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1. 发明授权

US09089086B2 Apparatus for mounting electronic component 有权
标题翻译：电子部件安装装置
公开(公告)号：US09089086B2
公开(公告)日：2015-07-21
申请号：US13225902
申请日：2011-09-06
申请人： Tohru Harada , Mitsuo Takeuchi , Hirokazu Yamanishi , Yoshiaki Yanagida , Toru Okada
发明人： Tohru Harada , Mitsuo Takeuchi , Hirokazu Yamanishi , Yoshiaki Yanagida , Toru Okada
IPC分类号： B23P19/00 , H05K13/04 , H01L23/00
CPC分类号： H05K13/0486 , H01L24/75 , H01L24/81 , Y10T29/49004 , Y10T29/53022
摘要： An apparatus for mounting an electronic component includes a heating head that moves relative to the electronic component placed on a printed board, inclines according to the inclination of the electronic component, comes into contact with the electronic component, and heats a joining material that joins the printed board and the electronic component; a first sensor that measures the position and the inclination of the heating head; a second sensor that measures the position and the inclination of the printed board; and, a control unit that calculates the position and the inclination of the electronic component based on a measurement result of the first sensor in a state where the heating head is in contact with the electronic component, and determines the melted state of the joining material based on the measurement result of the second sensor and the position and the inclination of the electronic component.
摘要翻译：一种用于安装电子部件的装置包括：相对于放置在印刷电路板上的电子部件移动的加热头，根据电子部件的倾斜倾斜与电子部件接触，并加热连接到电子部件的接合材料印刷电路板和电子元器件; 测量加热头的位置和倾斜度的第一传感器; 测量印刷板的位置和倾斜度的第二传感器; 以及控制单元，其基于在所述加热头与所述电子部件接触的状态下的所述第一传感器的测量结果来计算所述电子部件的位置和倾斜度，并且基于所述接合材料的熔融状态来确定关于第二传感器的测量结果以及电子部件的位置和倾斜度。

2. 发明申请

US20120060356A1 APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT 有权
标题翻译：用于安装电子元件的装置和方法
公开(公告)号：US20120060356A1
公开(公告)日：2012-03-15
申请号：US13225902
申请日：2011-09-06
申请人： Tohru Harada , Mitsuo Takeuchi , Hirokazu Yamanishi , Yoshiaki Yanagida , Toru Okada
发明人： Tohru Harada , Mitsuo Takeuchi , Hirokazu Yamanishi , Yoshiaki Yanagida , Toru Okada
IPC分类号： G01R31/28 , B23P21/00
CPC分类号： H05K13/0486 , H01L24/75 , H01L24/81 , Y10T29/49004 , Y10T29/53022
摘要： An apparatus for mounting an electronic component includes a heating head that moves relative to the electronic component placed on a printed board, inclines according to the inclination of the electronic component, comes into contact with the electronic component, and heats a joining material that joins the printed board and the electronic component; a first sensor that measures the position and the inclination of the heating head; a second sensor that measures the position and the inclination of the printed board; and, a control unit that calculates the position and the inclination of the electronic component based on a measurement result of the first sensor in a state where the heating head is in contact with the electronic component, and determines the melted state of the joining material based on the measurement result of the second sensor and the position and the inclination of the electronic component.
摘要翻译：一种用于安装电子部件的装置包括：相对于放置在印刷电路板上的电子部件移动的加热头，根据电子部件的倾斜倾斜与电子部件接触，并加热连接到电子部件的接合材料印刷电路板和电子元器件; 测量加热头的位置和倾斜度的第一传感器; 测量印刷板的位置和倾斜度的第二传感器; 以及控制单元，其基于在所述加热头与所述电子部件接触的状态下的所述第一传感器的测量结果来计算所述电子部件的位置和倾斜度，并且基于所述接合材料的熔融状态来确定关于第二传感器的测量结果以及电子部件的位置和倾斜度。

3. 发明申请

US20110120619A1 FILM STICKING DEVICE, FILM STICKING METHOD, AND ELECTRONIC PAPER MANUFACTURING METHOD 有权
标题翻译：电影胶卷装置，胶卷方法和电子纸制造方法
公开(公告)号：US20110120619A1
公开(公告)日：2011-05-26
申请号：US13020312
申请日：2011-02-03
申请人： Tohru Harada , Kazuhisa Mishima , Hirokazu Yamanishi , Yoshiaki Yanagida
发明人： Tohru Harada , Kazuhisa Mishima , Hirokazu Yamanishi , Yoshiaki Yanagida
IPC分类号： B32B37/02 , B32B38/18 , B32B38/04 , B32B37/10
CPC分类号： B29C65/524 , B29C65/02 , B29C65/1406 , B29C65/4835 , B29C65/4845 , B29C65/7847 , B29C66/1122 , B29C66/301 , B29C66/342 , B29C66/45 , B29C66/81422 , B29C66/81423 , B29C66/8362 , B29C66/9221 , B29C66/9231 , B29C66/92431 , B29C66/961 , B29K2105/0079 , B29K2995/0082 , B29L2016/00 , B32B37/003 , B32B37/0053 , B32B37/12 , B32B37/223 , B32B38/1858 , B32B38/1866 , B32B2457/20 , G02F1/1303 , G02F1/133305 , Y10T156/1052 , Y10T156/17
摘要： Disclosed is a film sticking device that sticks a first film substrate and a second film substrate together on a curved-surface shape. The film sticking device includes a mold having a curved attachment surface formed into a desired curved-surface shape; an attracting and holding unit capable of relatively moving on the curved attachment surface and having plural vacuum chambers on which an attracting surface for attracting and holding the second film substrate is provided; and a suctioning unit capable of separately applying suction processing to the plural vacuum chambers. The suctioning unit starts, as the attracting and holding unit moves, the suction processing of the vacuum chamber corresponding to a position opposing the second film substrate and sequentially stops, as the second film substrate is stuck to the first film substrate, the suction processing of the vacuum chamber corresponding to the stuck second film substrate.
摘要翻译：公开了一种胶片贴装装置，其以第一薄膜基板和第二薄膜基板一起弯曲成形。胶片贴附装置包括具有形成为期望的曲面形状的弯曲的附接表面的模具; 能够在弯曲的安装面上相对移动并具有多个真空室的吸引保持单元，在该真空室中设置有用于吸引和保持第二膜基板的吸附面; 以及能够对多个真空室分别进行吸引处理的吸引单元。当吸引保持单元移动时，抽吸单元开始与第二膜基板相对的位置对应的真空室的抽吸处理，并且随着第二膜基板粘贴到第一膜基板上而依次停止吸入处理真空室对应于粘附的第二膜基底。

4. 发明授权

US08163126B2 Film sticking device, film sticking method, and electronic paper manufacturing method 有权
标题翻译：胶片贴膜装置，胶片贴附方法以及电子纸制造方法
公开(公告)号：US08163126B2
公开(公告)日：2012-04-24
申请号：US13020312
申请日：2011-02-03
申请人： Tohru Harada , Kazuhisa Mishima , Hirokazu Yamanishi , Yoshiaki Yanagida
发明人： Tohru Harada , Kazuhisa Mishima , Hirokazu Yamanishi , Yoshiaki Yanagida
IPC分类号： B29C65/00 , B29C65/10 , B29C45/00 , B29C47/00 , B29C43/02 , B29C49/00 , B29C51/00 , B32B37/00 , B44C1/17 , B23K37/00 , B30B5/02 , B30B5/04 , B30B15/34 , B29D24/00 , B29D29/00 , B28B21/36 , B28B11/08 , A01J21/00 , A01J25/12 , A21C3/00 , A21C11/00 , A23G1/20 , A23G3/02 , A23P1/00 , B29C55/28
CPC分类号： B29C65/524 , B29C65/02 , B29C65/1406 , B29C65/4835 , B29C65/4845 , B29C65/7847 , B29C66/1122 , B29C66/301 , B29C66/342 , B29C66/45 , B29C66/81422 , B29C66/81423 , B29C66/8362 , B29C66/9221 , B29C66/9231 , B29C66/92431 , B29C66/961 , B29K2105/0079 , B29K2995/0082 , B29L2016/00 , B32B37/003 , B32B37/0053 , B32B37/12 , B32B37/223 , B32B38/1858 , B32B38/1866 , B32B2457/20 , G02F1/1303 , G02F1/133305 , Y10T156/1052 , Y10T156/17
摘要： Disclosed is a film sticking device that sticks a first film substrate and a second film substrate together on a curved-surface shape. The film sticking device includes a mold having a curved attachment surface formed into a desired curved-surface shape; an attracting and holding unit capable of relatively moving on the curved attachment surface and having plural vacuum chambers on which an attracting surface for attracting and holding the second film substrate is provided; and a suctioning unit capable of separately applying suction processing to the plural vacuum chambers. The suctioning unit starts, as the attracting and holding unit moves, the suction processing of the vacuum chamber corresponding to a position opposing the second film substrate and sequentially stops, as the second film substrate is stuck to the first film substrate, the suction processing of the vacuum chamber corresponding to the stuck second film substrate.
摘要翻译：公开了一种胶片贴装装置，其以第一薄膜基板和第二薄膜基板一起弯曲成形。胶片贴附装置包括具有形成为期望的曲面形状的弯曲的附接表面的模具; 能够在弯曲的安装面上相对移动并具有多个真空室的吸引保持单元，在该真空室中设置有用于吸引和保持第二膜基板的吸附面; 以及能够对多个真空室分别进行吸引处理的吸引单元。当吸引保持单元移动时，抽吸单元开始与第二膜基板相对的位置对应的真空室的抽吸处理，并且随着第二膜基板粘贴到第一膜基板上而依次停止吸入处理真空室对应于粘附的第二膜基底。

5. 发明授权

US08584337B2 Electronic component repair method 有权
标题翻译：电子元件维修方法
公开(公告)号：US08584337B2
公开(公告)日：2013-11-19
申请号：US13196437
申请日：2011-08-02
申请人： Tohru Harada , Mitsuo Takeuchi , Yoshiaki Yanagida
发明人： Tohru Harada , Mitsuo Takeuchi , Yoshiaki Yanagida
IPC分类号： B23P9/00
CPC分类号： H05K13/0486
摘要： An electronic component repair method for removing an electronic component soldered on a substrate, the method includes: mounting a heat transfer plate on the electronic component to be removed, the heat transfer plate being formed by bonding a plurality of heat transfer members via a heat insulating member, heating the heat transfer plate mounted on the electronic component by a heating unit, the heating unit heating individually each of the heat transfer members by different heat amount; and removing the electronic component from the substrate after the heating.
摘要翻译：一种用于去除焊接在基板上的电子部件的电子部件修复方法，所述方法包括：将传热板安装在要移除的电子部件上，所述传热板通过绝热结合多个传热部件而形成加热单元通过加热单元加热安装在电子部件上的传热板，加热单元通过不同的热量单独加热每个传热部件; 并且在加热之后从基板去除电子部件。

6. 发明申请

US20120090195A1 APPARATUS AND METHOD FOR HEATING ELECTRONIC COMPONENT 审中-公开
标题翻译：用于加热电子元件的装置和方法
公开(公告)号：US20120090195A1
公开(公告)日：2012-04-19
申请号：US13232655
申请日：2011-09-14
申请人： Mitsuo TAKEUCHI , Tohru Harada , Toru Okada
发明人： Mitsuo TAKEUCHI , Tohru Harada , Toru Okada
IPC分类号： F26B3/02 , F26B25/08
CPC分类号： H05K13/0486 , H05K3/225 , H05K3/3494 , H05K2201/10734 , H05K2203/176
摘要： An apparatus for heating an electronic component, the apparatus includes a table on which a printed board is placed, a heating head having a contact surface that comes into contact with the upper surface of a rectangular electronic component mounted on the upper surface of the printed board, a discharge portion that jets heated air; and a first passage that guides the air discharged from the discharge portion to the four vertexes of the electronic component.
摘要翻译：一种用于加热电子部件的装置，该装置包括一个放置有印刷电路板的工作台，具有与安装在印刷电路板的上表面上的矩形电子部件的上表面接触的接触面的加热头，喷射热空气的排出部分; 以及将从排出部排出的空气引导到电子部件的四个顶点的第一通路。

7. 发明授权

US08023112B2 Alignment apparatus and fabrication apparatus for planar member and alignment method and fabrication method for planar member 失效
标题翻译：平面构件对准装置及制造装置及平面构件的对准方法及制造方法
公开(公告)号：US08023112B2
公开(公告)日：2011-09-20
申请号：US12882812
申请日：2010-09-15
申请人： Tohru Harada , Kazuhisa Mishima , Hirokazu Yamanishi
发明人： Tohru Harada , Kazuhisa Mishima , Hirokazu Yamanishi
IPC分类号： G01B11/00
CPC分类号： G03F1/00 , G03F9/7011 , G03F9/7076 , G03F9/7088 , H01L21/67092 , H01L21/681
摘要： An alignment apparatus for a planar member includes, an image capturing unit which captures an image of a rotationally asymmetrical alignment mark provided on the planar member, a position detection unit which detects a position of the alignment mark from the image, a position adjusting unit which adjusts, based on the detected position of the alignment mark, the position of the planar member relative to a reference position, and an orientation detection unit which detects an orientation of the planar member based on the rotational asymmetry of the alignment mark captured in the image.
摘要翻译：一种用于平面构件的对准装置包括：捕获设置在平面构件上的旋转不对称对准标记的图像的图像捕获单元，检测来自图像的对准标记位置的位置检测单元，位置调整单元，基于对准标记的检测位置调整平面构件相对于基准位置的位置;以及姿态检测单元，其基于在图像中捕获的对准标记的旋转不对称性来检测平面构件的取向。

8. 发明申请

US20110001974A1 ALIGNMENT APPARATUS AND FABRICATION APPARATUS FOR PLANAR MEMBER AND ALIGNMENT METHOD AND FABRICATION METHOD FOR PLANAR MEMBER 失效
标题翻译：平面成员的对准装置和制造装置及其对准方法和制造方法
公开(公告)号：US20110001974A1
公开(公告)日：2011-01-06
申请号：US12882812
申请日：2010-09-15
申请人： Tohru Harada , Kazuhisa Mishima , Hirokazu Yamanishi
发明人： Tohru Harada , Kazuhisa Mishima , Hirokazu Yamanishi
IPC分类号： G01B11/00
CPC分类号： G03F1/00 , G03F9/7011 , G03F9/7076 , G03F9/7088 , H01L21/67092 , H01L21/681
摘要： An alignment apparatus for a planar member includes, an image capturing unit which captures an image of a rotationally asymmetrical alignment mark provided on the planar member, a position detection unit which detects a position of the alignment mark from the image, a position adjusting unit which adjusts, based on the detected position of the alignment mark, the position of the planar member relative to a reference position, and an orientation detection unit which detects an orientation of the planar member based on the rotational asymmetry of the alignment mark captured in the image.
摘要翻译：一种用于平面构件的对准装置包括：捕获设置在平面构件上的旋转非对称对准标记的图像的图像捕获单元，检测来自图像的对准标记位置的位置检测单元，位置调整单元，基于对准标记的检测位置调整平面构件相对于基准位置的位置;以及姿态检测单元，其基于在图像中捕获的对准标记的旋转不对称性来检测平面构件的取向。

9. 发明申请

US20110113624A1 SHEET BONDING DEVICE AND SHEET BONDING METHOD 审中-公开
标题翻译：表面结合装置和薄片粘合方法
公开(公告)号：US20110113624A1
公开(公告)日：2011-05-19
申请号：US12944226
申请日：2010-11-11
申请人： Tohru Harada
发明人： Tohru Harada
IPC分类号： H01R43/00 , B23P19/00
CPC分类号： B32B38/1841 , B32B2457/00 , Y10T29/49117 , Y10T29/5313
摘要： A sheet bonding device includes a detection unit that detects first position data of first marks in a first sheet provided with a first electrode, and second position data of second marks in a second sheet provided with a second electrode, a generation unit that generates third shape data from the first shape data based on a result of comparison of the first position data and the third position data, and generates fourth shape data from the second shape data based on a result of comparison of the second position data and the fourth position data, and a decision unit that changes relative positions of the third shape data and the fourth shape data, and determines a first relative position of the first electrode against the second electrode at which an area of overlapping in plan view of the third shape data and the fourth shape data is maximized.
摘要翻译：片材接合装置包括检测单元，其检测设置有第一电极的第一片材中的第一标记的第一位置数据，以及检测设置有第二电极的第二片材中的第二标记的第二位置数据，产生第三形状的生成单元基于第一位置数据和第三位置数据的比较结果，来自第一形状数据的数据，并且基于第二位置数据和第四位置数据的比较结果，从第二形状数据生成第四形状数据，以及决定单元，其改变第三形状数据和第四形状数据的相对位置，并且确定第一电极抵靠第二电极的第一相对位置，在该第二电极处第三形状数据和第四形状数据的平面图中的重叠区域形状数据最大化。

10. 发明授权

US08124031B2 Discharge volume control method, discharge pressure control method, and microbody forming method 有权
公开(公告)号：US08124031B2
公开(公告)日：2012-02-28
申请号：US11785431
申请日：2007-04-17
申请人： Tohru Harada , Akihiko Yabuki , Kiyoshi Taninaka
发明人： Tohru Harada , Akihiko Yabuki , Kiyoshi Taninaka
IPC分类号： B01L3/02
CPC分类号： C12M35/00 , Y10T137/0396 , Y10T137/0971 , Y10T137/3115 , Y10T137/85978
摘要： A second valve is opened to combine an injection-pressure generating pressure with a maintaining pressure into an injection pressure. After the injection pressure is applied to a capillary to cause discharge of an object therefrom, an output pressure of a regulator is set to the injection pressure. Then, a first valve is opened to reapply the injection pressure to the capillary. The second valve is opened to combine a maintaining-pressure generating pressure with the injection pressure into the maintaining pressure. After the maintaining pressure is applied to the capillary to terminate the discharge of the object, the output pressure of the regulator is set to the maintaining pressure. Then, the first valve is opened to reapply the maintaining pressure to the capillary.

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