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1. 发明申请

US20120282739A1 MANUFACTURING A FILLING OF A GAP IN SEMICONDUCTOR DEVICES 失效
标题翻译：制造半导体器件中的间隙的填充
公开(公告)号：US20120282739A1
公开(公告)日：2012-11-08
申请号：US13288546
申请日：2011-11-03
申请人： Thomas Brunschwiler , Javier V. Goicochea , Heiko Wolf
发明人： Thomas Brunschwiler , Javier V. Goicochea , Heiko Wolf
IPC分类号： H01L21/56
CPC分类号： H01L21/563 , H01L23/295 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/743 , H01L24/83 , H01L2224/16145 , H01L2224/16225 , H01L2224/26135 , H01L2224/26145 , H01L2224/26165 , H01L2224/26175 , H01L2224/29386 , H01L2224/29499 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/83007 , H01L2224/83104 , H01L2224/92125 , H01L2924/0132 , H01L2924/10253 , H01L2924/00 , H01L2924/01006 , H01L2924/01014 , H01L2924/01007 , H01L2924/01013 , H01L2924/05432 , H01L2924/05032 , H01L2924/04642
摘要： A method for manufacturing a filling in a gap region between a first surface and a second surface includes applying a suspension comprising a carrier fluid and filler particles in the gap region between the first and the second surface; and withholding filler particles by a barrier element in the gap region to form a path of attached filler particles between the first surface and the second surface.
摘要翻译：用于制造在第一表面和第二表面之间的间隙区域中的填充物的方法包括将包含载体流体和填料颗粒的悬浮液施加在第一和第二表面之间的间隙区域中; 并且通过所述间隙区域中的阻挡元件来阻止填料颗粒，以在所述第一表面和所述第二表面之间形成附着的填料颗粒的路径。

2. 发明授权

US08586411B2 Manufacturing a filling of a gap in semiconductor devices 失效
标题翻译：制造半导体器件间隙的填补
公开(公告)号：US08586411B2
公开(公告)日：2013-11-19
申请号：US13288546
申请日：2011-11-03
申请人： Thomas Brunschwiler , Javier V. Goicochea , Heiko Wolf
发明人： Thomas Brunschwiler , Javier V. Goicochea , Heiko Wolf
IPC分类号： H01L21/00
CPC分类号： H01L21/563 , H01L23/295 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/743 , H01L24/83 , H01L2224/16145 , H01L2224/16225 , H01L2224/26135 , H01L2224/26145 , H01L2224/26165 , H01L2224/26175 , H01L2224/29386 , H01L2224/29499 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/83007 , H01L2224/83104 , H01L2224/92125 , H01L2924/0132 , H01L2924/10253 , H01L2924/00 , H01L2924/01006 , H01L2924/01014 , H01L2924/01007 , H01L2924/01013 , H01L2924/05432 , H01L2924/05032 , H01L2924/04642
摘要： A method for manufacturing a filling in a gap region between a first surface and a second surface includes applying a suspension comprising a carrier fluid and filler particles in the gap region between the first and the second surface; and withholding filler particles by a barrier element in the gap region to form a path of attached filler particles between the first surface and the second surface.
摘要翻译：用于制造在第一表面和第二表面之间的间隙区域中的填充物的方法包括将包含载体流体和填料颗粒的悬浮液施加在第一和第二表面之间的间隙区域中; 并且通过所述间隙区域中的阻挡元件来阻止填料颗粒，以在所述第一表面和所述第二表面之间形成附着的填料颗粒的路径。

3. 发明授权

US09189037B2 Optimizing heat transfer in 3-D chip-stacks 有权
标题翻译：优化3-D芯片堆叠中的热传递
公开(公告)号：US09189037B2
公开(公告)日：2015-11-17
申请号：US13494047
申请日：2012-06-12
申请人： Thomas Brunschwiler , Eren Kursun , Gary W Maier
发明人： Thomas Brunschwiler , Eren Kursun , Gary W Maier
IPC分类号： G06F1/20 , H01L25/065
CPC分类号： G06F1/20 , H01L25/0657 , H01L2924/0002 , H01L2924/00
摘要： A computer-implemented method, system, and article of manufacture for optimizing heat transfer in a 3-D chip-stack. The method includes the steps of: receiving a heat-removal effectiveness parameter for a plurality of channel-region areas in the chip-stack, receiving at least one of a flow value and temperature value for at least two of the channel-region areas, comparing the received values for different channel-region areas, and adjusting a flow rate of a liquid flowing to at least one of the two channel-region areas based on the heat-removal effectiveness parameter of the channel-region area receiving the adjustment and the results of the comparison step, where at least one step is carried out using a computer device.
摘要翻译：用于优化3-D芯片堆叠中的热传递的计算机实现的方法，系统和制品。该方法包括以下步骤：接收码片堆叠中的多个信道区域区域的散热有效性参数，接收至少两个信道区域区域的流量值和温度值中的至少一个，比较不同通道区域的接收值，并且基于接收调整的通道区域区域的散热效率参数来调节流入两个通道区域区域中的至少一个的液体的流量，比较步骤的结果，其中使用计算机设备执行至少一个步骤。

4. 发明授权

US09064080B2 Transferring heat through an optical layer of integrated circuitry 有权
标题翻译：通过集成电路的光学层传输热量
公开(公告)号：US09064080B2
公开(公告)日：2015-06-23
申请号：US13010184
申请日：2011-01-20
申请人： Harry Barowski , Thomas Brunschwiler , Roger F. Dangel , Hubert Harrer , Andreas Huber , Norbert M. Meier , Bruno Michel , Tim Niggemeier , Stephan Paredes , Jochen Supper , Jonas R. Weiss
发明人： Harry Barowski , Thomas Brunschwiler , Roger F. Dangel , Hubert Harrer , Andreas Huber , Norbert M. Meier , Bruno Michel , Tim Niggemeier , Stephan Paredes , Jochen Supper , Jonas R. Weiss
IPC分类号： G02B6/12 , G06F17/50 , G02B6/42 , G02B6/43
CPC分类号： H01L23/367 , G02B6/12 , G02B6/122 , G02B6/4269 , G02B6/4272 , G02B6/43 , G02B2006/12147 , G06F17/5022 , G06F17/5068 , G06F17/5077 , H01L2224/16225 , H01L2924/15311
摘要： An integrated circuitry structure includes at least first and second regions. An optical layer includes optical waveguides. A heat-conductive material transfers heat from at least the second region through the optical layer to a heat sink.
摘要翻译：集成电路结构至少包括第一和第二区域。光学层包括光波导。导热材料将热量从至少第二区域传递通过光学层到散热器。

5. 发明授权

US08021710B2 Electronic device having an electrode with enhanced injection properties 有权
标题翻译：电子装置具有具有增强的注射性能的电极
公开(公告)号：US08021710B2
公开(公告)日：2011-09-20
申请号：US11205232
申请日：2005-08-16
申请人： Thomas Brunschwiler , Siegfried F. Karg , Walter Riess
发明人： Thomas Brunschwiler , Siegfried F. Karg , Walter Riess
IPC分类号： B05D5/12 , C08F2/46 , C08F2/48
CPC分类号： H01L51/5088 , H01L51/0003 , H01L51/0051 , H01L51/0062 , H01L51/0086 , H01L51/5092 , H01L51/56 , Y10T428/31504
摘要： The present invention relates to methods and apparatus for producing an electronic device, such as an organic light-emitting diode (OLED), having an electrode with enhanced injection properties. An example method according to the invention comprises the steps of providing an electrode, depositing a first layer of molecular charge transfer material on the electrode, and cross-linking the molecular charge transfer material. With the method according to the invention, an OLED with higher light efficiency, lower operating voltage, and longer lifetime can be produced. The present invention further relates to an electronic device having an electrode with enhanced injection properties.
摘要翻译：本发明涉及一种用于生产电子器件的方法和装置，例如有机发光二极管（OLED），其具有具有增强的注入特性的电极。根据本发明的示例性方法包括提供电极，在电极上沉积第一层分子电荷转移材料并交联分子电荷转移材料的步骤。利用根据本发明的方法，可以生产出光效率更高，工作电压更低，寿命更长的OLED。本发明还涉及一种具有提高喷射性能的电极的电子装置。

6. 发明申请

US20100308316A1 Electronic Device Having an Electrode With Enhanced Injection Properties 有权
标题翻译：具有增强注射性能的电极的电子器件
公开(公告)号：US20100308316A1
公开(公告)日：2010-12-09
申请号：US12856727
申请日：2010-08-16
申请人： Thomas Brunschwiler , Siegfried F. Karg , Walter Riess
发明人： Thomas Brunschwiler , Siegfried F. Karg , Walter Riess
IPC分类号： H01L51/54 , H01L51/56
CPC分类号： H01L51/5088 , H01L51/0003 , H01L51/0051 , H01L51/0062 , H01L51/0086 , H01L51/5092 , H01L51/56 , Y10T428/31504
摘要： An electronic device having an electrode with enhanced injection properties comprising a first electrode and a first layer of cross-linked molecular charge transfer material on the first electrode. The cross-linked molecular charge transfer material may be an acceptor, which may consist of at least one of: TNF, TN9(CN)2F, TeNF, TeCIBQ, TCNB, DCNQ, and TCAQ. The cross-linked molecular charge transfer material may also be a donor, which may consist of at least one of: Terpy, Ru(terpy)2 TTN, and crystal violet.
摘要翻译：一种具有增强的注入性能的电极的电子器件包括在第一电极上的第一电极和交联的分子电荷转移材料的第一层。交联分子电荷转移材料可以是受体，其可以由TNF，TN9（CN）2F，TeNF，TeCIBQ，TCNB，DCNQ和TCAQ中的至少一种组成。交联分子电荷转移材料也可以是供体，其可以由以下至少一种组成：Terpy，Ru（terpy）2 TTN和结晶紫。

7. 发明申请

US20100053890A1 COOLING SYSTEM FOR AN ELECTRONIC COMPONENT SYSTEM CABINET 有权
标题翻译：电子元件系统柜的冷却系统
公开(公告)号：US20100053890A1
公开(公告)日：2010-03-04
申请号：US12202619
申请日：2008-09-02
申请人： Thomas Brunschwiler , Ryan J. Linderman , Hugo E. Rothuizen , Reto Waelchli
发明人： Thomas Brunschwiler , Ryan J. Linderman , Hugo E. Rothuizen , Reto Waelchli
IPC分类号： H05K7/20
CPC分类号： H05K7/20772 , H05K7/20781
摘要： An electronic component system cabinet includes a plurality of electronic component system bays, and a plurality of electronic component systems mounted in respective ones of the plurality of electronic component system bays. The electronic component system cabinet further includes a cooling system including a plurality of coolant reservoirs. Each of the plurality of coolant reservoirs is associated with at least one of the plurality of electronic component system bays. The cooling system further includes at least one pump fluidly connected to each of the plurality of coolant reservoirs. The at least one pump is selectively operated to circulate a supply of coolant to each of the plurality of coolant reservoirs.
摘要翻译：电子部件系统机柜包括多个电子部件系统托架以及安装在多个电子部件系统托架中的各个电子部件系统托架中的多个电子部件系统。电子部件系统柜还包括包括多个冷却剂储存器的冷却系统。多个冷却剂储存器中的每一个与多个电子元件系统托架中的至少一个相关联。冷却系统还包括流体地连接到多个冷却剂储存器中的每一个的至少一个泵。所述至少一个泵被选择性地操作以将供应的冷却剂循环到多个冷却剂储存器中的每一个。

8. 发明申请

US20060286712A1 Thermal interface with a patterned structure 有权
标题翻译：具有图形结构的热界面
公开(公告)号：US20060286712A1
公开(公告)日：2006-12-21
申请号：US11437084
申请日：2006-05-19
申请人： Thomas Brunschwiler , Urs Kloter , Ryan Linderman , Bruno Michel , Hugo Rothuizen
发明人： Thomas Brunschwiler , Urs Kloter , Ryan Linderman , Bruno Michel , Hugo Rothuizen
IPC分类号： H01L21/00 , H01L23/02
CPC分类号： H01L23/3733 , H01L23/3737 , H01L23/42 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/2929 , H01L2224/293 , H01L2224/32245 , H01L2224/73253 , H01L2224/83365 , H01L2224/83385 , H01L2224/8385 , H01L2924/01057
摘要： An interface is formed by pressing a patterned first surface and a second surface together, with a particle-loaded interface material in between. The first surface is fabricated with a pattern of channels designed to redistribute the velocity gradients that occur in the interface material during interface formation in order to control the arrangement, orientation and concentration of particles at the end of the interface formation. The concept finds application in thermal interfaces and controlled placement of nano and micro particles and biological molecules.
摘要翻译：通过将图案化的第一表面和第二表面压在一起形成界面，其中颗粒加载的界面材料在其间。第一表面被制造成具有通道图案，其设计用于在界面形成期间重新分布出现在界面材料中的速度梯度，以便控制在界面形成结束时颗粒的排列，取向和浓度。该概念适用于热界面和受控放置的纳米微粒和生物分子。

9. 发明授权

US08487427B2 Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly 有权
标题翻译：组装包括通过晶片通孔的多个通孔，冷却组件的方法和制造组件的方法
公开(公告)号：US08487427B2
公开(公告)日：2013-07-16
申请号：US12544344
申请日：2009-08-20
申请人： Kerry Bernstein , Thomas Brunschwiler , Bruno Michel
发明人： Kerry Bernstein , Thomas Brunschwiler , Bruno Michel
IPC分类号： H01L23/24
CPC分类号： H01L23/49827 , H01L23/46 , H01L23/473 , H01L25/0657 , H01L2224/16 , H01L2225/06541 , H01L2225/06589 , H01L2924/15159 , H01L2924/3011
摘要： An assembly includes a chip including an integrated circuit, a casing including an integrated circuit and having an upper portion formed on a side of the chip and lower portion formed on another side of the chip, plural through-wafer vias (TWVs) for electrically connecting the integrated circuit of the chip and the integrated circuit of the casing, and a card connected to the casing for electrically connecting the casing to a system board.
摘要翻译：一种组件，包括集成电路的芯片，包括集成电路的壳体，并且具有形成在芯片的一侧的上部和形成在芯片的另一侧的下部，用于电连接的多个贯通晶片通孔（TWV）芯片的集成电路和壳体的集成电路，以及连接到壳体的卡，用于将壳体电连接到系统板。

10. 发明申请

US20120148187A1 INTEGRATED CIRCUIT PACKAGE CONNECTED TO A DATA TRANSMISSION MEDIUM 有权
标题翻译：集成电路连接到数据传输介质的电路
公开(公告)号：US20120148187A1
公开(公告)日：2012-06-14
申请号：US13312327
申请日：2011-12-06
申请人： Harry Barowski , Thomas Brunschwiler , Roger F. Dangel , Hubert Harrer , Andreas Huber , Norbert M. Meier , Bruno Michel , Tim Niggemeier , Stephan Paredes , Jochen Supper , Jonas R. Weiss
发明人： Harry Barowski , Thomas Brunschwiler , Roger F. Dangel , Hubert Harrer , Andreas Huber , Norbert M. Meier , Bruno Michel , Tim Niggemeier , Stephan Paredes , Jochen Supper , Jonas R. Weiss
IPC分类号： H01L23/538 , H01L21/50 , G02B6/12
CPC分类号： G02B6/43 , H01L23/3128 , H01L23/481 , H01L23/5226 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/14 , H01L24/16 , H01L25/0657 , H01L2224/03464 , H01L2224/0401 , H01L2224/05009 , H01L2224/051 , H01L2224/05147 , H01L2224/05184 , H01L2224/05655 , H01L2224/131 , H01L2224/14183 , H01L2224/16145 , H01L2224/16195 , H01L2224/16225 , H01L2225/06513 , H01L2225/06517 , H01L2225/06534 , H01L2225/06551 , H01L2225/06565 , H01L2924/14 , H01L2924/1533 , H01L2924/014
摘要： An integrated circuit coupling device includes an integrated circuit package with N integrated circuit layers (L1-LN) arranged as a 3D stack; and a data transmission medium with n data transmission layers (l1-ln), wherein n≧1 and N≧2, and wherein the N integrated circuit layers are electrically connectable to the n data transmission layers.
摘要翻译：集成电路耦合装置包括具有以3D叠层排列的N个集成电路层（L1-LN）的集成电路封装; 以及具有n个数据传输层（111-1）的数据传输介质，其中n≥1且N≥2，并且其中所述N个集成电路层可电连接到所述n个数据传输层。

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