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1. 发明授权

US5510633A Porous silicon light emitting diode arrays and method of fabrication 失效
标题翻译：多孔硅发光二极管阵列及其制造方法
公开(公告)号：US5510633A
公开(公告)日：1996-04-23
申请号：US257247
申请日：1994-06-08
申请人： Thomas E. Orlowski , Sophie V. Vandebroek
发明人： Thomas E. Orlowski , Sophie V. Vandebroek
IPC分类号： B41J2/44 , B41J2/45 , B41J2/455 , H01L27/15 , H01L33/00
CPC分类号： H01L27/15 , Y10S438/96
摘要： A porous silicon Light Emitting Diodes (LEDs) device and method for fabricating LEDs with supporting circuits on a silicon chip or wafer for a Full Width Array in which a switch diode structure is used to form the porous silicon LED element and later drives the LED after the LED is fabricated. The LED is formed by defining an area in the switch diode for placing an LED element. Epi silicon is deposited in the defined area; and the epi silicon is electrochemical etched to produce porous silicon. This procedure creates column-like Si structures of nanometer dimension which can efficiently emit visible to infrared light at room temperature. Next, the porous silicon LED chip can be cut and butted without excessive damage. In this way, the chips bearing both LEDs and drive circuitry are made of silicon and can be cut and accurately butted by known techniques to form a low cost, high resolution Full Width LED array.
摘要翻译：一种多孔硅发光二极管（LED）器件及其制造方法，用于在全芯片或硅片上制造具有支撑电路的LED，其中开关二极管结构用于形成多孔硅LED元件，并随后驱动LED LED被制造。 LED通过在开关二极管中限定用于放置LED元件的区域而形成。 Epi硅沉积在限定区域内; 并且epi硅被电化学蚀刻以产生多孔硅。该过程产生纳米尺寸的柱状Si结构，其可以在室温下有效地发射出可见的红外光。接下来，可以切割和对接多孔硅LED芯片而不会过度损坏。以这种方式，承载LED和驱动电路的芯片由硅制成，并且可以通过已知技术被切割并精确地对接以形成低成本，高分辨率的全宽度LED阵列。

2. 发明授权

US5552328A Method of fabrication of porous silicon light emitting diode arrays 失效
标题翻译：多孔硅发光二极管阵列的制造方法
公开(公告)号：US5552328A
公开(公告)日：1996-09-03
申请号：US463162
申请日：1995-06-05
申请人： Thomas E. Orlowski , Sophie V. Vandebroek
发明人： Thomas E. Orlowski , Sophie V. Vandebroek
IPC分类号： B41J2/44 , B41J2/45 , B41J2/455 , H01L27/15 , H01L33/00 , H01L21/3063 , H01L21/77
CPC分类号： H01L27/15 , Y10S438/96
摘要： A porous silicon Light Emitting Diodes (LEDs) device and method for fabricating LEDs with supporting circuits on a silicon chip or wafer for a Full Width Array in which a switch diode structure is used to form the porous silicon LED element and later drives the LED after the LED is fabricated. The LED is formed by defining an area in the switch diode for placing an LED element. Epi silicon is deposited in the defined area; and the epi silicon is electrochemical etched to produce porous silicon. This procedure creates column-like Si structures of nanometer dimension which can efficiently emit visible to infrared light at room temperature. Next, the porous silicon LED chip can be cut and butted without excessive damage. In this way, the chips bearing both LEDs and drive circuitry are made of silicon and can be cut and accurately butted by known techniques to form a low cost, high resolution Full Width LED array.
摘要翻译：一种多孔硅发光二极管（LED）器件及其制造方法，用于在全芯片或硅片上制造具有支撑电路的LED，其中开关二极管结构用于形成多孔硅LED元件，并随后驱动LED LED被制造。 LED通过在开关二极管中限定用于放置LED元件的区域而形成。 Epi硅沉积在限定区域内; 并且epi硅被电化学蚀刻以产生多孔硅。该过程产生纳米尺寸的柱状Si结构，其可以在室温下有效地发射出可见的红外光。接下来，可以切割和对接多孔硅LED芯片而不会过度损坏。以这种方式，承载LED和驱动电路的芯片由硅制成，并且可以通过已知技术被切割并精确地对接以形成低成本，高分辨率的全宽度LED阵列。

3. 发明授权

US5153023A Process for catalysis of electroless metal plating on plastic 失效
标题翻译：用于催化电解金属镀层的方法
公开(公告)号：US5153023A
公开(公告)日：1992-10-06
申请号：US621687
申请日：1990-12-03
申请人： Thomas E. Orlowski , James Duff , Joan R. Ewing , Joseph A. Swift , Raymond E. Bailey
发明人： Thomas E. Orlowski , James Duff , Joan R. Ewing , Joseph A. Swift , Raymond E. Bailey
IPC分类号： B41J29/00 , C23C18/08 , C23C18/16 , C23C18/30 , H05K3/18
CPC分类号： H05K3/185 , C23C18/1608 , C23C18/1612 , C23C18/2033 , C23C18/204 , C23C18/206 , C23C18/30 , C23C18/405
摘要： A method of forming at least one electrically conductive path in a plastic substrate comprising providing a thermoplastic substrate having a melting point below 325.degree. C., coating said substrate with a precursor of a catalyst for the electroless deposition of conductive metals, said catalyst precursor having a decomposition temperature below the melting point of said thermoplastic and within the temperature range where said thermoplastic softens, heating the portion of said coated thermoplastic substrate corresponding to said conductive path to a temperature sufficient to decompose said catalyst precursor to said catalyst and soften said thermoplastic; said substrate, catalyst precursor and temperature being selected such that on heating to the temperature the precursor decomposes to the catalyst, the thermoplastic softens and at least partially melts without substantial decomposition to enable the catalyst to penetrate the surface of the thermoplastic and become anchored thereto to provide nucleation sites for the subsequent electroless deposition of conductive metal and depositing conductive metal by electroless deposition on said heated portion to form said conductive path.

4. 发明授权

US5919514A Process for preparing electroded donor rolls 失效
标题翻译：制备电镀供体辊的方法
公开(公告)号：US5919514A
公开(公告)日：1999-07-06
申请号：US997489
申请日：1992-12-28
申请人： Thomas E. Orlowski , Donald S. Sypula , Joseph Mammino , John W. Spiewak , Raymond E. Bailey
发明人： Thomas E. Orlowski , Donald S. Sypula , Joseph Mammino , John W. Spiewak , Raymond E. Bailey
IPC分类号： C23C18/16 , G03G15/08 , B05D5/12
CPC分类号： C23C18/1612 , C23C18/1608 , C23C18/1641 , C23C18/1653 , C23C18/1879 , C23C18/1882 , C23C18/204 , C23C18/206 , C23C18/2066 , C23C18/30 , C23C18/32 , C23C18/38 , C25D5/02 , G03G15/0818 , C23C18/1651 , G03G2215/0863
摘要： A process for preparing a toner donor roll having an integral electrode pattern involving: (a) providing a cylindrically shaped insulating member; (b) coating the insulating member with a photo or thermally sensitive composition comprised of a polymeric material and a conductive metal nucleating agent; (c) patterning the composition, resulting in a first composition portion corresponding to the electrode pattern and a second composition portion; and (d) depositing conductive metal on the first composition portion, resulting in the electrode pattern which is capable of being electrically biased to detach toner particles from the donor roll. In an alternative embodiment, there is provided an insulating member comprised of an insulating polymeric material and a conductive metal nucleating agent.
摘要翻译：一种制备具有整体电极图案的调色剂供体辊的方法，包括：（a）提供圆柱形绝缘构件; （b）用由聚合物材料和导电金属成核剂组成的光敏或热敏组合物涂覆绝缘构件; （c）图案化组合物，得到对应于电极图案的第一组成部分和第二组合物部分; 和（d）在第一组合物部分上沉积导电金属，导致能够被电偏置以从供体辊上分离调色剂颗粒的电极图案。在替代实施例中，提供了由绝缘聚合材料和导电金属成核剂组成的绝缘构件。

5. 发明授权

US5900288A Method for improving substrate adhesion in fluoropolymer deposition processes 失效
标题翻译：改善含氟聚合物沉积工艺中基材粘附性的方法
公开(公告)号：US5900288A
公开(公告)日：1999-05-04
申请号：US722517
申请日：1996-09-27
申请人： Daniel E. Kuhman , Thomas E. Orlowski
发明人： Daniel E. Kuhman , Thomas E. Orlowski
IPC分类号： B08B7/00 , B41J2/16 , C23C16/02 , C23C16/44 , C23F4/00 , C23G5/00 , H01L21/304 , C23C14/02 , C08J7/18 , H05H1/24
CPC分类号： B41J2/1635 , B41J2/1601 , B41J2/1606 , B41J2/1628 , B41J2/1629 , B41J2/164 , C23C16/0245 , C23C16/4405 , B41J2202/03
摘要： A method of cleaning a substrate, in particular, the front face of a thermal ink jet printing device, to improve subsequent thin film deposition in a single chamber plasma processing system containing fluorine-containing deposits, involves treating the substrate with a hydrogen plasma. A front face coating for a thermal ink jet device may be formed by a method involving (1) treating a substrate of the thermal ink jet device with a hydrogen plasma; (2) optionally coating the cleaned substrate with an amorphous carbon layer; and (3) coating the substrate or amorphous carbon layer with a fluoropolymer layer.
摘要翻译：一种清洗基板，特别是热喷墨打印装置的正面以改善随后在含有含氟沉积物的单室等离子体处理系统中的薄膜沉积的方法涉及用氢等离子体处理该基板。用于热喷墨装置的前面涂层可以通过以下方法形成：（1）用氢等离子体处理热喷墨装置的基板; （2）任选地用无定形碳层涂覆清洁的基材; 和（3）用含氟聚合物层涂覆基材或无定形碳层。

6. 发明申请

US20120076980A1 METHOD FOR FORMING AN APERTURE AND ACTUATOR LAYER FOR AN INKJET PRINTHEAD 有权
标题翻译：用于形成喷嘴和打印机层的方法
公开(公告)号：US20120076980A1
公开(公告)日：2012-03-29
申请号：US12890234
申请日：2010-09-24
申请人： John R. Andrews , Thomas E. Orlowski
发明人： John R. Andrews , Thomas E. Orlowski
IPC分类号： B32B3/10 , B32B38/10
CPC分类号： B41J2/162 , B32B3/266 , B32B2457/08 , B41J2/1634 , B41J2/164 , Y10T156/1056 , Y10T428/24322
摘要： A method enables multiple inkjet printhead dies to be manufactured by bonding a single wafer to a single polymer layer. Multiple die sites on the single wafer are arranged in a predetermined pattern that corresponds to the pattern in which a plurality of aperture arrays are arranged in the polymer layer. The die sites on the wafer and the aperture arrays in polymer layer are aligned, the wafer and polymer layer are bonded, and the bonded wafer and polymer layer are cut to form a plurality of inkjet printhead dies.
摘要翻译：一种方法能够通过将单个晶片结合到单个聚合物层来制造多个喷墨打印头芯片。单个晶片上的多个裸片位置以对应于多个孔径阵列布置在聚合物层中的图案的预定图案布置。将晶片上的晶片位置和聚合物层中的孔阵列对准，将晶片和聚合物层接合，并且将接合的晶片和聚合物层切割成多个喷墨打印头芯片。

7. 发明授权

US5436696A Fibrillated pultruded electronic component for grounding a photoconductor 失效
标题翻译：用于接地光电导体的原始拉挤电子元件
公开(公告)号：US5436696A
公开(公告)日：1995-07-25
申请号：US122628
申请日：1993-09-17
申请人： Thomas E. Orlowski , Joseph A. Swift , Stanley J. Wallace , Wilbur M. Peck , John E. Courtney , David E. Rollins
发明人： Thomas E. Orlowski , Joseph A. Swift , Stanley J. Wallace , Wilbur M. Peck , John E. Courtney , David E. Rollins
IPC分类号： B29C70/52 , B29K105/08 , B29L31/34 , C08K7/00 , C08K7/02 , C08L101/00 , G03G15/00 , G03G21/00 , G03G21/06 , H01H1/02 , H01H1/029 , H01H1/10
CPC分类号： G03G15/75 , H01H1/02 , H01H1/029 , H01H1/10 , Y10S428/902 , Y10T428/249945 , Y10T428/268 , Y10T428/30
摘要： An electronic component for making electrical contact with another component comprising a nonmetallic pultruded composite member having a plurality of small generally circular cross section conductive fibers in a polymer matrix said plurality of fibers being oriented in said matrix in a direction substantially parallel to the axial direction of said member and being continuous from one end of said member to the other to provide a plurality of electrical point contacts at each end of said member at least one end of said member having a fibrillated brush-like structure of said plurality of fibers providing a densely distributed filament contact wherein the terminating ends of the fibers in the brush-like structure defines an electrically contacting surface. In a preferred embodiment the brush-like member is a laser fibrillated structure.
摘要翻译：一种用于与另一部件进行电接触的电子部件，该组件包括在聚合物基体中具有多个小的大致圆形横截面的导电纤维的非金属拉挤复合部件，所述多个纤维沿着基本上平行于所述构件并且从所述构件的一端连续到另一端，以在所述构件的每个端部处提供多个电点触点，所述构件的至少一个端部具有所述多个纤维的原纤化刷状结构，其密集地提供分布式灯丝接触，其中刷状结构中的纤维的终端限定电接触表面。在优选实施例中，刷状构件是激光原纤化结构。

8. 发明授权

US5410386A Hollow pultruded electical contact 失效
标题翻译：中空拉挤电动接触
公开(公告)号：US5410386A
公开(公告)日：1995-04-25
申请号：US84720
申请日：1993-06-25
申请人： Joseph A. Swift , Stanley J. Wallace , John E. Courtney , Wilbur M. Peck , Thomas E. Orlowski
发明人： Joseph A. Swift , Stanley J. Wallace , John E. Courtney , Wilbur M. Peck , Thomas E. Orlowski
IPC分类号： H01H1/023 , G03G15/00 , H01H1/02 , H01H1/029 , H01H1/06 , H05F3/02
CPC分类号： G03G15/75 , H01H1/029 , H01H1/06
摘要： An electroconductive contact is formed of a pultruded member that has a hollow construction. The pultruded member includes a plurality of continuous electroconductive strands embedded in a resin material. At least one end of the pultruded member has laser fibrillated strands that are intended to contact a photoreceptive belt. An alignment structure can be integrally formed during the pultrusion process on a surface of the pultruded member. The alignment structure aligns the pultruded member relative to a contact. The electroconductive contact may also provide electrical connection between a photoreceptive belt and a ground terminal.
摘要翻译：导电接触由具有中空结构的拉挤构件形成。拉挤构件包括嵌入树脂材料中的多个连续的导电丝。拉挤成型件的至少一端具有旨在接触感光带的激光原纤维股线。在拉挤成形过程中可以在拉拔构件的表面上一体地形成对准结构。对准结构使拉挤成形件相对于接触件对齐。导电接触还可以提供感光皮带和接地端子之间的电连接。

9. 发明授权

US08684499B2 Method for forming an aperture and actuator layer for an inkjet printhead 有权
标题翻译：用于形成用于喷墨打印头的孔和致动器层的方法
公开(公告)号：US08684499B2
公开(公告)日：2014-04-01
申请号：US12890234
申请日：2010-09-24
申请人： John R. Andrews , Thomas E. Orlowski
发明人： John R. Andrews , Thomas E. Orlowski
IPC分类号： B41J2/04
CPC分类号： B41J2/162 , B32B3/266 , B32B2457/08 , B41J2/1634 , B41J2/164 , Y10T156/1056 , Y10T428/24322
摘要： A method enables multiple inkjet printhead dies to be manufactured by bonding a single wafer to a single polymer layer. Multiple die sites on the single wafer are arranged in a predetermined pattern that corresponds to the pattern in which a plurality of aperture arrays are arranged in the polymer layer. The die sites on the wafer and the aperture arrays in polymer layer are aligned, the wafer and polymer layer are bonded, and the bonded wafer and polymer layer are cut to form a plurality of inkjet printhead dies.
摘要翻译：一种方法能够通过将单个晶片结合到单个聚合物层来制造多个喷墨打印头芯片。单个晶片上的多个裸片位置以对应于多个孔径阵列布置在聚合物层中的图案的预定图案布置。将晶片上的晶片位置和聚合物层中的孔阵列对准，将晶片和聚合物层接合，并且将键合的晶片和聚合物层切割成多个喷墨打印头芯片。

10. 发明授权

US5462773A Synchronized process for catalysis of electroless metal plating on plastic 失效
标题翻译：塑料上化学镀金的同步方法
公开(公告)号：US5462773A
公开(公告)日：1995-10-31
申请号：US996990
申请日：1992-12-28
申请人： Joseph A. Swift , Thomas E. Orlowski
发明人： Joseph A. Swift , Thomas E. Orlowski
IPC分类号： C08J7/04 , C23C18/16 , C23C18/20 , C23C18/30 , H05K3/18 , B05D1/18
CPC分类号： C23C18/1608 , C23C18/1612 , C23C18/204 , C23C18/206 , C23C18/30 , C23C18/405 , H05K3/185 , H05K2201/0129 , H05K2203/107
摘要： A method of forming at least one electrically conductive path in a thermoplastic substrate having a melting point below 325.degree. C., by synchronously depositing on the substrate in the predetermined pattern of said conductive path from an atomized stream of a precursor of a catalyst for the electroless deposition of conductive metals and locally heating the deposited precursor in the pattern corresponding to the conductive path, the catalyst precursor having a decomposition temperature below the melting point of the thermoplastic and within the temperature range where the thermoplastic softens, heating the portion of the thermoplastic substrate corresponding to said conductive path to a temperature sufficient to decompose said catalyst precursor to the catalyst and soften the thermoplastic; said substrate, catalyst precursor and temperature being selected such that on heating to the temperature the precursor decomposes to the catalyst, the thermoplastic softens and at least partially melts without substantial decomposition to enable the catalyst to penetrate the surface of the thermoplastic and become anchored thereto to provide nucleation sites for the subsequent electroless deposition of conductive metal and depositing conductive metal by electroless deposition on the heated portion to form the conductive path.
摘要翻译：一种在具有低于325℃的熔点的热塑性基材中形成至少一个导电路径的方法，通过以所述导电路径的预定图案从所述导电路径的预定图案中的雾化流同步沉积在用于导电金属的无电沉积并且以对应于导电路径的图案局部加热沉积的前体，催化剂前体具有低于热塑性塑料的熔点的分解温度，并且在热塑性软化的温度范围内，加热热塑性塑料的一部分对应于所述导电路径的衬底至足以将所述催化剂前体分解成催化剂并软化热塑性塑料的温度; 所述衬底，催化剂前体和温度被选择为使得在加热到前体分解为催化剂的温度下，热塑性软化并且至少部分地熔融而没有实质的分解，使得催化剂能够穿透热塑性塑料的表面并被锚定到提供成核位置用于随后的导电金属的无电沉积并通过无电沉积沉积导电金属在加热部分上以形成导电路径。

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