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    • 4. 发明申请
    • Computer and method for on-demand network access control
    • 用于按需网络访问控制的计算机和方法
    • US20060090023A1
    • 2006-04-27
    • US10973315
    • 2004-10-26
    • Claus OlsenChandrasekhar NarayanaswamiThomas Hildner
    • Claus OlsenChandrasekhar NarayanaswamiThomas Hildner
    • G06F13/00
    • H04L63/102G06F21/554G06F2221/2137H04L63/108
    • A computer and method that control access to a network. The computer includes an application that shrinks the window of opportunity for a network attack and reduces power consumption by automatically causing a computer to connect to the network when access is needed and to disconnect the computer from the network when access is not needed. The computer is automatically disconnected when it is deemed that network access is no longer needed, such as after a time period of no network activity. In turn, when the user, or the system, needs access to the network, the computer is automatically reconnected to the network. A software daemon on the computer may temporarily reconnect the computer to the network to access a server on the network to determine if attempts have been made to access the computer.
    • 控制对网络的访问的计算机和方法。 计算机包括缩小网络攻击机会窗口的应用程序,并在需要访问时自动使计算机连接到网络并在不需要访问时将计算机与网络断开连接,从而降低功耗。 当认为不再需要网络访问时,例如在没有网络活动的时间段之后,计算机将自动断开连接。 反过来,当用户或系统需要访问网络时,计算机将自动重新连接到网络。 计算机上的软件守护程序可能暂时将计算机重新连接到网络以访问网络上的服务器,以确定是否已尝试访问计算机。
    • 5. 发明申请
    • Mechanism for maintaining consistent thermal interface layer in an integrated circuit assembly
    • 在集成电路组件中保持一致的热界面层的机构
    • US20050133907A1
    • 2005-06-23
    • US10744835
    • 2003-12-23
    • Thomas HildnerVinod Kamath
    • Thomas HildnerVinod Kamath
    • H01L23/36H01L23/427H01L23/34
    • H01L23/4275H01L23/36H01L2924/0002H01L2924/00
    • An integrated circuit assembly includes an integrated circuit overlying a printed circuit board and a thermal solution interface such as a fan sink or a heat pipe overlying the integrated circuit. The lower surface of the thermal solution interface has a plurality of spacer structures to enforce a uniform displacement between the lower surface and an underlying surface contacted by the spacers. A heat transfer material, such as a thermal phase change material or a thermal grease, is positioned between the thermal solution interface and the underlying surface contacted by the spacers. The assembly may include a socket connected to the printed circuit board into which the integrated circuit is inserted. The spacers likely enforce a uniform displacement in the range of approximately 0.001 to 0.005 inches. The spacers may be configured as a set of substantially hemispherical protrusions or a set of substantially parallel elongated ridge protrusions.
    • 集成电路组件包括覆盖印刷电路板的集成电路和诸如风扇接收器或覆盖集成电路的热管的热解决方案接口。 热溶液界面的下表面具有多个间隔结构,以在下表面和与间隔物接触的下表面之间施加均匀位移。 传热材料,例如热相变材料或导热油脂,位于热溶液界面和与间隔物接触的下面的表面之间。 组件可以包括连接到印刷电路板的插座,集成电路插入该插座中。 间隔件可能在大约0.001至0.005英寸的范围内强制均匀位移。 间隔件可以被配置为一组基本上半球形的突起或一组基本上平行的细长突起。