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1. 发明专利

JP2010131618A METHOD OF MANUFACTURING Bi-CONTAINING SOLDER FOIL, Bi-CONTAINING SOLDER FOIL, JOINED BODY AND POWER SEMICONDUCTOR MODULE 有权
标题翻译：双包装机，双包装机，接合体和功率半导体模块的制造方法
公开(公告)号：JP2010131618A
公开(公告)日：2010-06-17
申请号：JP2008308653
申请日：2008-12-03
申请人： Tohoku Univ , Toyota Central R&D Labs Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 国立大学法人東北大学 , 株式会社豊田中央研究所
发明人： YAMADA YASUSHI , ISHIDA KIYOHITO , ONUMA IKUO , TAKAKU YOSHIKAZU , NAKAGAWA IKURO , ATSUMI TAKASHI
IPC分类号： B23K35/40 , B22F1/00 , B22F3/18 , B23K35/14 , B23K35/26 , C22C9/05 , C22C12/00 , H01L23/36 , H01L23/373 , H01L25/07 , H01L25/18 , H05K3/34
CPC分类号： H01L24/27 , H01L24/29 , H01L2224/83101 , H01L2924/351 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing Bi-containing solder foil and Bi-containing solder foil, and to provide a joined body that is highly heat resistant and accurately welded and a power semiconductor module. SOLUTION: In the method of manufacturing Bi-containing solder foil, powder of a solder material containing bismuth (Bi) is formed into a sheet by a powder rolling method. The ratio of a long side and a short side in the powder of the solder material is suitably ≥1.2 and ≤3.0 while the mean particle diameter of the powder is suitably ≥5 μm and ≤200 μm. The rolling by the powder rolling method is desirably performed at ≥-20°C and ≤269°C. Also, in the joined body and the power semiconductor module, the Bi-containing solder foil is used in the weld zone. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造含Bi焊料箔和Bi含有焊料箔的方法，并提供高耐热和精确焊接的接合体和功率半导体模块。解决方案：在制造含Bi焊料箔的方法中，通过粉末轧制法将含有铋（Bi）的焊料的粉末形成为片材。焊料的粉末中的长边和短边的比率适当地≥1.2和≤3.0，而粉末的平均粒径适当地≥5μm和≤200μm。通过粉末轧制法的轧制优选在≥-20℃和≤269℃下进行。此外，在接合体和功率半导体模块中，在焊接区域中使用含Bi焊料箔。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2009129983A Junction structure and method of manufacturing the same, and power semiconductor module and method of manufacturing the same 审中-公开
标题翻译：结构及其制造方法和功率半导体模块及其制造方法
公开(公告)号：JP2009129983A
公开(公告)日：2009-06-11
申请号：JP2007300793
申请日：2007-11-20
申请人： Tohoku Univ , Toyota Central R&D Labs Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 国立大学法人東北大学 , 株式会社豊田中央研究所
发明人： YAMADA YASUSHI , YAGI YUJI , TAKAKU YOSHIKAZU , ONUMA IKUO , ISHIDA KIYOHITO , ATSUMI TAKASHI , NAKAGAWA IKURO , SHIRAI MIKIO
IPC分类号： H01L21/52 , H01L23/34
CPC分类号： H01L24/83 , H01L2224/83101 , H01L2924/351 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a junction structure with a member junctioned uniformly owing to improved wetting properties when a solder material mainly comprising zinc is used, and to provide a power semiconductor module and method of manufacturing the same. SOLUTION: The junction structure 300 has a first member 101 and a second member 102. The part between the first member 101 and the second member 102 is junctioned by the solder material 50 mainly comprising zinc. Each surface to be junctioned of the first member 101 and the second member 102 includes nickel layers 111, 112. Further the surfaces of the nickel layers 111, 112 comprise metal surface layers 121, 122 having high reaction properties with zinc and generating the alloy with zinc. The metal surface layers 121, 122 are eliminated at the junction surface after the junction. The first member 101 and the second member 102 correspond to the power semiconductor device and an insulating substrate, or the insulating substrate and a heat sink. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种连接结构，其中当使用主要包含锌的焊料材料时，由于改善的润湿性能均匀地连接部件，并提供功率半导体模块及其制造方法。结合结构300具有第一构件101和第二构件102.第一构件101和第二构件102之间的部分由主要包含锌的焊料材料50连接。要与第一构件101和第二构件102接合的每个表面包括镍层111,112。此外，镍层111,112的表面包括与锌具有高反应性能的金属表面层121,122，并且与锌。金属表面层121,122在结之后的接合表面处被去除。第一构件101和第二构件102对应于功率半导体器件和绝缘基板，或者绝缘基板和散热器。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2008270353A Power semiconductor module 有权
标题翻译：功率半导体模块
公开(公告)号：JP2008270353A
公开(公告)日：2008-11-06
申请号：JP2007108311
申请日：2007-04-17
申请人： Tohoku Univ , Toyota Central R&D Labs Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 国立大学法人東北大学 , 株式会社豊田中央研究所
发明人： YAGI YUJI , YAMADA YASUSHI , ATSUMI TAKASHI , NAKAGAWA IKURO , SHIRAI MIKIO , ISHIDA KIYOHITO , ONUMA IKUO , TAKAKU YOSHIKAZU
IPC分类号： H01L25/07 , H01L23/40 , H01L25/18
CPC分类号： H01L23/3735 , H01L23/473 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/072 , H01L2224/29111 , H01L2224/29113 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2224/83447 , H01L2224/838 , H01L2224/83805 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/1579 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/01013 , H01L2924/01025 , H01L2924/01083 , H01L2924/3512 , H01L2924/00015 , H01L2224/83205
摘要： PROBLEM TO BE SOLVED: To provide a power semiconductor module which does not easily permit generation of a fault such as crack and break. SOLUTION: A power semiconductor module is formed by bonding a couple of components with a Bi solder material and this module is provided with a Cu layer at the surfaces to be bonded with a Bi solder material of the couple of components. The couple of components as the components to be bonded are formed by combining a semiconductor element 20, and an insulating material 30 or the insulating material 30 and a heat sink 40. The insulating material is constituted with a laminated material of Cu34/SiNx32/Cu36. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供不容易产生断裂和断裂等故障的功率半导体模块。解决方案：功率半导体模块通过用Bi焊料材料结合一对部件而形成，并且该模块在与两个部件的Bi焊料材料粘合的表面处设置有Cu层。通过组合半导体元件20，绝缘材料30或绝缘材料30和散热器40来形成要结合的部件的一对部件。绝缘材料由Cu34 / SiNx32 / Cu36的层叠材料构成。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2013020995A Reactor 审中-公开
标题翻译：反应堆
公开(公告)号：JP2013020995A
公开(公告)日：2013-01-31
申请号：JP2011150553
申请日：2011-07-07
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所 , Toyota Motor Corp , トヨタ自動車株式会社
发明人： URATA SHINYA , NAKAI HIDEO , FUMA HIROO , SHINOHARA NOBUKI , NOBUSAKA MAO , ATSUMI TAKASHI
IPC分类号： H01F37/00 , H01F27/24
CPC分类号： Y02T10/6204
摘要： PROBLEM TO BE SOLVED: To reduce the loss in a low load region and to minimize lowering of the inductance for a current load in a high load region of a reactor with a low cost configuration while preventing excessive increase in the size.SOLUTION: The reactor 22 includes an outer core 26, an inner core 24 disposed on the inside of the outer core 26 via a gap Gi therebetween, and an inner coil 10 and an outer coil 12 interposed between the center side part and the outside part of the inner core 24 and the outer core 26. Magnetic resistance of the outer core 26 is set higher than that of the inner core 24 in at least a partial operation region, and the inner core 24 is composed of an inner magnetic material having an iron loss smaller than that of an outer magnetic material composing the outer core 26.
摘要翻译：要解决的问题：为了减小低负载区域的损耗，并且尽可能减小在低成本构造的反应堆的高负载区域中的电流负载的电感的降低，同时防止尺寸的过度增加。解决方案：反应器22包括外芯26，内芯24经由其间的间隙Gi设置在外芯26的内部，内线圈10和外线圈12插入在中心侧部分和内芯24的外侧部分和外芯26.外芯26的磁阻在至少部分操作区域中设定为高于内芯24的磁阻，内芯24由内磁芯24构成铁损小于构成外芯26的外磁性材料的铁损的材料。（C）2013，JPO＆INPIT

5. 发明专利

JP2011203042A Simulation method utilizing curing rule 审中-公开
标题翻译：使用固化规则的模拟方法
公开(公告)号：JP2011203042A
公开(公告)日：2011-10-13
申请号：JP2010069475
申请日：2010-03-25
申请人： Nagoya Univ , Toyota Central R&D Labs Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 国立大学法人名古屋大学 , 株式会社豊田中央研究所
发明人： WADA KENSUKE , YAGI YUJI , ATSUMI TAKASHI , NAKAGAWA IKURO , ONO NOBUTADA
IPC分类号： G01N3/32 , G01N3/00
摘要： PROBLEM TO BE SOLVED: To provide a technique for accurately simulating the behavior of a laminated substrate wherein a metal layer consisting of any one of Cu, Al, a Cu alloy and an Al alloy and an insulating layer, consisting of insulating ceramics that are laminated.SOLUTION: This simulation method is constituted of a process for repeatedly deformation of the metal layer in a predetermined amplitude and acquiring actually measured data, showing a stress-strain curve at the time of saturation, the process for forming a uniaxial increase curve on the basis of the actually measured data, and a process for forming a material constant introduced into a curing rule on the basis of the formed uniaxial increase curve.
摘要翻译：要解决的问题：提供一种准确地模拟层压基板的行为的技术，其中由Cu，Al，Cu合金和Al合金中的任一种构成的金属层和由层压的绝缘陶瓷构成的绝缘层解决方案：该模拟方法由金属层以预定的振幅重复变形的过程构成，并获取实际测量的数据，显示饱和时的应力 - 应变曲线，形成单轴增加曲线的过程实际测量数据的基础，以及基于形成的单轴增加曲线形成引入固化规则的材料常数的方法。

6. 发明专利

JP2014103807A Power conversion device 有权
标题翻译：电源转换器件
公开(公告)号：JP2014103807A
公开(公告)日：2014-06-05
申请号：JP2012255209
申请日：2012-11-21
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所 , Toyota Motor Corp , トヨタ自動車株式会社
发明人： TAKAGI KENICHI , OSADA YUJI , KOJIMA TAKASHI , SUGIYAMA TAKAHIDE , NISHIBE YUJI , ATSUMI TAKASHI , SUGITA MASAYUKI
IPC分类号： H02M7/48
摘要： PROBLEM TO BE SOLVED: To provide a technique capable of, in a power conversion device assembled when card type power semiconductor modules are inserted into a slotted casing, facilitating mounting/dismounting of the individual power semiconductor modules.SOLUTION: The power conversion device disclosed includes: the casing having a plurality of slots on a front side and having a high current bus line and a small signal circuit board on a back side; and a plurality of card type modules inserted in corresponding slots. In the power conversion device, at least one of the plurality of card type modules is a power semiconductor module. In the power conversion device, in the back of the slots, the card type modules are electrically connected to the high current bus line and the card type modules are electrically connected to the small signal circuit board.
摘要翻译：要解决的问题：提供一种能够在卡式功率半导体模块插入开槽壳体中组装的电力转换装置中的技术，便于各个功率半导体模块的安装/拆卸。解决方案：所公开的电力转换装置壳体在前侧具有多个槽，并且在后侧具有高电流总线和小信号电路板; 以及插入对应的槽中的多个卡型模块。在功率转换装置中，多个卡型模块中的至少一个是功率半导体模块。在电力转换装置中，在插槽的后部，卡式模块电连接到高电流总线，并且卡式模块电连接到小信号电路板。

7. 发明专利

JP2013089828A Semiconductor module 有权
标题翻译：半导体模块
公开(公告)号：JP2013089828A
公开(公告)日：2013-05-13
申请号：JP2011230395
申请日：2011-10-20
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所 , Toyota Motor Corp , トヨタ自動車株式会社
发明人： SHOJI TOMOYUKI , OSADA YUJI , USUI MASANORI , NISHIBE YUJI , IMAI MAKOTO , TANIDA ATSUSHI , ATSUMI TAKASHI , FURUTA NORIBUMI
IPC分类号： H01L25/07 , H01L25/18
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor module having a simple configuration.SOLUTION: A semiconductor module 10 comprises a first structure 10Ua and a second structure 10Ub. The first structure 10Ua and the second structure 10Ub have common configurations. A first output bus bar Uout1 of the first structure 10Ua and a high-voltage-side bus bar 10P of the second structure 10Ub have common configurations. A low-voltage-side bus bar 10N of the first structure 10Ua and a second output bus bar Uout2 of the second structure 10Ub have common configurations.
摘要翻译：要解决的问题：提供具有简单配置的半导体模块。解决方案：半导体模块10包括第一结构10Ua和第二结构10Ub。第一结构10Ua和第二结构10Ub具有共同的结构。第一结构10Ua的第一输出汇流条Uout1和第二结构10Ub的高压侧汇流条10P具有共同的结构。第一结构10Ua的低压侧母线10N和第二结构10Ub的第二输出母线Uout2具有共同的结构。版权所有（C）2013，JPO＆INPIT

8. 发明专利

JP2013041881A Reactor 审中-公开
标题翻译：反应堆
公开(公告)号：JP2013041881A
公开(公告)日：2013-02-28
申请号：JP2011176165
申请日：2011-08-11
申请人： Toyota Motor Corp , トヨタ自動車株式会社 , Toyota Central R&D Labs Inc , 株式会社豊田中央研究所
发明人： NOBUSAKA MAO , SHINOHARA NOBUKI , ATSUMI TAKASHI , URATA SHINYA , NAKAI HIDEO
IPC分类号： H01F37/00 , H01F27/24
摘要： PROBLEM TO BE SOLVED: To improve performance of a reactor.SOLUTION: A reactor 10 includes: a first core 14 and a second core 16 arranged to face each other across an inter-core gap G12; and a coil 12 wound around over the cores 14 and 16. The first core 14 includes a first core element 18 made of a magnetic material, and the second core 16 includes a second core element 26 made of another magnetic material. When a current in a current range lower than a predetermined current value which has been set in advance flows into the coil 12, the first core 14 has magnetic resistance lower than that of the second core 16. When a current in a current range higher than the predetermined current value flows into the coil 12, the second core 16 has magnetic resistance lower than that of the first core 14.
摘要翻译：要解决的问题：提高反应堆的性能。解决方案：反应器10包括：第一芯14和第二芯16，其布置成跨越芯间间隙G12彼此面对; 以及缠绕在芯14和16周围的线圈12.第一芯14包括由磁性材料制成的第一芯体18，并且第二芯16包括由另一磁性材料制成的第二芯体26。当低于预先设定的预定电流值的电流范围内的电流流入线圈12时，第一磁芯14的磁阻低于第二磁芯16的磁阻。当电流范围高于预定电流值流入线圈12，第二芯16的磁阻低于第一芯14的磁阻。版权所有：（C）2013，JPO＆INPIT

9. 发明专利

JP2013016691A Reactor 审中-公开
标题翻译：反应堆
公开(公告)号：JP2013016691A
公开(公告)日：2013-01-24
申请号：JP2011149164
申请日：2011-07-05
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所 , Toyota Motor Corp , トヨタ自動車株式会社
发明人： URATA SHINYA , NAKAI HIDEO , SHINOHARA NOBUKI , NOBUSAKA MAO , ATSUMI TAKASHI
IPC分类号： H01F37/00 , H01F27/28
CPC分类号： Y02T10/6204
摘要： PROBLEM TO BE SOLVED: To improve a space factor of a coil while preventing the increase of size, and to effectively reduce an eddy current loss, in a reactor.SOLUTION: A reactor 20 includes a core 22, and both inner peripheral side and outer peripheral side coil elements 24 and 26 which are disposed so as to deviate in a diametrical direction, and connected with each other. The inner peripheral side and outer peripheral side coil elements 24 and 26 are respectively configured by inside and outside coils 40 and 42. The electric resistivity ρ1 of the inside coil 40 is made to be the electric resistivity ρ2 or more of the outside coil 42, and the number n1 of winding of the inside coil 40 is made to be smaller than the number n2 of winding of the outside coil 42. A cross-section S1 of the inside coil 40 is made to be smaller than a cross-section S2 of the outside coil 42, and an aspect ratio A1 which is a ratio of lateral length to the vertical length of the cross-section of the inside coil 40 is made to be smaller than an aspect ratio A2 of the cross-section of the outside coil 42.
摘要翻译：要解决的问题：在反应器中，为了提高线圈的空间因数，同时防止尺寸的增加并且有效地降低了涡流损耗。解决方案：反应器20包括芯体22，以及沿直径方向偏离并彼此连接的内周侧和外周侧线圈元件24和26。内周侧和外周侧线圈元件24,26分别由线圈40和内部线圈42构成。内侧线圈40的电阻率ρ1为外部线圈42的电阻率ρ2以上，使内侧线圈40的绕组数n1小于外侧线圈42的绕组数n2。使内侧线圈40的横截面S1小于外侧线圈42和作为内侧线圈40的横截面的横向长度与纵向长度的比的纵横比A1被设定为小于外部线圈的横截面的纵横比A2 42.版权所有（C）2013，JPO＆INPIT

10. 发明专利

JP2013016682A Reactor 审中-公开
标题翻译：反应堆
公开(公告)号：JP2013016682A
公开(公告)日：2013-01-24
申请号：JP2011149020
申请日：2011-07-05
申请人： Toyota Motor Corp , トヨタ自動車株式会社 , Toyota Central R&D Labs Inc , 株式会社豊田中央研究所
发明人： SHINOHARA NOBUKI , NOBUSAKA MAO , ATSUMI TAKASHI , URATA SHINYA , NAKAI HIDEO
IPC分类号： H01F27/24 , H01F27/255 , H01F37/00
摘要： PROBLEM TO BE SOLVED: To provide a reactor provided with a structure which allows a core body to be easily manufactured and is capable of preventing generation of a leakage magnetic flux.SOLUTION: A third core body (25) includes: a winding core part (26) which has one end in contact with a base body (11) and the other end extending toward a second core body (20) and around which a coil (30) is wound; and a gap plate (27) which is provided on the other end side of the winding core part (26) so as to project toward a pair of side walls (12, 12) and is disposed with a first gap (G1) between itself and the second core body (20) and a second gap (G2) between itself and the pair of side walls (12, 12).
摘要翻译：要解决的问题：提供一种具有允许容易制造芯体并且能够防止产生漏磁通的结构的电抗器。解决方案：第三芯体（25）包括：卷绕芯部（26），其一端与基体（11）接触，另一端朝向第二芯体（20）延伸，并围绕该芯体缠绕线圈（30）; 以及间隔板（27），其设置在所述卷绕芯部（26）的另一端侧，朝向一对侧壁（12,12）突出，并且在其自身之间设置有第一间隙（G1）和第二芯体（20）和在其与一对侧壁（12,12）之间的第二间隙（G2）。版权所有（C）2013，JPO＆INPIT

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