专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07001671B2 Kinetic sprayed electrical contacts on conductive substrates 有权
公开(公告)号：US07001671B2
公开(公告)日：2006-02-21
申请号：US10676393
申请日：2003-10-01
申请人： Thomas Hubert Van Steenkiste , George Albert Drew , Daniel William Gorkiewicz , Bryan A. Gillispie
发明人： Thomas Hubert Van Steenkiste , George Albert Drew , Daniel William Gorkiewicz , Bryan A. Gillispie
IPC分类号： B32B15/02 , B32B15/04 , B32B15/20 , H01R13/03
CPC分类号： H01R13/03 , H01R4/58 , Y10T428/12063 , Y10T428/12104 , Y10T428/12486 , Y10T428/12708 , Y10T428/12736 , Y10T428/12903 , Y10T428/24851 , Y10T428/24917 , Y10T428/25
摘要： The present invention is directed to electrical contacts that comprise spaced electrically conductive particles embedded and bonded into the surface of conductors in which the particles have been kinetically sprayed onto the conductors with sufficient energy to form direct mechanical bonds between the particles and the conductors in a pre-selected location and particle number density that promotes high surface-to-surface contact and reduced contact resistance between the conductors.

2. 发明授权

US06685988B2 Kinetic sprayed electrical contacts on conductive substrates 失效
公开(公告)号：US06685988B2
公开(公告)日：2004-02-03
申请号：US09974243
申请日：2001-10-09
申请人： Thomas Hubert Van Steenkiste , George Albert Drew , Daniel William Gorkiewicz , Bryan A. Gillispie
发明人： Thomas Hubert Van Steenkiste , George Albert Drew , Daniel William Gorkiewicz , Bryan A. Gillispie
IPC分类号： B05D102
CPC分类号： H01R13/03 , H01R4/58 , Y10T428/12063 , Y10T428/12104 , Y10T428/12486 , Y10T428/12708 , Y10T428/12736 , Y10T428/12903 , Y10T428/24851 , Y10T428/24917 , Y10T428/25
摘要： The present invention is directed to electrical contacts that comprise spaced electrically conductive particles embedded and bonded into the surface of conductors in which the particles have been kinetically sprayed onto the conductors with sufficient energy to form direct mechanical bonds between the particles and the conductors in a pre-selected location and particle number density that promotes high surface-to-surface contact and reduced contact resistance between the conductors.

3. 发明授权

US06896933B2 Method of maintaining a non-obstructed interior opening in kinetic spray nozzles 失效
标题翻译：在动力学喷嘴中保持无阻塞的内部开口的方法
公开(公告)号：US06896933B2
公开(公告)日：2005-05-24
申请号：US10116927
申请日：2002-04-05
申请人： Thomas Hubert Van Steenkiste , John R. Smith , Daniel William Gorkiewicz , Alaa A. Elmoursi , Bryan A. Gillispie , Nilesh B. Patel
发明人： Thomas Hubert Van Steenkiste , John R. Smith , Daniel William Gorkiewicz , Alaa A. Elmoursi , Bryan A. Gillispie , Nilesh B. Patel
IPC分类号： B05B15/02 , C23C24/04 , B05D1/02
CPC分类号： C23C24/04 , B05B15/50
摘要： A method of maintaining a non-obstructed interior opening in a kinetic spray nozzle is disclosed. The method includes the steps of providing a mixture of particles including first particle population and a second particle population; entraining the mixture of particles into a flow of a gas at a temperature below the melt temperature of the particle populations; and directing the mixture of particles entrained in the flow of gas through a supersonic nozzle to accelerate the first particle population to a velocity sufficient to result in adherence of the first particle population on a substrate positioned opposite the nozzle. The operating conditions of the kinetic spray system are selected such that the second particle population is not accelerated to a velocity sufficient to result in adherence when it impacts the substrate. The inclusion of the second particle population maintains the supersonic nozzle in a non-obstructed condition and also enables one to raise the main gas operating temperature to a much higher level, thereby increasing the deposition efficiency of the first particle population.
摘要翻译：公开了一种在动力学喷嘴中保持未阻塞的内部开口的方法。该方法包括提供包括第一粒子群和第二粒子群的粒子的混合物的步骤; 在低于颗粒群的熔融温度的温度下将颗粒混合物引入气体流中; 并且将夹带在气流中的颗粒的混合物引导通过超音速喷嘴，以将第一颗粒群体加速到足以导致第一颗粒群在与喷嘴相对定位的基底上的粘附。选择动力喷雾系统的操作条件使得第二粒子群体不被加速到足以在其撞击基底时导致粘附的速度。包含第二颗粒群体将超音速喷嘴保持在非阻塞状态，并且还使得能够将主气体操作温度升高到更高的水平，从而提高第一颗粒群的沉积效率。

4. 发明授权

US07475831B2 Modified high efficiency kinetic spray nozzle 有权
标题翻译：改性高效动力喷嘴
公开(公告)号：US07475831B2
公开(公告)日：2009-01-13
申请号：US10763824
申请日：2004-01-23
申请人： Thomas Hubert Van Steenkiste , Taeyoung Han , Bryan A. Gillispie
发明人： Thomas Hubert Van Steenkiste , Taeyoung Han , Bryan A. Gillispie
IPC分类号： B05B1/24
CPC分类号： B05B7/1486 , C23C24/04
摘要： A modified high efficiency kinetic spray nozzle is disclosed. The modified nozzle has a rapid expansion rate in the diverging region relative to prior art nozzles, which enables one to achieve much higher particle velocities without an increase in the main gas temperature. Preferably, the expansion rate of the supersonic nozzle in a portion of the diverging region is at least 1 mm2 per millimeter, more preferably 2 mm2 per millimeter, more preferably 5 mm2 per mm, with a most preferable expansion rate being 10 mm2 per millimeter.
摘要翻译：公开了改进的高效动力喷嘴。改进的喷嘴相对于现有技术的喷嘴在发散区域中具有快速膨胀率，这使得能够在不增加主气体温度的情况下实现高得多的粒子速度。优选地，超音速喷嘴在发散区域的一部分中的膨胀率至少为1mm 2，更优选为2mm 2 / mm 2，更优选为5mm 2 / mm，最优选的膨胀速率为10mm / mm。

5. 发明申请

US20080290378A1 Transistor package with wafer level dielectric isolation 审中-公开
标题翻译：晶体管封装，晶圆级绝缘隔离
公开(公告)号：US20080290378A1
公开(公告)日：2008-11-27
申请号：US11804925
申请日：2007-05-21
申请人： Bruce A. Myers , Darrel E. Peugh , Alaa A. Elmoursi , Thomas Hubert Van Steenkiste , Zhibo Zhao , Bryan A. Gillispie
发明人： Bruce A. Myers , Darrel E. Peugh , Alaa A. Elmoursi , Thomas Hubert Van Steenkiste , Zhibo Zhao , Bryan A. Gillispie
IPC分类号： H01L21/20 , H01L29/76
CPC分类号： H01L23/49838 , H01L23/3121 , H01L23/3677 , H01L23/49811 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/15311 , H01L2924/15312 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A low cost transistor package is provided for high power applications. The package provides high thermal conductivity and dissipation for a silicon transistor die, high current carrying capability and isolation, and high power and thermal cycle life performance and reliability. A dielectric layer is fixed to a silicon transistor die, for coupling to a heat conducting buffer and attachment to a substrate. The dielectric layer is fixed to the die by growing the dielectric layer, depositing the dielectric layer, or applying the dielectric layer using a plasma spray. In an aspect, a conductive layer is formed to the silicon transistor die by a thermal or kinetic spray process, and the dielectric layer is applied to the conductive layer. The dielectric layer may also be established either before or after the transistor fabrication. Electrical and thermal interconnects are advantageously positioned from opposite sides of the silicon transistor die.
摘要翻译：为高功率应用提供了低成本晶体管封装。该封装为硅晶体管裸片提供高导热性和耗散能力，高电流承载能力和隔离性以及高功率和热循环寿命性能和可靠性。电介质层被固定到硅晶体管管芯，用于耦合到导热缓冲器并附接到衬底。通过生长电介质层，沉积介电层或使用等离子体喷涂来施加电介质层，将电介质层固定到管芯。在一个方面，通过热或动力学喷涂工艺将导电层形成于硅晶体管管芯，并将介电层施加到导电层上。电介质层也可以在晶体管制造之前或之后建立。电和热互连有利地从硅晶体管管芯的相对侧定位。

6. 发明授权

US06949300B2 Product and method of brazing using kinetic sprayed coatings 有权
标题翻译：使用动力喷涂的钎焊的产品和方法
公开(公告)号：US06949300B2
公开(公告)日：2005-09-27
申请号：US10418244
申请日：2003-04-16
申请人： Bryan A. Gillispie , Zhibo Zhao , John Robert Smith , Thomas Hubert Van Steenkiste , Alaa A. Elmoursi , Yang Luo , Hartley F. Hutchins
发明人： Bryan A. Gillispie , Zhibo Zhao , John Robert Smith , Thomas Hubert Van Steenkiste , Alaa A. Elmoursi , Yang Luo , Hartley F. Hutchins
IPC分类号： B23K1/00 , C23C24/04 , F28F19/06 , B32B15/01 , B05D1/02
CPC分类号： C23C24/04 , B23K1/0012 , B23K2101/14 , F28F19/06 , Y10S428/937 , Y10S428/94 , Y10T428/12014 , Y10T428/12028 , Y10T428/12063 , Y10T428/1209 , Y10T428/12493 , Y10T428/12639 , Y10T428/12736 , Y10T428/12764 , Y10T428/12792
摘要： The present invention is directed to a process for preparing aluminum and aluminum alloy surfaces in heat exchangers for brazing by depositing thereon a kinetic sprayed brazing composition. The process simultaneously deposits monolith or composite coatings that can include all braze materials and corrosion protection materials used in the brazing of aluminum fins to plates and tubes in a single stage.
摘要翻译：本发明涉及一种在用于钎焊的热交换器中通过在其上沉积动力喷涂钎焊组合物来制备铝和铝合金表面的方法。该工艺同时沉积单块或复合涂层，其可以包括在单个阶段将铝翅片钎焊到板和管的所有钎焊材料和防腐蚀材料。

7. 发明授权

US06821558B2 Method for direct application of flux to a brazing surface 有权
标题翻译：将焊剂直接施加到钎焊表面的方法
公开(公告)号：US06821558B2
公开(公告)日：2004-11-23
申请号：US10202308
申请日：2002-07-24
申请人： Zhibo Zhao , Bryan A. Gillispie , John R. Smith , Thomas Hubert Van Steenkiste , Yang Luo
发明人： Zhibo Zhao , Bryan A. Gillispie , John R. Smith , Thomas Hubert Van Steenkiste , Yang Luo
IPC分类号： B05D102
CPC分类号： B23K1/203
摘要： A method is for direct application of a brazing flux material to a brazing surface. The method includes the step of applying a brazing filler material to a substrate utilizing a kinetic spray process to form a brazing surface. Following application of the brazing filler material to the substrate brazing flux material can be directly applied to the brazing surface as either a dry powder or a wet slurry. The nature of the brazing surface allows the applied flux material to adhere to the surface without the utilization of additional binders or resin materials.
摘要翻译：一种方法是将钎焊剂材料直接施加到钎焊表面。该方法包括使用动力学喷涂工艺将钎料填充材料施加到基底上以形成钎焊表面的步骤。在将钎料填充到基底上之后，钎焊剂材料可以作为干粉或湿浆直接施加到钎焊表面。钎焊表面的性质允许施加的焊剂材料粘附到表面，而不需要使用附加的粘合剂或树脂材料。

8. 发明授权

US06254979B1 Low friction electrical terminals 失效
标题翻译：低摩擦电气端子
公开(公告)号：US06254979B1
公开(公告)日：2001-07-03
申请号：US09089630
申请日：1998-06-03
申请人： George Albert Drew , Mark S. Ricketts , Bryan A. Gillispie , Yang-Tse Cheng , Robert A. Suchanek
发明人： George Albert Drew , Mark S. Ricketts , Bryan A. Gillispie , Yang-Tse Cheng , Robert A. Suchanek
IPC分类号： B32B516
CPC分类号： H01R13/03 , B32B15/01 , B32B15/013 , B32B15/018 , C25D7/00 , Y10S428/929 , Y10T428/12014 , Y10T428/12569 , Y10T428/25 , Y10T428/254 , Y10T428/256 , Y10T428/26 , Y10T428/269 , Y10T428/273
摘要： A low friction, low contact resistance coating for electrical terminal members, especially members made of copper base alloys and low carbon steel alloys and plastics, is formed of a coarse electroplate of tin or silver characterized by grains having an average dimension in the range of about 0.5 to 10 micrometers where such grains carry very small particles of polytetrafluoroethylene or the like having average diameters in the range up to about 0.30 micrometers.
摘要翻译：用于电端子构件，特别是由铜基合金和低碳钢合金和塑料制成的构件的低摩擦，低接触电阻涂层由粗大的锡或银电镀层形成，其特征在于平均尺寸在约 0.5至10微米，其中这种晶粒携带非常小的聚四氟乙烯颗粒，其平均直径范围高达约0.30微米。

9. 发明授权

US06007390A Low friction metal-ceramic composite coatings for electrical contacts 失效
标题翻译：用于电触点的低摩擦金属 - 陶瓷复合涂层
公开(公告)号：US06007390A
公开(公告)日：1999-12-28
申请号：US109284
申请日：1998-06-30
申请人： Yang-Tse Cheng , George Albert Drew , Bryan A. Gillispie , Wen-Jin Meng
发明人： Yang-Tse Cheng , George Albert Drew , Bryan A. Gillispie , Wen-Jin Meng
IPC分类号： C23C14/06 , H01R13/03 , H01R9/24
CPC分类号： H01R13/03 , C23C14/0688 , Y10T428/12896
摘要： An electrical terminal is disclosed where the terminal is formed of an electrically-conductive metal substrate such as copper alloys, aluminum alloys or stainless steel with the substrate having a codeposited composite coating of titanium nitride and gold or silver on the surface. The coating provides wear resistance in high temperature and vibration environments while retaining and demonstrating low friction and low contact resistance properties.
摘要翻译：公开了一种电气端子，其中端子由诸如铜合金，铝合金或不锈钢的导电金属基板形成，其中基板具有表面上的氮化钛和金或银的共沉积复合涂层。涂层在高温和振动环境中提供耐磨性，同时保持和显示低摩擦和低接触电阻性能。

10. 发明授权

US07081376B2 Kinetically sprayed aluminum metal matrix composites for thermal management 有权
公开(公告)号：US07081376B2
公开(公告)日：2006-07-25
申请号：US10972919
申请日：2004-10-25
申请人： Donald T. Morelli , Alaa A. Elmoursi , Thomas H. Van Steenkiste , Brian K. Fuller , Bryan A. Gillispie , Daniel W. Gorkiewicz
发明人： Donald T. Morelli , Alaa A. Elmoursi , Thomas H. Van Steenkiste , Brian K. Fuller , Bryan A. Gillispie , Daniel W. Gorkiewicz
IPC分类号： H01L21/44
CPC分类号： C23C24/04
摘要： Disclosed is a method for forming a heat sink laminate and a heat sink laminate formed by the method. In the method a particle mixture is formed from a metal, an alloy or mixtures thereof with a ceramic or mixture of ceramics. The mixture is kinetically sprayed onto a first side of a dielectric material to form a metal matrix composite layer. The second side of the dielectric material is thermally coupled to a heat sink baseplate, thereby forming the heat sink laminate.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式