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    • 8. 发明授权
    • Molding materials, containing imide group-containing aromatic polyamides
and process for their preparation
    • 含有含酰亚胺基团的芳族聚酰胺的成型材料及其制备方法
    • US4868272A
    • 1989-09-19
    • US250610
    • 1988-09-29
    • Juergen FinkeMartin BartmannFriedrich-Georg Schmidt
    • Juergen FinkeMartin BartmannFriedrich-Georg Schmidt
    • C08L77/10C08G69/32C08G73/14C08L77/00C08L79/08
    • C08G73/14C08G69/32
    • A molding material comprising an imide group-containing aromatic polyamide, obtained by polycondensation of(A) an aromatic diamine of the general formulaH.sub.2 N--Ar--O--Ar'--X--Ar'--O--Ar--NH.sub.2wherein Ar and Ar' are m- or p-phenylene groups and X is --SO.sub.2 -- or --CO--, with at least one aromatic dicarboxylic acid B) selected from the group consisting of(B1) a mixture comprising 40 to 100 mole % of an acid of the structure ##STR1## and 60 to 0 mole % of an acid of the structure ##STR2## in which n is 0-4 and R is selected from the group consisting of (a) an alkyl group having 1-6 carbon atoms,(b) an unsubstituted phenyl or an alkyl- or aryl substituted phenyl group,(c) an alkoxy group having 1-6 atoms,(d) a phenoxy group, in which the phenyl ring is unsubstituted or is alkyl- or aryl substituted, and(e) a halogen,(B2) an acid of the structure ##STR3## and (B3) a dicarboxylic acid of the formulaHO.sub.2 C--Ar--(A--Ar).sub.p --CO.sub.2 Hwherein Ar is m-phenylene or p-phenylene, A=--O--, --S--, --SO.sub.2 --, or --CO--, and p=0 or 1, and(C) an aromatic dicarboxylic acid anhydride of the formula ##STR4## in which R and n are as defined above.
    • 通过(A)通式为H 2 N-Ar-O-Ar'-X-Ar'-O-Ar-NH 2的芳族二胺缩聚得到的含酰亚胺基的芳族聚酰胺的成型材料,其中Ar和Ar' 是间 - 或对亚苯基,X是-SO 2 - 或-CO-,至少一种芳族二羧酸B)选自(B1)包含40-100mol%的 结构和60〜0摩尔%的结构的酸,其中n为0-4,R选自(a)具有1-6个碳原子的烷基,(b )未取代的苯基或烷基或芳基取代的苯基,(c)具有1-6个原子的烷氧基,(d)苯氧基,其中苯环是未取代的或者是烷基或芳基取代的,和( e)卤素,(B2)结构的酸和(B3)式HO2C-Ar-(A-Ar)p-CO2H的二羧酸,其中Ar是间亚苯基或对亚苯基,A = -O-,-S-,-SO 2 - 或-CO-,p = 0或1, 和(C)式“IMAGE”的芳族二羧酸酐,其中R和n如上所定义。