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1. 发明申请

US20120021170A1 Micro-Machined Structure Production Using Encapsulation 失效
标题翻译：使用封装的微加工结构生产
公开(公告)号：US20120021170A1
公开(公告)日：2012-01-26
申请号：US13248660
申请日：2011-09-29
申请人： Thomas Hantschel , Sven Kosgalwies , Eugene M. Chow , Gordon Todd Jagerson, JR.
发明人： Thomas Hantschel , Sven Kosgalwies , Eugene M. Chow , Gordon Todd Jagerson, JR.
IPC分类号： B32B3/22
CPC分类号： B81C1/00666 , G01R1/06755 , G01R1/07357 , H01L2924/00013 , H01L2924/01006 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H05K3/4092 , Y10T29/49146 , Y10T29/49147 , Y10T29/49204 , Y10T428/13 , Y10T428/1317 , Y10T428/24174 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.
摘要翻译：微加工（例如，应力工程弹簧）结构通过形成剥离层，形成部分或完全封装的梁/弹簧结构，然后通过蚀刻释放层来释放梁/弹簧结构来制造。封装结构在释放期间保护梁/弹簧，因此释放层和梁/弹簧都可以使用电镀和/或使用相同的材料形成。封装结构可以是金属，抗蚀剂，聚合物，氧化物或氮化物，并且可以在释放过程之后被去除，或者作为完成的微加工结构的一部分保留。

2. 发明授权

US08080293B2 Micro-machined structure production using encapsulation 有权
标题翻译：微加工结构生产采用封装
公开(公告)号：US08080293B2
公开(公告)日：2011-12-20
申请号：US12728047
申请日：2010-03-19
申请人： Thomas Hantschel , Sven Kosgalwies , Eugene M. Chow , Gordon Todd Jagerson, Jr.
发明人： Thomas Hantschel , Sven Kosgalwies , Eugene M. Chow , Gordon Todd Jagerson, Jr.
IPC分类号： H01R12/00
CPC分类号： B81C1/00666 , G01R1/06755 , G01R1/07357 , H01L2924/00013 , H01L2924/01006 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H05K3/4092 , Y10T29/49146 , Y10T29/49147 , Y10T29/49204 , Y10T428/13 , Y10T428/1317 , Y10T428/24174 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.
摘要翻译：微加工（例如，应力工程弹簧）结构通过形成剥离层，形成部分或完全封装的梁/弹簧结构，然后通过蚀刻释放层来释放梁/弹簧结构来制造。封装结构在释放期间保护梁/弹簧，因此释放层和梁/弹簧都可以使用电镀和/或使用相同的材料形成。封装结构可以是金属，抗蚀剂，聚合物，氧化物或氮化物，并且可以在释放过程之后被去除，或者作为完成的微加工结构的一部分保留。

3. 发明授权

US08435612B2 Micro-machined structure production using encapsulation 失效
标题翻译：微加工结构生产采用封装
公开(公告)号：US08435612B2
公开(公告)日：2013-05-07
申请号：US13248660
申请日：2011-09-29
申请人： Thomas Hantschel , Sven Kosgalwies , Eugene M. Chow , Gordon Todd Jagerson, Jr.
发明人： Thomas Hantschel , Sven Kosgalwies , Eugene M. Chow , Gordon Todd Jagerson, Jr.
IPC分类号： B32B3/22
CPC分类号： B81C1/00666 , G01R1/06755 , G01R1/07357 , H01L2924/00013 , H01L2924/01006 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H05K3/4092 , Y10T29/49146 , Y10T29/49147 , Y10T29/49204 , Y10T428/13 , Y10T428/1317 , Y10T428/24174 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.
摘要翻译：微加工（例如，应力工程弹簧）结构通过形成剥离层，形成部分或完全封装的梁/弹簧结构，然后通过蚀刻释放层来释放梁/弹簧结构来制造。封装结构在释放期间保护梁/弹簧，因此释放层和梁/弹簧都可以使用电镀和/或使用相同的材料形成。封装结构可以是金属，抗蚀剂，聚合物，氧化物或氮化物，并且可以在释放过程之后被去除，或者作为完成的微加工结构的一部分保留。

4. 发明申请

US20100184311A1 Micro-Machined Structure Production Using Encapsulation 有权
标题翻译：使用封装的微加工结构生产
公开(公告)号：US20100184311A1
公开(公告)日：2010-07-22
申请号：US12728047
申请日：2010-03-19
申请人： Thomas Hantschel , Sven Kosgalwies , Eugene M. Chow , Gordon Todd Jagerson, JR.
发明人： Thomas Hantschel , Sven Kosgalwies , Eugene M. Chow , Gordon Todd Jagerson, JR.
IPC分类号： H01R12/00
CPC分类号： B81C1/00666 , G01R1/06755 , G01R1/07357 , H01L2924/00013 , H01L2924/01006 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H05K3/4092 , Y10T29/49146 , Y10T29/49147 , Y10T29/49204 , Y10T428/13 , Y10T428/1317 , Y10T428/24174 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.
摘要翻译：微加工（例如，应力工程弹簧）结构通过形成剥离层，形成部分或完全封装的梁/弹簧结构，然后通过蚀刻释放层来释放梁/弹簧结构来制造。封装结构在释放期间保护梁/弹簧，因此释放层和梁/弹簧都可以使用电镀和/或使用相同的材料形成。封装结构可以是金属，抗蚀剂，聚合物，氧化物或氮化物，并且可以在释放过程之后被去除，或者作为完成的微加工结构的一部分保留。

5. 发明授权

US07730615B2 Micro-machined structure production using encapsulation 有权
标题翻译：微加工结构生产采用封装
公开(公告)号：US07730615B2
公开(公告)日：2010-06-08
申请号：US12037890
申请日：2008-02-26
申请人： Thomas Hantschel , Sven Kosgalwies , Eugene M. Chow , Gordon Todd Jagerson, Jr.
发明人： Thomas Hantschel , Sven Kosgalwies , Eugene M. Chow , Gordon Todd Jagerson, Jr.
IPC分类号： H01R43/16
CPC分类号： B81C1/00666 , G01R1/06755 , G01R1/07357 , H01L2924/00013 , H01L2924/01006 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H05K3/4092 , Y10T29/49146 , Y10T29/49147 , Y10T29/49204 , Y10T428/13 , Y10T428/1317 , Y10T428/24174 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.
摘要翻译：微加工（例如，应力工程弹簧）结构通过形成剥离层，形成部分或完全封装的梁/弹簧结构，然后通过蚀刻释放层来释放梁/弹簧结构来制造。封装结构在释放期间保护梁/弹簧，因此释放层和梁/弹簧都可以使用电镀和/或使用相同的材料形成。封装结构可以是金属，抗蚀剂，聚合物，氧化物或氮化物，并且可以在释放过程之后被去除，或者作为完成的微加工结构的一部分保留。

6. 发明申请

US20080146052A1 Micro-machined structure production using encapsulation 有权
公开(公告)号：US20080146052A1
公开(公告)日：2008-06-19
申请号：US12037890
申请日：2008-02-26
申请人： Thomas Hantschel , Sven Kosgalwies , Eugene M. Chow , Gordon Todd Jagerson
发明人： Thomas Hantschel , Sven Kosgalwies , Eugene M. Chow , Gordon Todd Jagerson
IPC分类号： H05K1/02 , H01R43/16
CPC分类号： B81C1/00666 , G01R1/06755 , G01R1/07357 , H01L2924/00013 , H01L2924/01006 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H05K3/4092 , Y10T29/49146 , Y10T29/49147 , Y10T29/49204 , Y10T428/13 , Y10T428/1317 , Y10T428/24174 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.

7. 发明授权

US07356920B2 Micro-machined structure production using encapsulation 失效
标题翻译：微加工结构生产采用封装
公开(公告)号：US07356920B2
公开(公告)日：2008-04-15
申请号：US10986712
申请日：2004-11-12
申请人： Thomas Hantschel , Sven Kosgalwies , Eugene M. Chow , Gordon Todd Jagerson, Jr.
发明人： Thomas Hantschel , Sven Kosgalwies , Eugene M. Chow , Gordon Todd Jagerson, Jr.
IPC分类号： H05K3/30
CPC分类号： B81C1/00666 , G01R1/06755 , G01R1/07357 , H01L2924/00013 , H01L2924/01006 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H05K3/4092 , Y10T29/49146 , Y10T29/49147 , Y10T29/49204 , Y10T428/13 , Y10T428/1317 , Y10T428/24174 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.
摘要翻译：微加工（例如，应力工程弹簧）结构通过形成剥离层，形成部分或完全封装的梁/弹簧结构，然后通过蚀刻释放层来释放梁/弹簧结构来制造。封装结构在释放期间保护梁/弹簧，因此释放层和梁/弹簧都可以使用电镀和/或使用相同的材料形成。封装结构可以是金属，抗蚀剂，聚合物，氧化物或氮化物，并且可以在释放过程之后被去除，或者作为完成的微加工结构的一部分保留。

8. 发明申请

US20090077807A1 Self-Releasing Spring Structures And Methods 有权
标题翻译：自我释放弹簧结构与方法
公开(公告)号：US20090077807A1
公开(公告)日：2009-03-26
申请号：US12256060
申请日：2008-10-22
申请人： Thomas Hantschel , Sven Kosgalwies , David K. Fork , Eugene M. Chow
发明人： Thomas Hantschel , Sven Kosgalwies , David K. Fork , Eugene M. Chow
IPC分类号： B23P13/00
CPC分类号： G01R1/06716 , G01R3/00 , Y10T29/49609
摘要： According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing layer is disclosed, wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer. Moreover, a method of manufacturing a spring device, according to various exemplary embodiments, includes providing a substrate, providing a self-releasing layer over the substrate and providing a stressed-metal layer over the self-releasing layer wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer is also disclosed in this invention.
摘要翻译：根据各种示例性实施例，公开了一种弹簧装置，其包括基板，设置在基板上的自放电层和设置在自放电层上的应力金属层，其中应力金属层内部的应力量导致剥离力高于自释放层和应力金属层之间的粘附力。此外，根据各种示例性实施例的制造弹簧装置的方法包括提供衬底，在衬底上提供自释放层，并在自释放层上方提供应力金属层，其中，在本发明中也公开了应力金属层导致比自发层和应力金属层之间的粘附力高的剥离力。

9. 发明授权

US07943504B2 Self-releasing spring structures and methods 有权
标题翻译：自释弹簧结构及方法
公开(公告)号：US07943504B2
公开(公告)日：2011-05-17
申请号：US12256060
申请日：2008-10-22
申请人： Thomas Hantschel , Sven Kosgalwies , David K. Fork , Eugene M. Chow
发明人： Thomas Hantschel , Sven Kosgalwies , David K. Fork , Eugene M. Chow
IPC分类号： H01L21/4763
CPC分类号： G01R1/06716 , G01R3/00 , Y10T29/49609
摘要： According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing layer is disclosed, wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer. Moreover, a method of manufacturing a spring device, according to various exemplary embodiments, includes providing a substrate, providing a self-releasing layer over the substrate and providing a stressed-metal layer over the self-releasing layer wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer is also disclosed in this invention.
摘要翻译：根据各种示例性实施例，公开了一种弹簧装置，其包括基板，设置在基板上的自放电层和设置在自放电层上的应力金属层，其中应力金属层内部的应力量导致剥离力高于自释放层和应力金属层之间的粘附力。此外，根据各种示例性实施例的制造弹簧装置的方法包括提供衬底，在衬底上提供自释放层，并在自释放层上方提供应力金属层，其中，在本发明中也公开了应力金属层导致比自发层和应力金属层之间的粘附力高的剥离力。

10. 发明授权

US07456092B2 Self-releasing spring structures and methods 有权
标题翻译：自释弹簧结构及方法
公开(公告)号：US07456092B2
公开(公告)日：2008-11-25
申请号：US10959180
申请日：2004-10-07
申请人： Thomas Hantschel , Sven Kosgalwies , David K. Fork , Eugene M. Chow
发明人： Thomas Hantschel , Sven Kosgalwies , David K. Fork , Eugene M. Chow
IPC分类号： H01L21/4763
CPC分类号： G01R1/06716 , G01R3/00 , Y10T29/49609
摘要： According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing layer is disclosed, wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer. Moreover, a method of manufacturing a spring device, according to various exemplary embodiments, includes providing a substrate, providing a self-releasing layer over the substrate and providing a stressed-metal layer over the self-releasing layer wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer is also disclosed in this invention.
摘要翻译：根据各种示例性实施例，公开了一种弹簧装置，其包括基板，设置在基板上的自放电层和设置在自放电层上的应力金属层，其中应力金属层内部的应力量导致剥离力高于自释放层和应力金属层之间的粘附力。此外，根据各种示例性实施例的制造弹簧装置的方法包括提供衬底，在衬底上提供自释放层，并在自释放层上方提供应力金属层，其中，在本发明中也公开了应力金属层导致比自发层和应力金属层之间的粘附力高的剥离力。

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