image portion of the design pattern.
摘要翻译：使用由至少一种能量发射材料构成的功能墨水，将所提供的设计图案的可激励设计图像部分（203）印刷在所提供的基板（201）上。然后使用至少一个图形油墨将该设计图案的被动设计图像部分（202）印刷在该基板上。在优选实施例中，该装置还可以包括在基板上的导电电极（204），以允许能量发射材料的选择性激励，从而引起设计图案的可激励设计图像部分的照明。

5. 发明授权

US06649445B1 Wafer coating and singulation method 有权
标题翻译：晶圆涂层和切片方法
公开(公告)号：US06649445B1
公开(公告)日：2003-11-18
申请号：US10241265
申请日：2002-09-11
申请人： Jing Qi , Janice Danvir , Tomasz Klosowiak
发明人： Jing Qi , Janice Danvir , Tomasz Klosowiak
IPC分类号： H01L2144
CPC分类号： H01L21/561 , H01L21/304 , H01L21/3043 , H01L21/56 , H01L21/563 , H01L21/78 , H01L23/3114 , H01L24/29 , H01L24/96 , H01L24/97 , H01L2224/16 , H01L2224/274 , H01L2224/73104 , H01L2224/73203 , H01L2224/83191 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01033 , H01L2924/01078 , H01L2924/10329 , H01L2924/12041 , H01L2924/14 , H01L2924/18161 , H01L2924/3511 , H01L2924/00
摘要： A method for providing an underfill material on an integrated circuit chip at the wafer level. The wafer (10) typically contains one or more integrated circuit chips (12), and each integrated circuit chip typically has a plurality of solder bumps (34) on its active surface. The wafer is first diced (22) on the active surface side to form channels (38) that will ultimately define the edges (39) of each individual integrated circuit chip, the dicing being of such a depth that it only cuts part-way through the wafer. The front side (36) of the wafer is then coated (24) with an underfill material (40). Generally, a portion (45) of each solder bump remains uncoated, but in certain cases the bumps can be completely covered. The back side of the wafer is then lapped, ground, polished or otherwise treated (26) so as to remove material down to the level of the previously diced channels. This reduction in the thickness of the wafer causes the original diced channels to now extend completely from the front side to the back side of the wafer. The wafer is then singulated (28) by cutting the underfill material (92) that was deposited in the channels during the coating step, so that the integrated circuit chip (12) is released from the wafer, and the underfill material that was coated on the active side remains affixed to the active surface of each individual integrated circuit chip.
摘要翻译：一种用于在晶片级的集成电路芯片上提供底部填充材料的方法。晶片（10）通常包含一个或多个集成电路芯片（12），并且每个集成电路芯片在其有源表面上通常具有多个焊料凸块（34）。晶片首先在有源表面侧切割（22）以形成最终限定每个单独的集成电路芯片的边缘（39）的通道（38），切割具有这样的深度，使得其仅切割晶圆。然后用底部填充材料（40）涂覆（24）晶片的前侧（36）。通常，每个焊料凸块的一部分（45）保持未涂覆，但在某些情况下，凸块可被完全覆盖。然后将晶片的背面研磨，研磨，抛光或以其他方式处理（26），以便将材料移除到先前切割的通道的水平。晶片厚度的这种减小使得原来的切割通道现在完全从晶片的正面延伸到背面。然后通过切割在涂布步骤期间沉积在通道中的底部填充材料（92）将晶片分割（28），使得集成电路芯片（12）从晶片释放，并将涂覆的底部填充材料有源侧保持固定到每个单独的集成电路芯片的有源表面。

6. 发明授权

US06891991B2 Optical path method and apparatus 有权
标题翻译：光路方法和装置
公开(公告)号：US06891991B2
公开(公告)日：2005-05-10
申请号：US10413644
申请日：2003-04-15
申请人： Tomasz Klosowiak , Robert Lempkowski , Keryn K. Lian
发明人： Tomasz Klosowiak , Robert Lempkowski , Keryn K. Lian
IPC分类号： G02B6/35
CPC分类号： G02B6/3584 , G02B6/3508 , G02B6/353 , G02B6/355 , G02B6/3552 , G02B6/357 , G02B6/3594
摘要： A mesoscale micro electro-mechanical systems (MEMS) structure comprises an optical interface member (18) that moves with a pivoting member (15). Such movement serves to occlude and/or to complete an optical signal pathway (19).
摘要翻译：中尺度微电子机械系统（MEMS）结构包括与枢转构件（15）一起移动的光学接口构件（18）。这种移动用于闭塞和/或完成光信号通路（19）。

7. 发明授权

US5276418A Flexible substrate electronic assembly 失效
标题翻译：柔性基板电子组件
公开(公告)号：US5276418A
公开(公告)日：1994-01-04
申请号：US675045
申请日：1991-03-25
申请人： Tomasz Klosowiak , Sanjar Ghaem
发明人： Tomasz Klosowiak , Sanjar Ghaem
IPC分类号： H05K1/05 , H05K1/11 , H05K1/14 , H05K1/18 , H05K3/00 , H05K3/40 , H05K5/00 , H05K7/14 , H01H9/02
CPC分类号： H05K5/006 , H05K1/14 , H05K1/189 , H05K7/1417 , H05K1/05 , H05K1/117 , H05K1/118 , H05K2201/042 , H05K2201/053 , H05K2201/09081 , H05K2201/10189 , H05K2201/10363 , H05K2201/2009 , H05K3/0058 , H05K3/40
摘要： A unitary flexible substrate has three planar areas with components and conductors carried thereon. The substrate is folded to provide a subassembly with a compact packaging factor such that each planar area is in a different parallel plane. Two conductor-carrying projections of the substrate extend from different end portions of the substrate to free distal ends of the projections which are positioned adjacent to each other. The projection conductors, at the projection distal ends, are soldered to each other to provide a more direct, low resistance electrical connection between conductors on the substrate end portions. Heat sink rigidizer plates are attached to each of the three planar substrate portions. One rigidizer plate is thermally and planarly coupled to a metal heat sink cover of a protective housing for the folded subassembly. The other rigidizer plates are planarly bonded to each other to form a unitary support structure for two of the planar substrate portions.
摘要翻译：单一柔性基板具有三个平面区域，其上承载有部件和导体。折叠基板以提供具有紧凑包装因子的子组件，使得每个平面区域处于不同的平行平面。基板的两个导体承载突起从基板的不同端部延伸到彼此相邻定位的凸起的自由远端。在突出的远端处的投影导体彼此焊接，以在基底端部的导体之间提供更直接，低电阻的电连接。散热刚性板连接到三个平面基板部分中的每一个。一个刚性板被热平面地耦合到用于折叠子组件的保护壳体的金属散热器盖。其他刚性板彼此平面地接合以形成用于两个平面基板部分的整体支撑结构。

8. 发明申请

US20070039503A1 Method to facilitate provision of an energizable design image 审中-公开
标题翻译：方便提供可激励的设计图像
公开(公告)号：US20070039503A1
公开(公告)日：2007-02-22
申请号：US11207687
申请日：2005-08-18
申请人： Tomasz Klosowiak , Krishna Kalyanasundaram , Jie Zhang , Daniel Gamota , Krishna Jonnalagadda
发明人： Tomasz Klosowiak , Krishna Kalyanasundaram , Jie Zhang , Daniel Gamota , Krishna Jonnalagadda
IPC分类号： B41F33/00
CPC分类号： B41M7/00 , B41P2200/00 , B41P2200/13 , B41P2200/40 , H01L51/0005 , H01L51/0022
摘要： An energizable design image portion of a provided design pattern (101) is printed (103) on a provided substrate (101) using a functional ink comprised of at least one energy emissive material. A passive design image portion of that design pattern is then also printed (104) on that substrate using at least one graphic arts ink. In a preferred embodiment this process (100) further provides for printing (105) electrically conductive electrodes on the substrate to permit selective energization of the energy emissive material to thereby induce illumination of the energizable design image portion of the design pattern.
摘要翻译：使用由至少一种能量发射材料构成的功能油墨，将所提供的设计图案（101）的可激发的设计图像部分印刷（103）在所提供的基板（101）上。然后使用至少一个图形油墨在该基板上印刷（104）该设计图案的被动设计图像部分。在优选实施例中，该工艺（100）进一步提供在衬底上印刷（105）导电电极，以允许能量发射材料的选择性通电，从而引起设计图案的可激励设计图像部分的照明。

9. 发明申请

US20060006817A1 AC powered self organizing wireless node 审中-公开
标题翻译：交流供电自组织无线节点
公开(公告)号：US20060006817A1
公开(公告)日：2006-01-12
申请号：US11126686
申请日：2005-05-11
申请人： Marc Chason , Janice Danvir , Katherine Devanie , David Hume , Tomasz Klosowiak , Kevin McDunn
发明人： Marc Chason , Janice Danvir , Katherine Devanie , David Hume , Tomasz Klosowiak , Kevin McDunn
IPC分类号： G05F1/00 , H05B37/02
CPC分类号： H04W52/0296 , H04W84/18 , H04W88/02 , Y02D70/144 , Y02D70/162
摘要： An alternating current (AC) powered self organizing wireless node (100, 400, 600) includes a self organizing wireless receiver-transmitter (115), an AC branch connection (105), an AC to direct current (DC) converter (110), a secondary power function (120), and a housing (150). The self organizing wireless receiver-transmitter can communicate information throughout a network of compatible self organizing nodes solely using radio transmission to and reception from nearby self-organizing nodes. The secondary power function can couple power to the AC to DC converter for powering the self organizing wireless receiver-transmitter when AC power is not provided. The AC powered self organizing wireless node is designed and fabricated for agency certification. The AC powered self organizing wireless node may include one or more sensors (125), sensor inputs (135), transducers (130), or control outputs (155).
摘要翻译：交流（AC）供电的自组织无线节点（100,400,600）包括自组织无线接收器 - 发射器（115），AC分支连接（105），AC至直流（DC）转换器（110），辅助电力功能（120）和壳体（150）。自组织无线接收机 - 发射机可以通过使用到附近的自组织节点的无线电传输和从其接收的相容自组织节点的网络来传送信息。辅助电源功能可以连接AC到DC转换器的电源，以便在不提供交流电源时给自组织无线接收器 - 发射器供电。交流供电的自组织无线节点是为代理认证设计和制造的。 AC供电的自组织无线节点可以包括一个或多个传感器（125），传感器输入（135），换能器（130）或控制输出（155）。

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