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1. 发明公开

EP1394869A2 Method of forming protection film for covering electronic component and electronic device having protection film 审中-公开
标题翻译：一种用于覆盖所述电子部件和电子装置的保护层制造的保护层的过程
公开(公告)号：EP1394869A2
公开(公告)日：2004-03-03
申请号：EP03018759.5
申请日：2003-08-27
申请人： Tohoku Pioneer Corp.
发明人： Ohata, Hiroshi , Ogushi, Kunizo , Kimura, Masami
IPC分类号： H01L51/20
CPC分类号： H01L51/56 , H01L51/5253
摘要： A method for forming a protection film capable of effectively sealing an organic EL device mounted on a surface of a substrate is provided, for example.
Crucibles 15a to 15c as vapor sources are disposed facing the organic EL device 2 mounted on the surface of the transparent substrate 1. There is also provided a mask 11 having an opening 11a facing the organic EL device 2 and the mask 11 is disposed between the substrate 1 and a crucible 15. Distances of the mask 11 from the substrate are progressively increased and materials evaporated from the crucibles 15a to 15c are selected, to thereby form a first layer of protection film 21 for covering the EL device 2, a second layer of protection film 22 for covering beyond the first layer of protection film, and further third or more layers of protection films similarly.
摘要翻译：提供了一种用于形成保护膜能够有效地密封安装在基板的表面上的有机EL元件的方法，例如。坩埚15A至15C作为蒸气源的面对有机EL元件2配置在安装于透明基板1。因此，提供了具有在开口11a面对有机EL元件2和掩模11的掩模11在之间设置的表面上 1个基板和掩模11从基板的坩埚15的距离逐渐增加，并从坩埚15A至15C蒸发材料被选择，从而形成保护膜21的第一层，用于覆盖所述EL元件2，第二层的保护膜22覆盖超出保护膜，电影，和保护膜的进一步的第三或更多层类似的第一层。

2. 发明公开

EP1394869A3 Method of forming protection film for covering electronic component and electronic device having protection film 审中-公开
标题翻译：一种用于覆盖所述电子部件和电子装置的保护层制造的保护层的过程
公开(公告)号：EP1394869A3
公开(公告)日：2007-06-20
申请号：EP03018759.5
申请日：2003-08-27
申请人： Tohoku Pioneer Corp.
发明人： Ohata, Hiroshi , OgOshi, Kunizo , Kimura, Masami
IPC分类号： H01L51/20
CPC分类号： H01L51/56 , H01L51/5253
摘要： A method for forming a protection film capable of effectively sealing an organic EL device mounted on a surface of a substrate is provided, for example.
Crucibles 15a to 15c as vapor sources are disposed facing the organic EL device 2 mounted on the surface of the transparent substrate 1. There is also provided a mask 11 having an opening 11a facing the organic EL device 2 and the mask 11 is disposed between the substrate 1 and a crucible 15. Distances of the mask 11 from the substrate are progressively increased and materials evaporated from the crucibles 15a to 15c are selected, to thereby form a first layer of protection film 21 for covering the EL device 2, a second layer of protection film 22 for covering beyond the first layer of protection film, and further third or more layers of protection films similarly.

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