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1. 发明授权

US4933209A Method of making a thin film recording head apparatus utilizing polyimide films 失效
公开(公告)号：US4933209A
公开(公告)日：1990-06-12
申请号：US372800
申请日：1989-06-28
申请人： Thomas C. Anthony , Steven L. Naberhuis , Robert A. Garcia , Hardayal S. Gill
发明人： Thomas C. Anthony , Steven L. Naberhuis , Robert A. Garcia , Hardayal S. Gill
IPC分类号： G11B5/31
CPC分类号： G11B5/3163 , Y10T29/49044 , Y10T29/49046 , Y10T29/49066
摘要： A thin film recording head which utilizes polyimide as the coil encapsulant. The polyimide encapsulant is self planarizing and lends itself to processing of the coil vias, magnetic shunt vias and apex tapers. Methods of fabricating a thin film recording head and forming coil vias, magnetic shunt vias and apex tapers are also disclosed. In general, an insulating material is deposited on a bottom magnetic yoke. A first layer of polyimide is then deposited of the insulating material. Then, a three layer photoresist structure is deposited on the first layer of polyimide, which includes a transfer layer deposited between two layers of photoresist. The top layer of photoresist is developed and the transfer layer is etched. The first layer of photoresist is then etched into the polyimide layer to form troughs therein. The coil material is then deposited into the etched troughs. The coil material comprises a layer of metal having a relatively thin passivation layer deposited thereover. The photoresist and transfer layers and unwanted coil material are then removed by ultrasonic agitation in acetone. A second layer of polyimide is then deposited over the formed coil structure to encapsulate and planarize it. The method which forms the coil vias, magnetic shunt vias and apex tapers of the recording head after formation of the encapsulated coil comprises the following steps. First, a photoresist layer is deposited on top of the second layer of polyimide. The photoresist layer is then patterned to define coil vias, magnetic shunt vias and apex taper locations. Then, this structure is heated to a temperature less than 120 degrees Celsius to round the corners of the photoresist layer at the coil via, magnetic shunt via and apex angle locations. Finally, the patterned photoresist layer and underlying polyimide layer are etched to provide the coil vias, magnetic shunt vias and apex tapers. Thereafter, the top magnetic yoke is deposited over the encapsulated structure to complete the thin film magnetic recording head.

2. 发明申请

US20100078640A1 Thin Film Transistor Backplane 有权
标题翻译：薄膜晶体管背板
公开(公告)号：US20100078640A1
公开(公告)日：2010-04-01
申请号：US12243073
申请日：2008-10-01
申请人： Ping Mei , Hao Luo , Albert Hua Jeans , Angeles Marcia Almanza-Workman , Robert A. Garcia , Warren Jackson , Carl P. Taussig , Craig M. Perlov
发明人： Ping Mei , Hao Luo , Albert Hua Jeans , Angeles Marcia Almanza-Workman , Robert A. Garcia , Warren Jackson , Carl P. Taussig , Craig M. Perlov
IPC分类号： H01L27/105 , B29D11/00
CPC分类号： H01L27/1288 , H01L27/1214 , Y10S438/942
摘要： A fabrication process for a device such as a backplane for a flat panel display includes depositing thin film layers on a substrate, forming a 3D template overlying the thin film layers, and etching the 3D template and the thin film layers to form gate lines and transistors from the thin film layers. An insulating or passivation layer can then be deposited on the gate lines and the transistors, so that column or data lines can be formed on the insulating layer.
摘要翻译：用于平板显示器的背板的装置的制造方法包括在衬底上沉积薄膜层，形成覆盖薄膜层的3D模板，以及蚀刻3D模板和薄膜层以形成栅线和晶体管从薄膜层。然后可以在栅极线和晶体管上沉积绝缘或钝化层，使得可以在绝缘层上形成列或数据线。

3. 发明申请

US20110309365A1 THIN FILM TRANSISTOR BACKPLANE 审中-公开
标题翻译：薄膜晶体管背板
公开(公告)号：US20110309365A1
公开(公告)日：2011-12-22
申请号：US13219571
申请日：2011-08-26
申请人： Ping Mei , Hao Luo , Albert Hua Jeans , Angeles Marcia Almanza-Workman , Robert A. Garcia , Warren Jackson , Carl P. Taussig , Craig M. Perlov
发明人： Ping Mei , Hao Luo , Albert Hua Jeans , Angeles Marcia Almanza-Workman , Robert A. Garcia , Warren Jackson , Carl P. Taussig , Craig M. Perlov
IPC分类号： H01L33/08
CPC分类号： H01L27/1288 , H01L27/1214 , Y10S438/942
摘要： A fabrication process for a device such as a backplane for a flat panel display includes depositing thin film layers on a substrate, forming a 3D template overlying the thin film layers, and etching the 3D template and the thin film layers to form gate lines and transistors from the thin film layers. An insulating or passivation layer can then be deposited on the gate lines and the transistors, so that column or data lines can be formed on the insulating layer.
摘要翻译：用于平板显示器的背板的装置的制造方法包括在衬底上沉积薄膜层，形成覆盖薄膜层的3D模板，以及蚀刻3D模板和薄膜层以形成栅线和晶体管从薄膜层。然后可以在栅极线和晶体管上沉积绝缘或钝化层，使得可以在绝缘层上形成列或数据线。

4. 发明授权

US08021935B2 Thin film device fabrication process using 3D template 有权
标题翻译：使用3D模板的薄膜器件制造工艺
公开(公告)号：US08021935B2
公开(公告)日：2011-09-20
申请号：US12243073
申请日：2008-10-01
申请人： Ping Mei , Hao Luo , Albert Hua Jeans , Angeles Marcia Almanza-Workman , Robert A. Garcia , Warren Jackson , Carl P. Taussig , Craig M. Perlov
发明人： Ping Mei , Hao Luo , Albert Hua Jeans , Angeles Marcia Almanza-Workman , Robert A. Garcia , Warren Jackson , Carl P. Taussig , Craig M. Perlov
IPC分类号： H01L21/00
CPC分类号： H01L27/1288 , H01L27/1214 , Y10S438/942
摘要： A fabrication process for a device such as a backplane for a flat panel display includes depositing thin film layers on a substrate, forming a 3D template overlying the thin film layers, and etching the 3D template and the thin film layers to form gate lines and transistors from the thin film layers. An insulating or passivation layer can then be deposited on the gate lines and the transistors, so that column or data lines can be formed on the insulating layer.
摘要翻译：用于平板显示器的背板的装置的制造方法包括在衬底上沉积薄膜层，形成覆盖薄膜层的3D模板，以及蚀刻3D模板和薄膜层以形成栅线和晶体管从薄膜层。然后可以在栅极线和晶体管上沉积绝缘或钝化层，使得可以在绝缘层上形成列或数据线。

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