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1. 发明授权

US06631546B1 Self-aligned void filling for mushroomed plating 失效
标题翻译：自对准空隙填充为蘑菇电镀
公开(公告)号：US06631546B1
公开(公告)日：2003-10-14
申请号：US09496070
申请日：2000-02-01
申请人： Thomas Edward Dinan , Richard Hsiao , John I. Kim , Ashok Lahiri , Clinton David Snyder
发明人： Thomas Edward Dinan , Richard Hsiao , John I. Kim , Ashok Lahiri , Clinton David Snyder
IPC分类号： G11R5127
CPC分类号： C25D5/022 , G11B5/127 , G11B5/3163 , Y10T29/49032 , Y10T29/49155 , Y10T29/49156
摘要： A method of manufacturing includes 2 mushroom plating process starts with an overplated component which includes an enlarged mushroom head having outer portions which overhang a resist layer. The next step in the first process embodiment is a heating step in which the resist layer is hard baked. Thereafter, using a dry etch process, such as a reactive ion etch (RIE) process, the hard baked resist layer is removed in all areas except beneath the overhang of the mushroom head. The area beneath the overhang thereby remains filled with hard baked resist. Thereafter, the device is ultimately encapsulated such that no voids and/or redeposition problems exist under the overhang due to the presence of the hard baked resist. In an alternative process embodiment of the present invention the dry etch process is conducted first upon the resist layer, such that the resist layer is removed in all areas except under the overhang. Thereafter, the device is baked, such that hard baked resist remains beneath the overhang. Ultimately, the device is encapsulated and no voids or redeposition problems exist beneath the overhang due to the presence of the hard baked resist.
摘要翻译：一种制造方法包括2个蘑菇电镀工艺，其中包括一个具有外伸部分的扩大的蘑菇头的一个过度的部件，其上覆盖了一个抗蚀剂层。第一工艺实施例中的下一步骤是其中抗蚀剂层被硬烘烤的加热步骤。此后，使用诸如反应离子蚀刻（RIE）工艺的干蚀刻工艺，除了在蘑菇头的突出部以外的所有区域中除去硬烘烤抗蚀剂层。悬挂下方的区域由此保持充满硬烘烤抗蚀剂。此后，装置最终被封装，使得由于存在硬烘烤抗蚀剂而在悬垂下不存在空隙和/或再沉积问题。在本发明的替代方法实施方案中，首先在抗蚀剂层上进行干蚀刻工艺，使得除了在悬垂体之外的所有区域中除去抗蚀剂层。此后，该装置被烘烤，使得硬烘烤抗蚀剂保留在悬垂物的下方。最终，器件被封装，由于存在硬烘烤的抗蚀剂，悬臂下方不存在空隙或再沉积问题。

2. 发明授权

US07123443B2 Self-aligned void filling for mushroomed plating 失效
标题翻译：自对准空隙填充为蘑菇电镀
公开(公告)号：US07123443B2
公开(公告)日：2006-10-17
申请号：US10617322
申请日：2003-07-09
申请人： Thomas Edward Dinan , Richard Hsiao , John I. Kim , Ashok Lahiri , Clinton David Snyder
发明人： Thomas Edward Dinan , Richard Hsiao , John I. Kim , Ashok Lahiri , Clinton David Snyder
IPC分类号： G11B5/17
CPC分类号： C25D5/022 , G11B5/127 , G11B5/3163 , Y10T29/49032 , Y10T29/49155 , Y10T29/49156
摘要： The present invention includes an overplated component which includes an enlarged mushroom head having outer portions which overhang a hard baked resist layer. The device is ultimately encapsulated such that no voids and/or redeposition problems exist under the overhang due to the presence of the hard baked resist. While not intended to be limiting in any manner, a device of the present invention is a thin film magnetic head wherein the yoke portion of a magnetic pole is formed utilizing the mushroom plating techniques of the present invention. Another mushroom plated component found in many devices is a mushroom plated electrical interconnecting stud that is formed utilizing the process steps of the present invention.
摘要翻译：本发明包括一个外延部件，它包括一个扩大的蘑菇头部，其具有伸出硬烘烤抗蚀剂层的外部部分。该装置最终被包封，使得由于硬烘烤抗蚀剂的存在而在悬垂下不存在空隙和/或再沉积问题。虽然不是以任何方式限制，但是本发明的装置是薄膜磁头，其中利用本发明的蘑菇电镀技术形成磁极的磁轭部分。在许多装置中发现的另一种蘑菇电镀组件是利用本发明的方法步骤形成的蘑菇电镀电互连柱。

3. 发明授权

US07127800B2 Narrow write head pole tip fabricated by sidewall processing 失效
标题翻译：通过侧壁加工制造的窄写头磁极尖端
公开(公告)号：US07127800B2
公开(公告)日：2006-10-31
申请号：US10610970
申请日：2003-06-30
申请人： Thomas Edward Dinan , Richard Hsiao
发明人： Thomas Edward Dinan , Richard Hsiao
IPC分类号： G11B5/187 , C25D5/02
CPC分类号： G11B5/3163 , G11B5/012 , G11B5/3116 , Y10T29/49043 , Y10T29/49044 , Y10T29/49046 , Y10T29/4906
摘要： The magnetic head includes a P2 pole tip in which the P2 pole tip material is electroplated upon a sidewall of the P2 pole tip photolithographic trench. To accomplish this, a block of material is deposited upon a write gap layer, such that a generally straight, vertical sidewall of the block of material is disposed at the P2 pole tip location. Thereafter, an electroplating seed layer is deposited upon the sidewall. A P2 pole tip trench is photolithographically fabricated such that the sidewall (with its deposited seed layer) is exposed within the P2 pole tip trench. Thereafter, the P2 pole tip is formed by electroplating pole tip material upon the seed layer and outward from the sidewall within the trench. The width of the P2 pole tip is thus determined by the quantity of pole tip material that is deposited upon the sidewall.
摘要翻译：磁头包括P 2极尖端，其中P 2极尖端材料电镀在P 2极端光刻沟槽的侧壁上。为了实现这一点，一块材料沉积在写间隙层上，使得材料块的大致直的垂直侧壁设置在P 2极尖端位置处。此后，电镀种子层沉积在侧壁上。光刻地制造P 2极端沟槽，使得侧壁（其沉积的种子层）暴露在P 2极尖端沟槽内。此后，P 2极端部通过将电极端部材料电镀在种子层上并且从沟槽内的侧壁向外而形成。因此，P 2极尖的宽度由沉积在侧壁上的极尖材料的量决定。

4. 发明授权

US06507456B1 Dual coil and lead connections fabricated by image transfer and selective etch 失效
标题翻译：通过图像传输和选择性蚀刻制造的双线圈和引线连接
公开(公告)号：US06507456B1
公开(公告)日：2003-01-14
申请号：US09651149
申请日：2000-08-30
申请人： Thomas Edward Dinan , Richard Hsiao , Eric James Lee , Scott A. MacDonald
发明人： Thomas Edward Dinan , Richard Hsiao , Eric James Lee , Scott A. MacDonald
IPC分类号： G11B517
CPC分类号： G11B5/17 , G11B5/313 , G11B5/3163
摘要： A magnetic head including a dual layer induction coil fabricated by reactive ion etching (RIE) techniques. An etch stop layer and an etchable insulation material layer and an induction coil etching mask are fabricated on a first magnetic pole. Induction coil trenches are thereafter RIE etched into the insulation material to the etch stop layer, and the first induction coil is fabricated into the induction coil trenches. Following a chemical mechanical polishing (CMP) step, a second etch stop layer, a second layer of etchable insulation material and a second induction coil etching mask are fabricated. Second induction coil trenches are RIE etched into the second insulation material layer to the second etch stop layer, and a second induction coil is fabricated into the second induction coil trenches. A second CMP step is followed by an insulation layer and the fabrication of a second magnetic pole (P2) upon the insulation layer.
摘要翻译：包括通过反应离子蚀刻（RIE）技术制造的双层感应线圈的磁头。在第一磁极上制造蚀刻停止层和可蚀刻绝缘材料层和感应线圈蚀刻掩模。此后，感应线圈沟槽RIE蚀刻到绝缘材料到蚀刻停止层，并且第一感应线圈被制造成感应线圈沟槽。在化学机械抛光（CMP）步骤之后，制造第二蚀刻停止层，第二层可蚀刻绝缘材料和第二感应线圈蚀刻掩模。将第二感应线圈沟槽RIE蚀刻到第二绝缘材料层到第二蚀刻停止层，并且将第二感应线圈制造成第二感应线圈沟槽。第二CMP步骤之后是绝缘层，并且在绝缘层上制造第二磁极（P2）。

5. 发明授权

US07199972B2 Narrow write head pole tip fabricated by sidewall processing 失效
标题翻译：通过侧壁加工制造的窄写头磁极尖端
公开(公告)号：US07199972B2
公开(公告)日：2007-04-03
申请号：US09944648
申请日：2001-08-31
申请人： Thomas Edward Dinan , Richard Hsiao
发明人： Thomas Edward Dinan , Richard Hsiao
IPC分类号： G11B5/127
CPC分类号： G11B5/3163 , G11B5/012 , G11B5/3116 , Y10T29/49043 , Y10T29/49044 , Y10T29/49046 , Y10T29/4906
摘要： The magnetic head includes a P2 pole tip in which the P2 pole tip material is electroplated upon a sidewall of the P2 pole tip photolithographic trench. To accomplish this, a block of material is deposited upon a write gap layer, such that a generally straight, vertical sidewall of the block of material is disposed at the P2 pole tip location. Thereafter, an electroplating seed layer is deposited upon the sidewall. A P2 pole tip trench is photolithographically fabricated such that the sidewall (with its deposited seed layer) is exposed within the P2 pole tip trench. Thereafter, the P2 pole tip is formed by electroplating pole tip material upon the seed layer and outward from the sidewall within the trench, The width of the P2 pole tip is thus determined by the quantity of pole tip material that is deposited upon the sidewall.
摘要翻译：磁头包括P2极尖端，其中P2极尖端材料电镀在P2极尖端光刻沟槽的侧壁上。为了实现这一点，一块材料沉积在写间隙层上，使得材料块的大致直的垂直侧壁设置在P2极尖端位置处。此后，电镀种子层沉积在侧壁上。通过光刻方法制造P2极端沟槽，使得侧壁（其沉积的种子层）暴露在P2极尖端沟槽内。此后，P2极端部通过在种子层上电镀极尖材料并且在沟槽内从侧壁向外侧形成。因此，P2极尖端的宽度由沉积在侧壁上的极尖材料的量决定。

6. 发明授权

US06855240B2 CoFe alloy film and process of making same 失效
标题翻译： CoFe合金薄膜及其制作方法
公开(公告)号：US06855240B2
公开(公告)日：2005-02-15
申请号：US10457194
申请日：2003-06-09
申请人： Emanuel Israel Cooper , Thomas Edward Dinan , Lubomyr Taras Romankiw , Hong Xu
发明人： Emanuel Israel Cooper , Thomas Edward Dinan , Lubomyr Taras Romankiw , Hong Xu
IPC分类号： H01F10/16 , H01F41/26 , D25D3/56
CPC分类号： H01F41/26 , H01F10/16
摘要： A cobalt-iron alloy film having saturation magnetization of at least about 2.30 Telsa. The film alloy includes about 55 wt % to about 75 wt. % iron and the remainder cobalt. The film is made by a process in which the film is electrodeposited from an aqueous medium which includes one or more ferrous salts, one or more cobaltous salts, a buffer having a pKa of about 6 to about 8, at least one carboxylic acid having a pKa of between about 3.5 and about 5.5, an aromatic sulfinic acid or its salt and optionally, a halide salt and/or a surfactant. The alloy film is useful as a write head in magnetic recording.
摘要翻译：具有至少约2.30Telsa的饱和磁化强度的钴 - 铁合金膜。膜合金包括约55重量％至约75重量％％铁和其余钴。该膜通过一种方法制备，其中该膜从包含一种或多种亚铁盐，一种或多种钴盐，含有约6至约8的pKa的缓冲液，至少一种羧酸的水性介质电沉积，约3.5至约5.5的pKa，芳族亚磺酸或其盐以及任选的卤化物盐和/或表面活性剂。合金膜可用作磁记录中的写头。

7. 发明授权

US06876507B2 High-saturation thin-film write head for high-coercivity magnetic data storage media 有权
标题翻译：用于高矫顽力磁数据存储介质的高饱和度薄膜写头
公开(公告)号：US06876507B2
公开(公告)日：2005-04-05
申请号：US10054554
申请日：2002-01-18
申请人： Mike Ming Yu Chen , Thomas Edward Dinan , Paul Phong Nguyen , Neil Leslie Robertson
发明人： Mike Ming Yu Chen , Thomas Edward Dinan , Paul Phong Nguyen , Neil Leslie Robertson
IPC分类号： G11B5/60 , G11B15/18
CPC分类号： G11B5/6005
摘要： A thin-film write head employing pole pieces formed of an electroplated body-centered cubic (BCC) nickel-iron alloy with a saturation flux density (BS) of 1.9 to 2.3 T (19 to 23 kG) and an acceptable coercivity (HC) of about 80 to about 160 A/m (1-2 Oe). The iron content of the electroplated nickel-iron alloy is from 64% to 81% by weight. The two-layer pole fabrication process holds magnetic anisotropy and coercivity to useable values while improving saturation flux density and optimizing magnetostriction. This is accomplished by first electroplating a BCC nickel-iron layer onto an underlying seed layer and then annealing the two layers to reduce coercivity to less than about 160 amps/meter and raise magnetization to acceptable levels.
摘要翻译：使用由电感体心立方（BCC）镍铁合金形成的极片的薄膜写头，其饱和磁通密度（BS）为1.9至2.3T（19至23kG）和可接受的矫顽力（HC）为约80至约160A / m（1-2Oe）。电镀镍铁合金的铁含量为64〜81重量％。双层极制造工艺将磁各向异性和矫顽力保持在可用值上，同时提高饱和磁通密度和优化磁致伸缩。这是通过首先将BCC镍铁层电镀到下层种子层上，然后使两层退火以将矫顽力降低到小于约160安培/米，并将磁化升高至可接受的水平来实现的。

8. 发明授权

US06724571B2 Magnetic head for hard disk drive having varied composition nickel-iron alloy magnetic poles 失效
公开(公告)号：US06724571B2
公开(公告)日：2004-04-20
申请号：US09952741
申请日：2001-09-13
申请人： Thomas Edward Dinan , Neil Leslie Robertson , Alan Jun-Yuan Tam
发明人： Thomas Edward Dinan , Neil Leslie Robertson , Alan Jun-Yuan Tam
IPC分类号： G11B531
CPC分类号： C25D5/18 , C25D3/562 , C25D5/10 , Y10T29/49044
摘要： A magnetic head for a hard disk drive. The magnetic poles of the head are formed with a NiFe alloy having a graduated composition in which a higher Fe concentration is fabricated proximate the write gap layer between the magnetic poles. Each magnetic pole is fabricated in a single electroplating step in which the duty cycle of the electroplating current is altered during the electroplating operation. Where the duty cycle is greatest the Fe ion concentration is likewise greatest.

9. 发明授权

US06912771B2 Magnetic head for hard disk drive having varied composition nickel-iron alloy magnetic poles 失效
标题翻译：用于硬盘驱动器的磁头，具有不同组成的镍铁合金磁极
公开(公告)号：US06912771B2
公开(公告)日：2005-07-05
申请号：US10796751
申请日：2004-03-08
申请人： Thomas Edward Dinan , Neil Leslie Robertson , Alan Jun-Yuan Tam
发明人： Thomas Edward Dinan , Neil Leslie Robertson , Alan Jun-Yuan Tam
IPC分类号： C25D3/56 , C25D5/10 , C25D5/18 , G11B5/42 , G11B5/147
CPC分类号： C25D5/18 , C25D3/562 , C25D5/10 , Y10T29/49044
摘要： A magnetic head for a hard disk drive. The magnetic poles of the head are formed with a NiFe alloy having a graduated composition in which a higher Fe concentration is fabricated proximate the write gap layer between the magnetic poles. Each magnetic pole is fabricated in a single electroplating step in which the duty cycle of the electroplating current is altered during the electroplating operation. Where the duty cycle is greatest the Fe ion concentration is likewise greatest.
摘要翻译：用于硬盘驱动器的磁头。头部的磁极由具有刻度组合物的NiFe合金形成，其中在磁极之间的写间隙层附近制造更高的Fe浓度。每个磁极在单个电镀步骤中制造，其中在电镀操作期间电镀电流的占空比被改变。当占空比最大时，Fe离子浓度同样最大。

10. 发明授权

US06599411B2 Method of electroplating a nickel-iron alloy film with a graduated composition 失效
公开(公告)号：US06599411B2
公开(公告)日：2003-07-29
申请号：US09839901
申请日：2001-04-20
申请人： Thomas Edward Dinan , Neil Leslie Robertson , Alan Jun-Yuen Tam
发明人： Thomas Edward Dinan , Neil Leslie Robertson , Alan Jun-Yuen Tam
IPC分类号： C25D518
CPC分类号： C25D5/10 , C25D3/562 , C25D5/18 , Y10S205/922
摘要： In the NiFe electroplating method of the present invention, the atomic percent (at. %) composition of Ni and Fe in NiFe electroplated material is controlled by selection of the duty cycle of the electroplating current during the electroplating process. Generally, for a particular electroplating bath, where the electroplating current duty cycle is greatest the NiFe electroplated material has a higher Fe at. %, and where the electroplating current duty cycle is reduced, a lower Fe at. %. Therefore, electroplated NiFe components from a single electroplating bath can have differing NiFe concentrations where the electroplating current duty cycle is altered. Additionally, NiFe components can be electroplated with a graduated or changing Ni and Fe concentration by altering the electroplating current duty cycle during the electroplating process.

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