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    • 1. 发明授权
    • Disk drive with composite sheet metal and encapsulated plastic base
    • 带复合金属片和封装塑料底座的磁盘驱动器
    • US6034841A
    • 2000-03-07
    • US87336
    • 1998-05-29
    • Thomas Robert AlbrechtVijayeshwar Das KhannaSuresh KumarSri Muthuthamby Sri-Jayantha
    • Thomas Robert AlbrechtVijayeshwar Das KhannaSuresh KumarSri Muthuthamby Sri-Jayantha
    • G11B25/04G11B33/02G11B5/012
    • G11B33/02G11B25/043
    • A miniature removable disk drive that meets the CompactFlash type II form factor and interface specifications uses a composite sheet metal/plastic tub-shaped base for supporting the disk drive components, e.g., the spindle motor with attached disk, the voice coil motor actuator with attached read/write head, and the preamplifier/write driver electronics module. The composite base is a metal plate with a flange extending around its perimeter and a plastic frame that encapsulates the flange and surrounds the perimeter of the metal plate. The metal plate supports the disk drive spindle motor and voice coil motor actuator and is made of high magnetic permeability, low coercivity material so that it can form part of the magnetic circuit of the spindle motor and/or actuator. The flanges on the metal plate provide rigidity and allow the base to be fabricated by injection molding the plastic frame onto the metal base so that the plastic encapsulates the metal flanges to form the walls of the tub-shaped base. An electronics card is located beneath the metal plate and is electrically shielded from the read/write heads and electronics module by the metal plate. Top and bottom covers are attached to the frame to enclose the disk drive components and the electronics card. Because the frame is made of plastic the corners may be made with intricately shaped cutouts that allow elastomeric corner bumpers to be interlocked into the frame at the corners. The corner bumpers extend beyond the frame and the covers so as to provide shock protection if the miniature removable disk drive is dropped.
    • 符合CompactFlash II型外形尺寸和接口规格的微型可移动磁盘驱动器使用复合金属/塑料桶形基座来支撑磁盘驱动器组件,例如带有附加磁盘的主轴电机,附带的音圈电机执行器 读/写头,以及前置放大/写入驱动器电子模块。 复合基座是具有围绕其周边延伸的凸缘的金属板和塑料框架,其封装凸缘并且围绕金属板的周边。 金属板支撑磁盘驱动器主轴电机和音圈电机执行器,并由高磁导率,低矫顽力材料制成,从而可以形成主轴电机和/或执行器的磁路的一部分。 金属板上的凸缘提供刚性并允许通过将塑料框架注塑成金属基底来制造基座,使得塑料封装金属法兰以形成盆形基座的壁。 电子卡位于金属板下方,并通过金属板与读/写头和电子模块电隔离。 顶盖和底盖连接到框架以封闭磁盘驱动器组件和电子卡。 由于框架由塑料制成,所以角部可以形成为具有复杂形状的切口,其允许弹性角部保险杠在拐角处与框架互锁。 拐角缓冲器延伸超出框架和盖子,以便在微型可移动磁盘驱动器掉落时提供冲击保护。
    • 8. 发明申请
    • Method to Extract and Apply Circuit Features in Organic Substrate for Automation of Warp Modeling
    • 在有机基板中提取和应用电路特征的方法,用于自动化变形建模
    • US20090313588A1
    • 2009-12-17
    • US12260957
    • 2008-10-29
    • Hien Phu DangVijayeshwar Das KhannaArun SharmaSri M. Sri-Jayantha
    • Hien Phu DangVijayeshwar Das KhannaArun SharmaSri M. Sri-Jayantha
    • G06F17/50
    • H05K3/0005H05K1/0271H05K2201/09136
    • A method of characterizing an organic substrate including a plurality of circuit layers is provided includes the steps of: receiving an image of the organic substrate, the image including a geometric description of the circuit layers of the substrate; segmenting the substrate into multiple processing regions based, at least in part, on geometric coordinates of circuit structures defined in the image of the substrate; generating a circuit layer image corresponding to a selected one of the processing regions of the substrate; identifying one or more geometric features in the circuit layer image; estimating at least one thermomechanical property of the circuit layer image as a function of the identified geometric features; repeating the steps of receiving an image, generating a circuit layer image, identifying one or more geometric features in the circuit layer image, and estimating at least one thermomechanical property of the circuit layer image until all circuit layers in the substrate have been processed; and generating a 3-D representation of the selected one of the processing regions of the substrate including the plurality of circuit layer images as a function of the at least one thermomechanical property of each of the plurality of circuit layer images.
    • 提供了表征包括多个电路层的有机衬底的方法包括以下步骤:接收有机衬底的图像,该图像包括衬底的电路层的几何描述; 至少部分地基于在衬底的图像中限定的电路结构的几何坐标将衬底分割成多个处理区域; 生成与所述基板的所述选择的一个所述处理区域对应的电路层图像; 识别电路层图像中的一个或多个几何特征; 估计电路层图像的至少一个热机械性质作为所识别的几何特征的函数; 重复接收图像的步骤,生成电路层图像,识别电路层图像中的一个或多个几何特征,以及估计电路层图像的至少一个热机械特性,直到已经处理了基板中的所有电路层; 以及根据所述多个电路层图像中的每一个的所述至少一个热机械特性,生成包括所述多个电路层图像的所述基板的所选择的一个处理区域的3-D表示。