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    • 1. 发明授权
    • Light absorption modulator and integrated semiconductor laser and
modulator
    • 光吸收调制器和集成半导体激光器和调制器
    • US5771257A
    • 1998-06-23
    • US774018
    • 1996-12-26
    • Tohru TakiguchiEitaro Ishimura
    • Tohru TakiguchiEitaro Ishimura
    • G02F1/015G02F1/017H01S5/026H01S5/30H01S5/34H01S5/343H01S3/19G02F1/01G02F1/03H01S3/10
    • B82Y20/00G02F1/01708H01S5/0265G02F2001/0156H01S5/3054H01S5/3409H01S5/34306H01S5/3434
    • A light absorption modulator includes a semiconductor substrate of a first conductivity type; a first cladding layer of the first conductivity type disposed on the substrate; an optical waveguide disposed on the first cladding layer and including a multiple quantum well optical waveguide layer through which light travels and first and second light confinement layers respectively disposed on opposed surfaces of the optical waveguide layer to confine light in the optical waveguide layer; and a second cladding layer of a second conductivity type, opposite the first conductivity type, disposed on the optical waveguide, one of the first and second cladding layers being n type, the one of the first and second light confinement layers that contacts the n type cladding layer being p type, and light traveling through the optical waveguide layer being modulated by applying an electric field to the optical waveguide layer. The electric field strength in the multiple quantum well optical waveguide layer when no reverse bias is applied to the modulator is reduced, whereby the rise time of the optical output from the modulator is reduced.
    • 光吸收调制器包括第一导电类型的半导体衬底; 设置在基板上的第一导电类型的第一包层; 光波导,其设置在所述第一包层上,并且包括光行进的多量子阱光波导层,以及分别设置在所述光波导层的相对表面上以将光限制在所述光波导层中的第一和第二光限制层; 和与所述第一导电类型相反的第二导电类型的第二包覆层,设置在所述光波导上,所述第一和第二包层中的一个为n型,所述第一和第二限光层中的一个接触所述n型 包层为p型,通过对光波导层施加电场来调制通过光波导层的光。 当没有反向偏置被施加到调制器时,多量子阱光波导层中的电场强度降低,从而调制器的光输出的上升时间减小。
    • 5. 发明授权
    • Semiconductor photoreceptor device
    • 半导体感光器件
    • US07875943B2
    • 2011-01-25
    • US12475668
    • 2009-06-01
    • Masaharu NakajiEitaro Ishimura
    • Masaharu NakajiEitaro Ishimura
    • H01L31/0232
    • G02B6/122H01L31/02327H01L31/105
    • A semiconductor light detecting device includes an n-contact layer selectively disposed on an Fe—InP substrate. An optical waveguide layer is disposed on the n-contact layer and includes an n-cladding layer, a light absorption layer, and a p-cladding layer, laminated on one another over the n-contact layer, in that order. An Fe—InP current blocking layer is disposed on the n-cladding layer such that sides of the optical waveguide layer are buried in the Fe—InP current blocking layer. A p-electrode includes a contact electrode electrically connected to the p-cladding layer of the optical waveguide layer, a lead-out electrode portion extending on a side wall of the current blocking layer from the contact electrode and extending on the Fe—InP substrate, and an electrode pad disposed on a surface of the Fe—InP substrates with an SiN film between the electrode pad and the surface of the Fe—InP substrate and connected to the lead-out electrode portion.
    • 半导体光检测装置包括选择性地设置在Fe-InP衬底上的n接触层。 光波导层设置在n接触层上,并且包括依次层叠在n接触层上的n包层,光吸收层和p包覆层。 在n包层上设置Fe-InP电流阻挡层,使得光波导层的侧面埋设在Fe-InP电流阻挡层中。 p电极包括与光波导层的p包层电连接的接触电极,在接触电极的电流阻挡层的侧壁上延伸并在Fe-InP衬底上延伸的引出电极部 以及电极焊盘,其在所述电极焊盘与所述Fe-InP衬底的表面之间,在所述Fe-InP衬底的表面上设置有SiN膜,并且与所述引出电极部连接。
    • 6. 发明申请
    • SEMICONDUCTOR PHOTODETECTOR
    • SEMICONDUCTOR PHOTODETEOROR
    • US20100006967A1
    • 2010-01-14
    • US12327861
    • 2008-12-04
    • Eitaro IshimuraMasaharu Nakaji
    • Eitaro IshimuraMasaharu Nakaji
    • H01L31/0232
    • H01L31/02327H01L31/02162H01L31/0304H01L31/03046H01L31/105Y02E10/544
    • A semiconductor photodetector comprises: a semiconductor substrate; a first multilayer reflective layer on a first surface of the semiconductor substrate and including semiconductor layers; a first optically-resonant layer on the first multilayer reflective layer; a second multilayer reflective layer on the first optically-resonant layer and including semiconductor layers; a light absorbing layer on the second multilayer reflective layer; a reflective film on the light absorbing layer; and an antireflective film on a second surface of the semiconductor substrate. The first optically-resonant layer has a larger thickness than the semiconductor layers of the first and second multilayer reflective layers. The combined optical thickness of the layers between the second multilayer reflective layer and the reflective film is not equal to the optical thickness of the first optically-resonant layer.
    • 半导体光电检测器包括:半导体衬底; 半导体衬底的第一表面上的第一多层反射层,包括半导体层; 第一多层反射层上的第一光学共振层; 在所述第一光学谐振层上的第二多层反射层,并且包括半导体层; 在所述第二多层反射层上的光吸收层; 光吸收层上的反射膜; 以及在半导体衬底的第二表面上的抗反射膜。 第一光学共振层具有比第一和第二多层反射层的半导体层更大的厚度。 第二多层反射层和反射膜之间的层的组合光学厚度不等于第一光谐振层的光学厚度。
    • 8. 发明申请
    • SEMICONDUCTOR PHOTORECEPTOR DEVICE
    • US20090243013A1
    • 2009-10-01
    • US12475668
    • 2009-06-01
    • Masaharu NakajiEitaro Ishimura
    • Masaharu NakajiEitaro Ishimura
    • H01L31/0232
    • G02B6/122H01L31/02327H01L31/105
    • A semiconductor light detecting device includes an n-contact layer selectively disposed on an Fe—InP substrate. An optical waveguide layer is disposed on the n-contact layer and includes an n-cladding layer, a light absorption layer, and a p-cladding layer, laminated on one another over the n-contact layer, in that order. An Fe—InP current blocking layer is disposed on the n-cladding layer such that sides of the optical waveguide layer are buried in the Fe—InP current blocking layer. A p-electrode includes a contact electrode electrically connected to the p-cladding layer of the optical waveguide layer, a lead-out electrode portion extending on a side wall of the current blocking layer from the contact electrode and extending on the Fe—InP substrate, and an electrode pad disposed on a surface of the Fe—InP substrates with an SiN film between the electrode pad and the surface of the Fe—InP substrate and connected to the lead-out electrode portion.
    • 半导体光检测装置包括选择性地设置在Fe-InP衬底上的n接触层。 光波导层设置在n接触层上,并且包括依次层叠在n接触层上的n包层,光吸收层和p包覆层。 在n包层上设置Fe-InP电流阻挡层,使得光波导层的侧面埋设在Fe-InP电流阻挡层中。 p电极包括与光波导层的p包层电连接的接触电极,在接触电极的电流阻挡层的侧壁上延伸并在Fe-InP衬底上延伸的引出电极部 以及电极焊盘,其在所述电极焊盘与所述Fe-InP衬底的表面之间,在所述Fe-InP衬底的表面上设置有SiN膜,并且与所述引出电极部连接。
    • 10. 发明授权
    • Avalanche photodiode
    • 雪崩光电二极管
    • US07187013B2
    • 2007-03-06
    • US11136466
    • 2005-05-25
    • Masaharu NakajiEitaro IshimuraEiji YagyuNobuyuki Tomita
    • Masaharu NakajiEitaro IshimuraEiji YagyuNobuyuki Tomita
    • H01L31/072H01L31/109H01L31/0328H01L31/0336
    • H01L31/03046H01L31/107H01L31/1075Y02E10/544
    • An avalanche photodiode has improved low-noise characteristics, high-speed response characteristics, and sensitivity. The avalanche photodiode includes a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, a semiconductor multiplication layer interposed between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, and a semiconductor light-absorbing layer interposed between the semiconductor multiplication layer and the second conductivity type semiconductor layer. The avalanche photodiode further comprises a multiplication suppressing layer which suppresses multiplication of charge carriers in the semiconductor light-absorbing layer, has a thickness of 0.6 μm or less, and is located between the semiconductor light-absorbing layer and the second conductivity type semiconductor layer. The thickness of the semiconductor light-absorbing layer is 0.5 μm or more.
    • 雪崩光电二极管具有改进的低噪声特性,高速响应特性和灵敏度。 雪崩光电二极管包括第一导电类型半导体层,第二导电类型半导体层,介于第一导电类型半导体层和第二导电类型半导体层之间的半导体倍增层,以及插入在半导体乘法 层和第二导电类型半导体层。 雪崩光电二极管还包括抑制半导体光吸收层中的电荷载流子的倍增的增殖抑制层,其厚度为0.6μm以下,位于半导体光吸收层与第二导电型半导体层之间。 半导体光吸收层的厚度为0.5μm以上。