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    • 1. 发明申请
    • HIGH REFLECTIVE SUBSTRATE OF LIGHT EMITTING DEVICES WITH IMPROVED LIGHT OUTPPUT
    • 具有改进的光输出的发光装置的高反射基板
    • US20110248287A1
    • 2011-10-13
    • US12757179
    • 2010-04-09
    • Thomas Cheng-Hsin YuanBernd KellerRonan Le ToquinTheodore Lowes
    • Thomas Cheng-Hsin YuanBernd KellerRonan Le ToquinTheodore Lowes
    • H01L33/48H01L33/60
    • H01L33/60H01L25/0753H01L2924/0002H01L2924/00
    • Apparatuses and methods for producing light emitting devices maximizing luminous flux output are disclosed. In one possible embodiment, a light emitting device comprises a substrate and a reflective layer at least partially covering the substrate. The reflective layer is non-yellowing, and may be substantially light transparent. One or more light emitting diode (LED) chips are disposed on the substrate. The light emitting device may emit white light. The reflective layer may comprise a silicone carrier with light reflective particles dispersed in the silicone carrier. A light diffusion lens may also be disposed on the substrate and surrounding the LED chips. Furthermore, one or more microspheres, light scattering particles, and/or phosphor particles may be dispersed in the lens. In one possible method for producing a light emitting device, a substrate is provided. One or more LED chips are coupled with the substrate, and a high reflective, non-yellowing coating is applied on at least a portion of the top surface of the substrate. The coating comprises a carrier with reflective particles dispersed throughout.
    • 公开了用于产生最大化光通量输出的发光器件的装置和方法。 在一个可能的实施例中,发光器件包括至少部分地覆盖衬底的衬底和反射层。 反射层是不发黄的,并且可以是基本上透明的。 一个或多个发光二极管(LED)芯片设置在基板上。 发光装置可以发出白光。 反射层可以包括具有分散在硅氧烷载体中的光反射颗粒的硅氧烷载体。 光扩散透镜也可以设置在基板上并围绕LED芯片。 此外,一个或多个微球,光散射颗粒和/或磷光体颗粒可以分散在透镜中。 在制造发光器件的一种可能的方法中,提供了一种衬底。 一个或多个LED芯片与衬底耦合,并且高反射,不发黄的涂层施加在衬底顶表面的至少一部分上。 该涂层包括具有分散在其中的反射颗粒的载体。
    • 2. 发明授权
    • High reflective substrate of light emitting devices with improved light output
    • 具有改善的光输出的发光器件的高反射衬底
    • US09012938B2
    • 2015-04-21
    • US12757179
    • 2010-04-09
    • Thomas Cheng-Hsin YuanBernd KellerRonan Le ToquinTheodore Lowes
    • Thomas Cheng-Hsin YuanBernd KellerRonan Le ToquinTheodore Lowes
    • H01L33/00H01L33/60H01L25/075
    • H01L33/60H01L25/0753H01L2924/0002H01L2924/00
    • Apparatuses and methods for producing light emitting devices maximizing luminous flux output are disclosed. In one possible embodiment, a light emitting device comprises a substrate and a reflective layer at least partially covering the substrate. The reflective layer is non-yellowing, and may be substantially light transparent. One or more light emitting diode (LED) chips are disposed on the substrate. The light emitting device may emit white light. The reflective layer may comprise a silicone carrier with light reflective particles dispersed in the silicone carrier. A light diffusion lens may also be disposed on the substrate and surrounding the LED chips. Furthermore, one or more microspheres, light scattering particles, and/or phosphor particles may be dispersed in the lens. In one possible method for producing a light emitting device, a substrate is provided. One or more LED chips are coupled with the substrate, and a high reflective, non-yellowing coating is applied on at least a portion of the top surface of the substrate. The coating comprises a carrier with reflective particles dispersed throughout.
    • 公开了用于产生最大化光通量输出的发光器件的装置和方法。 在一个可能的实施例中,发光器件包括至少部分地覆盖衬底的衬底和反射层。 反射层是不发黄的,并且可以是基本上透明的。 一个或多个发光二极管(LED)芯片设置在基板上。 发光装置可以发出白光。 反射层可以包括具有分散在硅氧烷载体中的光反射颗粒的硅氧烷载体。 光扩散透镜也可以设置在基板上并围绕LED芯片。 此外,一个或多个微球,光散射颗粒和/或磷光体颗粒可以分散在透镜中。 在制造发光器件的一种可能的方法中,提供了一种衬底。 一个或多个LED芯片与衬底耦合,并且高反射,不发黄的涂层施加在衬底顶表面的至少一部分上。 该涂层包括具有分散在其中的反射颗粒的载体。
    • 9. 发明授权
    • Expandable LED array interconnect
    • 可扩展的LED阵列互连
    • US07897980B2
    • 2011-03-01
    • US11595720
    • 2006-11-09
    • Thomas Cheng-Hsin YuanBernd Keller
    • Thomas Cheng-Hsin YuanBernd Keller
    • H01L33/00
    • F21S2/005F21K9/00F21Y2105/10F21Y2107/40F21Y2115/10F21Y2115/30H01L25/0753H01L2924/0002H01L2924/00
    • A light emitting device that can function as an array element in an expandable array of such devices. The light emitting device comprises a substrate that has a top surface and a plurality of edges. Input and output terminals are mounted to the top surface of the substrate. Both terminals comprise a plurality of contact pads disposed proximate to the edges of the substrate, allowing for easy access to both terminals from multiple edges of the substrate. A lighting element is mounted to the top surface of the substrate. The lighting element is connected between the input and output terminals. The contact pads provide multiple access points to the terminals which allow for greater flexibility in design when the devices are used as array elements in an expandable array.
    • 一种可用作这种装置的可扩展阵列中的阵列元件的发光装置。 发光器件包括具有顶表面和多个边缘的衬底。 输入和输出端子安装到基板的顶表面。 两个端子包括靠近基板的边缘设置的多个接触焊盘,允许从基板的多个边缘容易地接近两个端子。 照明元件安装到基板的顶表面。 照明元件连接在输入和输出端子之间。 接触垫为端子提供多个接入点,当器件用作可扩展阵列中的阵列元件时,允许设计更大的灵活性。
    • 10. 发明申请
    • LED array and method for fabricating same
    • LED阵列及其制造方法
    • US20080170396A1
    • 2008-07-17
    • US11982276
    • 2007-10-31
    • Thomas Cheng-Hsin YuanBernd Keller
    • Thomas Cheng-Hsin YuanBernd Keller
    • F21V5/00H01L33/00H01L21/60
    • F21V5/007F21K9/00F21S2/005F21V5/04F21Y2105/10F21Y2107/40F21Y2113/00F21Y2115/10H01L25/0753H01L33/62H01L2924/0002H01L2924/00
    • A light emitting device or array comprising a submount having a top surface, a bottom surface and a plurality of edges, with input and output terminals disposed on the top surface. A plurality of attach pads and traces are also disposed on the top surface and electrically connected between the input and output terminals. A plurality of LEDs are also included, each of which is mounted to one of the attach pads. The attach pads cover more of the top surface than the LEDs and spread heat from the LEDs to the top surface of the submount. A plurality of lenses are also included each of which is molded over a respective one of the attach pads and covers the LED mounted to the particular attach pad. The arrays are shaped and arranged so that they can be easily attached to similar arrays in a tiling fashion, with the desired number of arrays included to meet the desired lighting requirements. Methods for fabricating the arrays from a single submount or submounts panel are also disclosed.
    • 一种发光器件或阵列,包括具有顶表面,底表面和多个边缘的基座,其中输入和输出端子设置在顶表面上。 多个附接焊盘和迹线也设置在顶表面上并电连接在输入和输出端子之间。 还包括多个LED,每个LED被安装到附接焊盘之一。 连接焊盘覆盖比LED更多的顶表面,并将热量从LED传播到底座的顶表面。 还包括多个透镜,每个透镜被模制在相应的一个连接焊盘上并且覆盖安装到特定连接焊盘上的LED。 阵列的形状和布置使得它们可以以平铺的方式容易地附接到类似的阵列,其中包括所需数量的阵列以满足期望的照明要求。 还公开了从单个底座或底座面板制造阵列的方法。