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1. 发明授权

US09535865B2 Interconnection of multiple chips in a package 有权
标题翻译：封装中多个芯片的互连
公开(公告)号：US09535865B2
公开(公告)日：2017-01-03
申请号：US13996107
申请日：2011-12-22
申请人： Thomas P. Thomas , Randy B. Osborne , Rajesh Kumar
发明人： Thomas P. Thomas , Randy B. Osborne , Rajesh Kumar
IPC分类号： G06F13/00 , G06F13/364 , G06F13/14 , G06F13/40 , G06F13/42 , G06F3/0488 , G06F13/16
CPC分类号： G06F13/364 , G06F3/0488 , G06F13/14 , G06F13/16 , G06F13/4068 , G06F13/4273 , Y02D10/14 , Y02D10/151
摘要： An interface. A first set of single-ended transmitter circuits reside on a first die having a master device. A first set of single-ended receiver circuits reside on a second die. The receiver circuits have no termination and no equalization. The second die has a slave device responsive to the master device of the first die. Conductive lines connect the first set of transmitter circuits and the first set of receiver circuits. The lengths of the conductive lines are matched.
摘要翻译：一个接口第一组单端发射器电路驻留在具有主器件的第一管芯上。第一组单端接收器电路驻留在第二管芯上。接收器电路没有终端，没有均衡。第二管芯具有响应于第一管芯的主器件的从器件。导电线连接第一组发射器电路和第一组接收器电路。导线的长度相匹配。

2. 发明申请

US20140201405A1 INTERCONNECTION OF MULTIPLE CHIPS IN A PACKAGE UTILIZING ON-PACKAGE INPUT/OUTPUT INTERFACES 有权
标题翻译：使用封装输入/输出接口的封装中的多个插座的互连
公开(公告)号：US20140201405A1
公开(公告)日：2014-07-17
申请号：US13996107
申请日：2011-12-22
申请人： Thomas P. Thomas , Randy B. Osborne , Rajesh Kumar
发明人： Thomas P. Thomas , Randy B. Osborne , Rajesh Kumar
IPC分类号： G06F13/364 , G06F13/16 , G06F3/0488
CPC分类号： G06F13/364 , G06F3/0488 , G06F13/14 , G06F13/16 , G06F13/4068 , G06F13/4273 , Y02D10/14 , Y02D10/151
摘要： An interface. A first set of single-ended transmitter circuits reside on a first die having a master device. A first set of single-ended receiver circuits reside on a second die. The receiver circuits have no termination and no equalization. The second die has a slave device responsive to the master device of the first die. Conductive lines connect the first set of transmitter circuits and the first set of receiver circuits. The lengths of the conductive lines are matched.
摘要翻译：一个接口第一组单端发射器电路驻留在具有主器件的第一管芯上。第一组单端接收器电路驻留在第二管芯上。接收器电路没有终端，没有均衡。第二管芯具有响应于第一管芯的主器件的从器件。导电线连接第一组发射器电路和第一组接收器电路。导线的长度相匹配。

3. 发明授权

US09519609B2 On-package input/output architecture 有权
标题翻译：封装输入/输出架构
公开(公告)号：US09519609B2
公开(公告)日：2016-12-13
申请号：US13995007
申请日：2011-12-22
申请人： Thomas P. Thomas , Rajesh Kumar
发明人： Thomas P. Thomas , Rajesh Kumar
IPC分类号： G06F13/40 , G06F13/38
CPC分类号： G06F13/4072 , G06F13/385 , G06F13/40 , G06F13/4086 , H01L2924/0002 , Y02D10/14 , Y02D10/151 , H01L2924/00
摘要： An on-package interface. A first set of single-ended transmitter circuits on a first die. The transmitter circuits are impedance matched and have no equalization. A first set of single-ended receiver circuits on a second die. The receiver circuits have no termination and no equalization. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines are matched.
摘要翻译：一个封装接口。第一组第一组单端发射机电路。发射机电路阻抗匹配，无均衡。第二组芯片上的第一组单端接收器电路。接收器电路没有终端，没有均衡。多条导线耦合第一组发射机电路和第一组接收机电路。多条导线的长度相匹配。

4. 发明授权

US09384163B2 Non-linear termination for an on-package input/output architecture 有权
标题翻译：用于封装输入/输出架构的非线性终端
公开(公告)号：US09384163B2
公开(公告)日：2016-07-05
申请号：US13995110
申请日：2011-12-22
申请人： Todd W. Mellinger , Michael E. Griffith , Ganesh Balamurugan , Thomas P. Thomas , Rajesh Kumar
发明人： Todd W. Mellinger , Michael E. Griffith , Ganesh Balamurugan , Thomas P. Thomas , Rajesh Kumar
IPC分类号： G06F13/40 , G06F13/14 , G06F13/36
CPC分类号： G06F13/4086 , G06F13/14 , G06F13/36 , Y02D10/14 , Y02D10/151
摘要： An on-package interface. A first set of single-ended transmitter circuits on a first die. A first set of single-ended receiver circuits on a second die. The receiver circuits have a termination circuit comprising an inverter and a resistive feedback element. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines arc matched.
摘要翻译：一个封装接口。第一组第一组单端发射机电路。第二组芯片上的第一组单端接收器电路。接收器电路具有包括反相器和电阻反馈元件的终端电路。多条导线耦合第一组发射机电路和第一组接收机电路。多个导线的长度匹配。

5. 发明申请

US20130318266A1 ON-PACKAGE INPUT/OUTPUT ARCHITECTURE 有权
标题翻译：封装输入/输出结构
公开(公告)号：US20130318266A1
公开(公告)日：2013-11-28
申请号：US13995007
申请日：2011-12-22
申请人： Thomas P. Thomas , Rajesh Kumar
发明人： Thomas P. Thomas , Rajesh Kumar
IPC分类号： G06F13/42
CPC分类号： G06F13/4072 , G06F13/385 , G06F13/40 , G06F13/4086 , H01L2924/0002 , Y02D10/14 , Y02D10/151 , H01L2924/00
摘要： An on-package interface. A first set of single-ended transmitter circuits on a first die. The transmitter circuits are impedance matched and have no equalization. A first set of single-ended receiver circuits on a second die. The receiver circuits have no termination and no equalization. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines are matched.
摘要翻译：一个封装接口。第一组第一组单端发射机电路。发射机电路阻抗匹配，无均衡。第二组芯片上的第一组单端接收器电路。接收器电路没有终端，没有均衡。多条导线耦合第一组发射机电路和第一组接收机电路。多条导线的长度相匹配。

6. 发明申请

US20140089549A1 NON-LINEAR TERMINATION FOR AN ON-PACKAGE INPUT/OUTPUT ARCHITECTURE 有权
标题翻译：用于封装输入/输出结构的非线性终止
公开(公告)号：US20140089549A1
公开(公告)日：2014-03-27
申请号：US13995110
申请日：2011-12-22
申请人： Todd W. Mellinger , Michael E. Griffith , Ganesh Balamurugan , Thomas P. Thomas , Rajesh Kumar
发明人： Todd W. Mellinger , Michael E. Griffith , Ganesh Balamurugan , Thomas P. Thomas , Rajesh Kumar
IPC分类号： G06F13/36
CPC分类号： G06F13/4086 , G06F13/14 , G06F13/36 , Y02D10/14 , Y02D10/151
摘要： An on-package interface. A first set of single-ended transmitter circuits on a first die. A first set of single-ended receiver circuits on a second die. The receiver circuits have a termination circuit comprising an inverter and a resistive feedback element. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines arc matched.
摘要翻译：一个封装接口。第一组第一组单端发射机电路。第二组芯片上的第一组单端接收器电路。接收器电路具有包括反相器和电阻反馈元件的终端电路。多条导线耦合第一组发射机电路和第一组接收机电路。多个导线的长度匹配。

7. 发明授权

US10685947B2 Distributed semiconductor die and package architecture 有权
公开(公告)号：US10685947B2
公开(公告)日：2020-06-16
申请号：US15869637
申请日：2018-01-12
申请人： Wilfred Gomes , Mark T. Bohr , Rajesh Kumar , Robert L. Sankman , Ravindranath V. Mahajan , Wesley D. Mc Cullough
发明人： Wilfred Gomes , Mark T. Bohr , Rajesh Kumar , Robert L. Sankman , Ravindranath V. Mahajan , Wesley D. Mc Cullough
IPC分类号： H01L23/48 , H01L25/18 , H01L25/00 , H01L23/00 , H01L23/538 , H01L23/522 , H01L25/16 , H01L25/065 , H01L23/498
摘要： The present disclosure is directed to systems and methods of conductively coupling a plurality of relatively physically small core dies to a relatively physically larger base die using an electrical mesh network that is formed in whole or in part in, on, across, or about all or a portion of the base die. Electrical mesh networks beneficially permit the positioning of the cores in close proximity to support circuitry carried by the base die. The minimal separation between the core circuitry and the support circuitry advantageously improves communication bandwidth while reducing power consumption. Each of the cores may include functionally dedicated circuitry such as processor core circuitry, field programmable logic, memory, or graphics processing circuitry. The use of core dies beneficially and advantageously permits the use of a wide variety of cores, each having a common or similar interface to the electrical mesh network.

8. 发明授权

US09719011B2 Proppant 有权
公开(公告)号：US09719011B2
公开(公告)日：2017-08-01
申请号：US13126905
申请日：2009-10-29
申请人： Christopher M. Tanguay , John Erickson , Victoria Manea , Jyh-Chiarng Huarng , Rajesh Kumar , Fikri Emrah Alemdaroglu
发明人： Christopher M. Tanguay , John Erickson , Victoria Manea , Jyh-Chiarng Huarng , Rajesh Kumar , Fikri Emrah Alemdaroglu
IPC分类号： E21B43/26 , B05D7/00 , C09K8/92 , C09K8/80 , C09K8/62
CPC分类号： C09K8/805 , C09K8/62
摘要： A proppant comprises a particle and a polycarbodiimide coating disposed on the particle. The polycarbodiimide coating comprises the reaction product of a polymeric isocyanate and a monomeric isocyanate, in the presence of a catalyst. A method of forming the proppant comprises the steps of providing the particle, providing the polymeric isocyanate, providing the monomeric isocyanate, providing the catalyst, reacting the polymeric isocyanate and the monomeric isocyanate in the presence of the catalyst to form the polycarbodiimide coating, and coating the particle with the polycarbodiimide coating.

9. 发明申请

US20160328768A1 TOWING / VENDOR CONNECTION APPARATUS AND METHOD OF USE THEREOF 审中-公开
标题翻译：推送器/供应商连接装置及其使用方法
公开(公告)号：US20160328768A1
公开(公告)日：2016-11-10
申请号：US14706919
申请日：2015-05-07
申请人： Rajesh Kumar , Todd DeMasseo
发明人： Rajesh Kumar , Todd DeMasseo
IPC分类号： G06Q30/06
CPC分类号： G06Q30/0619
摘要： The invention comprises a connection system, implemented as an apparatus and method of use thereof, for linking vehicle towing related information with a service and/or a product provided by a company. The connection system optionally timely provides information about a towed vehicle and/or towing event to a service system where the towing related information is optionally: obtained through a standardized uplink utilized by a set of towing companies; used to develop a towing/services relationship calibration; provided to a probabilistic prediction system; directly related to an incident; related to non-incident vehicle status; related to a specific actor, location, incident, vehicle type, and/or vehicle sub-system; and/or is provided to the service system, such as a retailor or a vendor.
摘要翻译：本发明包括实现为其装置及其使用方法的连接系统，用于将车辆牵引相关信息与由公司提供的服务和/或产品相关联。连接系统可选地及时地将牵引车辆和/或牵引事件的信息提供给服务系统，其中牵引相关信息可选地通过一组牵引公司使用的标准上行链路获得; 用于开发牵引/服务关系校准; 提供给概率预测系统; 直接与事件有关; 涉及非事故车辆状况; 与具体演员，位置，事件，车辆类型和/或车辆子系统相关; 和/或被提供给服务系统，例如零售商或供应商。

10. 发明授权

US09353020B2 Dust suppressing aggregate 有权
标题翻译：粉尘抑制骨料
公开(公告)号：US09353020B2
公开(公告)日：2016-05-31
申请号：US14115377
申请日：2012-05-04
申请人： Raymond Neff , Alexander Gershanovich , Donald C. Mente , Rajesh Kumar
发明人： Raymond Neff , Alexander Gershanovich , Donald C. Mente , Rajesh Kumar
IPC分类号： C05G3/00 , C05C9/00
CPC分类号： C05G3/0088 , C05C9/00 , C05G3/0029 , C05G3/0035
摘要： A dust suppressing aggregate includes a core particle and a dust suppressing agent. The dust suppressing agent comprises polycarbodiimide and is disposed about the core particle for suppressing dusting of the core particle. A method of forming the dust suppressing aggregate includes the steps of reacting isocyanates in the presence of a catalyst to form the polycarbodiimide and encapsulating the core particle with the polycarbodiimide to form the dust suppressing agent. A system for producing the dust suppressing aggregate includes the core particle, the isocyanates, and the catalyst.
摘要翻译：粉尘聚集体包括核心颗粒和粉尘抑制剂。防尘剂包括聚碳化二亚胺，并且设置在芯颗粒周围以抑制芯颗粒的除尘。形成粉尘抑制聚集体的方法包括以下步骤：在催化剂存在下使异氰酸酯反应形成聚碳化二亚胺，并用核心颗粒与聚碳化二亚胺包封以形成除尘剂。用于生产除尘骨料的系统包括核心颗粒，异氰酸酯和催化剂。

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