专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20140107282A1 Flame Retarding Adhesives 审中-公开
标题翻译：阻燃粘合剂
公开(公告)号：US20140107282A1
公开(公告)日：2014-04-17
申请号：US14006555
申请日：2012-03-22
申请人： Thu-Van T. Tran , Marie Aloshyna ep Lesuffleur , Richard B. Ross , Eumi Pyun , Anthony R. Plepys , Peter J. Harrison , Jason D. Clapper , Naiyong Jing , Vivek Bharti , Neeraj Sharma
发明人： Thu-Van T. Tran , Marie Aloshyna ep Lesuffleur , Richard B. Ross , Eumi Pyun , Anthony R. Plepys , Peter J. Harrison , Jason D. Clapper , Naiyong Jing , Vivek Bharti , Neeraj Sharma
IPC分类号： C09J11/06
CPC分类号： C09J11/06 , C08K5/0066 , C08K5/521 , C08K5/523 , C08L53/00 , C08L2201/02 , C08L2666/24 , C09J7/387 , C09J133/08 , C09J153/00 , C09J2205/102 , C08L2666/84
摘要： Pressure sensitive adhesives having flame retarding properties include a (meth)acrylate-based block copolymer, and at least 10% by weight of a halogen-free flame retarding agent. The adhesives may contain additional optional additives such as tackifying resins, plasticizers, and the like. The adhesives are prepared by blending the (meth)acrylate-based block copolymer, and the halogen-free flame retarding agent either in solvent or by a solventless process.
摘要翻译：具有阻燃性的压敏粘合剂包括（甲基）丙烯酸酯类嵌段共聚物和至少10重量％的无卤阻燃剂。粘合剂可以含有额外的任选的添加剂，例如增粘树脂，增塑剂等。通过在溶剂或无溶剂方法中混合（甲基）丙烯酸酯类嵌段共聚物和无卤阻燃剂来制备粘合剂。

2. 发明申请

US20140162058A1 Flame Retarding Tapes 审中-公开
标题翻译：阻燃胶带
公开(公告)号：US20140162058A1
公开(公告)日：2014-06-12
申请号：US14032298
申请日：2012-03-22
申请人： Thu-Van T. Tran , Marie Aloshyna ep Lesuffleur , Richard B. Ross , Eumi Pyun , Anthony R. Plepys , Peter J. Harrison , Jason D. Clapper , Naiyong Jing , Vivek Bharti , Neeraj Sharma
发明人： Thu-Van T. Tran , Marie Aloshyna ep Lesuffleur , Richard B. Ross , Eumi Pyun , Anthony R. Plepys , Peter J. Harrison , Jason D. Clapper , Naiyong Jing , Vivek Bharti , Neeraj Sharma
IPC分类号： C09J7/02 , C09J5/06 , B05D1/00
CPC分类号： C09J5/06 , B05D1/00 , C08K3/013 , C08K5/0066 , C08K5/521 , C08L2201/02 , C09J7/22 , C09J7/38 , C09J7/385 , C09J153/00 , C09J2205/102 , C09J2453/00 , Y10T428/2891
摘要： Pressure sensitive adhesive tapes having flame retarding properties include a backing and a pressure sensitive adhesive layer. The pressure sensitive adhesive layer includes a (meth)acrylate-based block copolymer, and may also include at least 10% by weight of a halogen-free flame retarding agent. The adhesive layer may contain additional optional additives such as tackifying resins, plasticizers, and the like. The tapes are prepared by coating the flame retarding pressure sensitive adhesive onto the backing, either in solvent or by a solventless process.
摘要翻译：具有阻燃性的压敏粘合带包括背衬和压敏粘合剂层。压敏粘合剂层包括（甲基）丙烯酸酯类嵌段共聚物，并且还可以包含至少10重量％的无卤阻燃剂。粘合剂层可以含有额外的任选的添加剂，例如增粘树脂，增塑剂等。通过将溶剂或无溶剂方法将阻燃压敏粘合剂涂布在背衬上来制备胶带。

3. 发明申请

US20130236718A1 Pressure Sensitive Adhesives Containing A Cyclic Phosphonate Ester Flame Retardant 审中-公开
标题翻译：含有环磷酸酯阻燃剂的压敏粘合剂
公开(公告)号：US20130236718A1
公开(公告)日：2013-09-12
申请号：US13882555
申请日：2011-03-11
申请人： Joern Buettner , Eumi Pyun , Anthony R. Plepys , Lisa S. Lim , Francois C. D'Haese , Tobias Pick
发明人： Joern Buettner , Eumi Pyun , Anthony R. Plepys , Lisa S. Lim , Francois C. D'Haese , Tobias Pick
IPC分类号： C09J133/06 , B32B7/12 , C09J7/02
CPC分类号： C09J133/064 , B32B7/12 , C08K5/0066 , C08K5/5357 , C09J7/22 , C09J7/38 , C09J7/385 , C09J2205/102 , C09J2433/00 , C09J2467/006 , Y10T428/249983 , Y10T428/2848 , Y10T428/2891
摘要： Pressure sensitive adhesives containing a cyclic phosphonate ester are described. Methods of preparing such adhesives and articles comprising such adhesives are also described.
摘要翻译：描述了含有环状膦酸酯的压敏粘合剂。还描述了制备这种粘合剂的方法和包含这种粘合剂的制品。

4. 发明授权

US5539033A Solventless compounding and coating of non-thermoplastic hydrocarbon elastomers 失效
公开(公告)号：US5539033A
公开(公告)日：1996-07-23
申请号：US215212
申请日：1994-03-21
申请人： Timothy D. Bredahl , Harold W. Leverty , Robert L. Smith , Richard E. Bennett , David J. Yarusso , Daniel C. Munson , Anthony R. Plepys
发明人： Timothy D. Bredahl , Harold W. Leverty , Robert L. Smith , Richard E. Bennett , David J. Yarusso , Daniel C. Munson , Anthony R. Plepys
IPC分类号： B29C47/00 , B29C47/02 , B29C47/06 , B29C47/10 , B29C47/40 , B29C47/50 , B29C71/02 , C08J9/06 , C08L21/00 , C09J5/06 , C09J5/08 , C09J7/00 , C09J7/02 , C09J11/06 , C09J157/00 , C08L23/00 , C08J3/20
CPC分类号： B29C47/02 , B29C47/0047 , B29C47/065 , B29C47/1063 , B29C47/364 , B29C47/50 , C09J5/08 , C09J7/0214 , B29C47/0021 , B29C47/1045 , B29C47/1081 , B29C47/367 , B29C47/40 , B29C71/02 , B29K2023/22 , B29K2105/0005 , B29K2105/16 , B29K2105/24 , C08L21/00 , C09J2421/00 , Y10T428/249954 , Y10T428/249958 , Y10T428/249984 , Y10T428/249985 , Y10T428/2852
摘要： A solvent-free hot melt process, for preparing a non-thermosettable, pressure-sensitive adhesive from a tackified non-thermoplastic hydrocarbon elastomer. The process employs a continuous compounding device that has a sequence of alternating conveying and processing zones. The processing zones masticate and mix materials in them. Non-thermoplastic elastomers having high molecular weight may be readily compounded into adhesives in the process.

5. 发明授权

US5663530A Wire bond tape ball grid array package 失效
标题翻译：导线胶带球栅阵列封装
公开(公告)号：US5663530A
公开(公告)日：1997-09-02
申请号：US509779
申请日：1995-08-01
申请人： Randolph D. Schueller , Anthony R. Plepys , Howard E. Evans
发明人： Randolph D. Schueller , Anthony R. Plepys , Howard E. Evans
IPC分类号： H01L23/12 , H01L23/13 , H01L23/31 , H01L23/495 , H01L23/498 , H05K1/02
CPC分类号： H01L23/49572 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L24/49 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48233 , H01L2224/49175 , H01L2224/73265 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/0102 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/0105 , H01L2924/01055 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/18301 , H01L2924/30107
摘要： A tape ball grid array package reverses the usual attachment of flexible circuitry to a stiffener so that the circuit traces face the stiffener rather than away from the stiffener as is conventional. This construction allows the elimination of a previously necessary solder mask and so reduces the cost to produce the package.
摘要翻译：磁带栅格阵列封装将柔性电路的通常连接反转到加强件，使得电路迹线面向加强件而不是如常规那样远离加强件。这种结构允许消除先前所需的焊接掩模，因此降低了生产封装的成本。

6. 发明授权

US5550175A Solventless compounding and coating of non-thermoplastic hydrocarbon elastomers 失效
公开(公告)号：US5550175A
公开(公告)日：1996-08-27
申请号：US435980
申请日：1995-05-05
申请人： Timothy D. Bredahl , Harold Leverty , Robert L. Smith , Richard E. Bennett , David J. Yarusso , Daniel C. Munson , Anthony R. Plepys
发明人： Timothy D. Bredahl , Harold Leverty , Robert L. Smith , Richard E. Bennett , David J. Yarusso , Daniel C. Munson , Anthony R. Plepys
IPC分类号： B29C47/00 , B29C47/02 , B29C47/06 , B29C47/10 , B29C47/40 , B29C47/50 , B29C71/02 , C08J9/06 , C08L21/00 , C09J5/06 , C09J5/08 , C09J7/00 , C09J7/02 , C09J11/06 , C09J157/00 , C08K3/00 , C08L23/00 , B32B7/12 , B32B3/26
CPC分类号： B29C47/02 , B29C47/0047 , B29C47/065 , B29C47/1063 , B29C47/364 , B29C47/50 , C09J5/08 , C09J7/0214 , B29C47/0021 , B29C47/1045 , B29C47/1081 , B29C47/367 , B29C47/40 , B29C71/02 , B29K2023/22 , B29K2105/0005 , B29K2105/16 , B29K2105/24 , C08L21/00 , C09J2421/00 , Y10T428/249954 , Y10T428/249958 , Y10T428/249984 , Y10T428/249985 , Y10T428/2852
摘要： A solvent-free hot melt process, for preparing a non-thermosettable, pressure-sensitive adhesive from a tackified non-thermoplastic hydrocarbon elastomer. The process employs a continuous compounding device that has a sequence of alternating conveying and processing zones. The processing zones masticate and mix materials in them. Non-thermoplastic elastomers having high molecular weight may be readily compounded into adhesives in the process.

7. 发明授权

US6140707A Laminated integrated circuit package 失效
标题翻译：层压集成电路封装
公开(公告)号：US6140707A
公开(公告)日：2000-10-31
申请号：US74126
申请日：1998-05-07
申请人： Anthony R. Plepys , Paul M. Harvey
发明人： Anthony R. Plepys , Paul M. Harvey
IPC分类号： H01L23/12 , H01L21/50 , H01L23/498 , H01L29/40
CPC分类号： H01L21/50 , H01L23/49816 , H01L23/4985 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/07811 , H01L2924/15311
摘要： A low-cost integrated circuit package is provided for packaging integrated circuits. In preferred embodiments, the package comprises a flexible circuit that is laminated to a stiffener using a dielectric adhesive, with the conductive traces on the flexible circuit facing toward the stiffener but separated therefrom by the adhesive. The conductive traces include an array of flip-chip attachment pads. A window is formed in the stiffener over the attachment pad array, such as by etching. The adhesive is then removed over the attachment pads by laser ablation, but left in place between the pads, thus forming a flip-chip attachment site. In preferred embodiments, this invention eliminates the need for high-resolution patterned adhesive, and it also eliminates the need for application of a solder mask at the flip-chip attachment site, because the remaining adhesive performs the solder mask function of preventing bridging between attachment pads. This package provides a die attachment site having a high degree of planarity due to tensile stresses formed in the flexible circuit and adhesive layers during lamination of those layers to the stiffener. Embodiments of this invention may be used with TBGA, frangible lead, and other packaging technologies.
摘要翻译：提供了一种用于封装集成电路的低成本集成电路封装。在优选实施例中，封装包括使用电介质粘合剂层压到加强件的柔性电路，柔性电路上的导电迹线面向加强件，但是通过粘合剂与其分离。导电迹线包括倒装芯片附接焊盘的阵列。在附着垫阵列上的加强件中形成窗口，例如通过蚀刻。然后通过激光烧蚀在粘附垫上去除粘合剂，但留在垫之间的位置，从而形成倒装芯片附着部位。在优选实施例中，本发明消除了对高分辨率图案化粘合剂的需要，并且也消除了在倒装芯片附接位置处施加焊接掩模的需要，因为剩余的粘合剂执行阻焊功能以防止附着之间的桥接垫该包装提供了由于在将这些层层压到加强件期间在柔性电路和粘合剂层中形成的拉伸应力而具有高度平坦度的模具附接部位。本发明的实施例可以与TBGA，易碎引线和其他封装技术一起使用。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式