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    • 1. 发明申请
    • Intergrated semiconductor memory and method for producing an integrated semiconductor memory
    • 集成半导体存储器和集成半导体存储器的制造方法
    • US20060291268A1
    • 2006-12-28
    • US11441805
    • 2006-05-26
    • Thomas HappCay-Uwe PinnowRalf SymanczykKlaus-Dieter Ufert
    • Thomas HappCay-Uwe PinnowRalf SymanczykKlaus-Dieter Ufert
    • G11C17/00
    • H01L45/06H01L45/1233H01L45/1246H01L45/144H01L45/1666
    • An integrated semiconductor memory includes a storage medium (6) arranged between two electrodes (10, 20), which storage medium may be a phase change medium, for example. The storage medium (6) can be put into a first state or a second state by means of an electric current, as a result of which an item of information can be stored. According to embodiments of the invention, a layer plane (L) is provided in which impurity particles made from a material (4) are embedded, as a result of which the current density in the storage medium is locally increased and the programming current required for reprogramming is reduced. As a result, the current consumption of memory elements containing a phase change medium is reduced, so that for the first time they can be embodied with minimal feature size, together with other components such as transistors, and integrated into a single semiconductor circuit and no longer have to be arranged in separate subcircuits.
    • 集成半导体存储器包括布置在两个电极(10,20)之间的存储介质(6),该存储介质可以是例如相变介质。 存储介质(6)可以通过电流进入第一状态或第二状态,结果可以存储信息项。 根据本发明的实施例,提供了一种层状平面(L),其中嵌入由材料(4)制成的杂质颗粒,结果存储介质中的电流密度局部增加,并且需要编程电流 重编程减少。 结果,包含相变介质的存储元件的电流消耗减少,使得它们可以首次以最小的特征尺寸与其他元件(例如晶体管)一体化,并且集成到单个半导体电路中,并且不存在 更长的时间必须在单独的子电路中排列。
    • 2. 发明授权
    • Integrated circuit having a resistive memory
    • 具有电阻存储器的集成电路
    • US07787279B2
    • 2010-08-31
    • US11441805
    • 2006-05-26
    • Thomas D. HappCay-Uwe PinnowRalf SymanczykKlaus-Dieter Ufert
    • Thomas D. HappCay-Uwe PinnowRalf SymanczykKlaus-Dieter Ufert
    • G11C11/00
    • H01L45/06H01L45/1233H01L45/1246H01L45/144H01L45/1666
    • An integrated semiconductor memory includes a storage medium (6) arranged between two electrodes (10, 20), which storage medium may be a phase change medium, for example. The storage medium (6) can be put into a first state or a second state by means of an electric current, as a result of which an item of information can be stored. According to embodiments of the invention, a layer plane (L) is provided in which impurity particles made from a material (4) are embedded, as a result of which the current density in the storage medium is locally increased and the programming current required for reprogramming is reduced. As a result, the current consumption of memory elements containing a phase change medium is reduced, so that for the first time they can be embodied with minimal feature size, together with other components such as transistors, and integrated into a single semiconductor circuit and no longer have to be arranged in separate subcircuits.
    • 集成半导体存储器包括布置在两个电极(10,20)之间的存储介质(6),该存储介质可以是例如相变介质。 存储介质(6)可以通过电流进入第一状态或第二状态,结果可以存储信息项。 根据本发明的实施例,提供了一种层状平面(L),其中嵌入由材料(4)制成的杂质颗粒,结果存储介质中的电流密度局部增加,并且需要编程电流 重编程减少。 结果,包含相变介质的存储元件的电流消耗减少,使得它们可以首次以最小的特征尺寸与其他元件(例如晶体管)一体化,并且集成到单个半导体电路中,并且不存在 更长的时间必须在单独的子电路中排列。
    • 3. 发明授权
    • Fabricating memory components (PCRAMS) including memory cells based on a layer that changes phase state
    • 基于改变阶段状态的层,构建存储器组件(PCRAMS),包括存储器单元
    • US07329561B2
    • 2008-02-12
    • US11210112
    • 2005-08-24
    • Ralf SymanczykCay-Uwe PinnowThomas Happ
    • Ralf SymanczykCay-Uwe PinnowThomas Happ
    • H01L21/06
    • H01L45/144H01L27/2436H01L45/06H01L45/1233H01L45/1246H01L45/1273H01L45/16
    • A method is describe for fabricating memory components including memory cells based on an active material of an active layer, the phase state of which can be changed and which is enclosed between a bottom electrode and a top electrode. To reduce the current intensity of the programming current and the erase current required for programming and erasing of the memory element and therefore the quantity of heat which is required to change the phase state, a nanoporous aluminium oxide layer is used as a mask during the production of the active layer or the interface with the electrodes. The nanoporous aluminium oxide layer can be used as a positive mask, as a negative mask, or used directly as an insulating current aperture. The contact surface between electrode and active layer can be set in virtually any desired form by varying the process parameters of the aluminium oxide mask. Since the typical cell area of the memory cell is significantly larger than the mean diameter of the nanopores, a good homogeneity and reproducibility of the contacts results from a production engineering standpoint.
    • 描述了一种用于制造包括基于有源层的活性材料的存储器单元的存储器组件的方法,该有源层的相位状态可以被改变并且被包围在底部电极和顶部电极之间。 为了降低编程电流的电流强度和存储元件的编程和擦除所需的擦除电流以及因此改变相位状态所需的热量,在生产过程中使用纳米孔氧化铝层作为掩模 的活性层或与电极的界面。 纳米多孔氧化铝层可以用作正掩模,作为负掩模,或直接用作绝缘电流孔。 通过改变氧化铝掩模的工艺参数,电极和有源层之间的接触表面可以几乎任意形成。 由于存储单元的典型单元面积显着大于纳米孔的平均直径,所以从生产工程的观点来看,接触的良好的均匀性和再现性。
    • 4. 发明申请
    • Fabricating memory components (PCRAMS) including memory cells based on a layer that changes phase state
    • 基于改变阶段状态的层,构建存储器组件(PCRAMS),包括存储器单元
    • US20060046379A1
    • 2006-03-02
    • US11210112
    • 2005-08-24
    • Ralf SymanczykCay-Uwe PinnowThomas Happ
    • Ralf SymanczykCay-Uwe PinnowThomas Happ
    • H01L21/8244
    • H01L45/144H01L27/2436H01L45/06H01L45/1233H01L45/1246H01L45/1273H01L45/16
    • A method is describe for fabricating memory components including memory cells based on an active material of an active layer, the phase state of which can be changed and which is enclosed between a bottom electrode and a top electrode. To reduce the current intensity of the programming current and the erase current required for programming and erasing of the memory element and therefore the quantity of heat which is required to change the phase state, a nanoporous aluminium oxide layer is used as a mask during the production of the active layer or the interface with the electrodes. The nanoporous aluminium oxide layer can be used as a positive mask, as a negative mask, or used directly as an insulating current aperture. The contact surface between electrode and active layer can be set in virtually any desired form by varying the process parameters of the aluminium oxide mask. Since the typical cell area of the memory cell is significantly larger than the mean diameter of the nanopores, a good homogeneity and reproducibility of the contacts results from a production engineering standpoint.
    • 描述了一种用于制造包括基于有源层的活性材料的存储器单元的存储器组件的方法,该有源层的相位状态可以被改变并且被包围在底部电极和顶部电极之间。 为了降低编程电流的电流强度和存储元件的编程和擦除所需的擦除电流以及因此改变相位状态所需的热量,在生产过程中使用纳米孔氧化铝层作为掩模 的活性层或与电极的界面。 纳米多孔氧化铝层可以用作正掩模,作为负掩模,或直接用作绝缘电流孔。 通过改变氧化铝掩模的工艺参数,电极和有源层之间的接触表面可以几乎任意形成。 由于存储单元的典型单元面积显着大于纳米孔的平均直径,所以从生产工程的观点来看,接触的良好的均匀性和再现性。