专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20090200704A1 COMPRESSION MOLDING METHOD FOR ELECTRONIC COMPONENT AND COMPRESSION MOLDING APPARATUS EMPLOYED THEREFOR 有权
标题翻译：电子元器件的压缩成型方法及其应用的压缩成型设备
公开(公告)号：US20090200704A1
公开(公告)日：2009-08-13
申请号：US12303504
申请日：2007-10-22
申请人： Tetsuya Yamada , Tomoyuki Gotoh
发明人： Tetsuya Yamada , Tomoyuki Gotoh
IPC分类号： B29C43/18
CPC分类号： B29C43/18 , B29C31/045 , B29C43/34 , B29C2043/023 , B29C2043/3438 , B29L2031/772 , H01L21/565 , H01L21/566 , H01L24/97 , H01L2924/12033 , H01L2924/12041 , H01L2924/181 , H01L2924/00
摘要： First, a horizontal nozzle is inserted between an upper mold section and a lower mold section in a horizontally extending state. Then, liquid resin is horizontally discharged from a discharge port of the horizontal nozzle. Thus, the liquid resin is supplied into a cavity. Thereafter the upper mold section and the lower mold section are closed. Consequently, an electronic component mounted on a substrate is dipped in the liquid resin stored in the cavity. Therefore, the electronic component is resin-sealed on the substrate by compression molding.
摘要翻译：首先，水平喷嘴以水平延伸状态插入在上模具部分和下模具部件之间。然后，液态树脂从水平喷嘴的排出口水平排出。因此，将液体树脂供给到空腔中。此后，上模具部分和下模具部分被关闭。因此，将安装在基板上的电子部件浸入存储在空腔中的液体树脂中。因此，通过压缩成型将电子部件树脂密封在基板上。

2. 发明授权

US08684718B2 Compression molding method for electronic component and compression molding apparatus employed therefor 有权
标题翻译：用于其的电子部件和压缩成型设备的压缩成型方法
公开(公告)号：US08684718B2
公开(公告)日：2014-04-01
申请号：US13335460
申请日：2011-12-22
申请人： Tetsuya Yamada , Tomoyuki Gotoh
发明人： Tetsuya Yamada , Tomoyuki Gotoh
IPC分类号： A23G1/20 , A23G1/22 , B29C45/14 , H01L21/00
CPC分类号： B29C43/18 , B29C31/045 , B29C43/34 , B29C2043/023 , B29C2043/3438 , B29L2031/772 , H01L21/565 , H01L21/566 , H01L24/97 , H01L2924/12033 , H01L2924/12041 , H01L2924/181 , H01L2924/00
摘要： First, a horizontal nozzle is inserted between an upper mold section and a lower mold section in a horizontally extending state. Then, liquid resin is horizontally discharged from a discharge port of the horizontal nozzle. Thus, the liquid resin is supplied into a cavity. Thereafter the upper mold section and the lower mold section are closed. Consequently, an electronic component mounted on a substrate is dipped in the liquid resin stored in the cavity. Therefore, the electronic component is resin-sealed on the substrate by compression molding.
摘要翻译：首先，水平喷嘴以水平延伸状态插入在上模具部分和下模具部件之间。然后，液态树脂从水平喷嘴的排出口水平排出。因此，将液体树脂供给到空腔中。此后，上模具部分和下模具部分被关闭。因此，将安装在基板上的电子部件浸入存储在空腔中的液体树脂中。因此，通过压缩成型将电子部件树脂密封在基板上。

3. 发明授权

US08105524B2 Compression molding method for electronic component and compression molding apparatus employed therefor 有权
标题翻译：用于其的电子部件和压缩成型设备的压缩成型方法
公开(公告)号：US08105524B2
公开(公告)日：2012-01-31
申请号：US12303504
申请日：2007-10-22
申请人： Tetsuya Yamada , Tomoyuki Gotoh
发明人： Tetsuya Yamada , Tomoyuki Gotoh
IPC分类号： B29C45/14 , B29B13/00 , A23G1/22
CPC分类号： B29C43/18 , B29C31/045 , B29C43/34 , B29C2043/023 , B29C2043/3438 , B29L2031/772 , H01L21/565 , H01L21/566 , H01L24/97 , H01L2924/12033 , H01L2924/12041 , H01L2924/181 , H01L2924/00
摘要： First, a horizontal nozzle is inserted between an upper mold section and a lower mold section in a horizontally extending state. Then, liquid resin is horizontally discharged from a discharge port of the horizontal nozzle. Thus, the liquid resin is supplied into a cavity. Thereafter the upper mold section and the lower mold section are closed. Consequently, an electronic component mounted on a substrate is dipped in the liquid resin stored in the cavity. Therefore, the electronic component is resin-sealed on the substrate by compression molding.
摘要翻译：首先，水平喷嘴以水平延伸状态插入在上模具部分和下模具部件之间。然后，液态树脂从水平喷嘴的排出口水平排出。因此，将液体树脂供给到空腔中。此后，上模具部分和下模具部分被关闭。因此，将安装在基板上的电子部件浸入存储在空腔中的液体树脂中。因此，通过压缩成型将电子部件树脂密封在基板上。

4. 发明授权

US5716108A Braking force control system of electric vehicle 失效
标题翻译：电动车制动力控制系统
公开(公告)号：US5716108A
公开(公告)日：1998-02-10
申请号：US534698
申请日：1995-09-27
申请人： Hironori Asa , Tomoyuki Gotoh , Kenji Takeda
发明人： Hironori Asa , Tomoyuki Gotoh , Kenji Takeda
IPC分类号： B60T8/26 , B60L7/24 , B60T7/04 , B60T13/58 , B60T13/74
CPC分类号： B60T7/042 , B60L11/1805 , B60L15/2009 , B60L3/0076 , B60L7/12 , B60L7/26 , B60T13/586 , B60T13/74 , B60L2240/421 , B60L2240/423 , B60L2250/26 , Y02T10/645 , Y02T10/7005 , Y02T10/72 , Y02T10/7275
摘要： A braking force control system of an electric vehicle includes a regenerative-controllable motor for driving driven wheels, wheel cylinders for braking non-driven wheels, respectively, and a master cylinder connected to a brake pedal for producing a master cylinder pressure in proportion to a depression amount of the brake pedal. A mechanical braking force control unit is further provided in a working fluid passage from the master cylinder and the wheel cylinders. The mechanical braking force control unit includes a proportioning valve and a free-piston cylinder arranged in parallel with each other in the working fluid passage. The proportioning valve is operated to output a wheel cylinder pressure to the wheel cylinders when the depression amount of the brake pedal is no more than a given value. On the other hand, the free-piston cylinder is operated to output a wheel cylinder pressure to the wheel cylinders when the depression amount of the brake pedal is more than the given value. A motor control unit is further provided to perform a regenerative control of the motor for achieving a regenerative braking force which is equal to a difference between a target total braking force derived based on the depression amount of the brake pedal and a mechanical braking force derived based on the wheel cylinder pressure outputted from the mechanical braking force control unit.
摘要翻译：电动车辆的制动力控制系统包括用于驱动从动轮的再生可控电动机，用于非驱动轮制动的车轮缸和连接到制动踏板的主缸，用于与主缸压力成比例地产生制动踏板的抑制量。机械制动力控制单元还设置在从主缸和轮缸的工作流体通道中。机械制动力控制单元包括在工作流体通道中彼此平行布置的配比阀和自由活塞缸。操作比例阀，当制动踏板的下压量不大于给定值时，将轮缸压力输出到轮缸。另一方面，当制动踏板的踩踏量大于给定值时，自由活塞气缸被操作以向轮缸输出轮缸压力。还设置有电动机控制单元，用于对电动机进行再生控制，以实现再生制动力，该再生制动力等于基于制动踏板的下压量导出的目标总制动力与基于制动踏板的机械制动力在从机械制动力控制单元输出的轮缸压力上。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式