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    • 2. 发明授权
    • Fabrication method of multilayer printed wiring board
    • 多层印刷线路板的制作方法
    • US5979044A
    • 1999-11-09
    • US45797
    • 1998-03-23
    • Shinji SumiKouichi Wakashima
    • Shinji SumiKouichi Wakashima
    • H05K1/11H05K3/00H05K3/46H05K3/36
    • H05K3/4623H05K1/113H05K3/0094Y10T29/49126Y10T29/49144Y10T29/49165
    • A fabrication method of a multilayer PWB is provided, which realizes a satisfactorily-high adhesion strength between a mounting pad and a cured resin of a prepreg layer located in a surface via hole. A first surface via hole is formed in a first subboard, and a second surface via hole is formed in a second subboard. Then, the first and second subboards are laminated together while placing an inner structure including a prepreg layer between the first and second subboards. The first and second surface via holes are filled with a resin contained in the prepreg layer. Filler particles are buried into first and second surface regions of the resin which are located in the first and second surface via holes, respectively. The filler particles buried into the first and second surface regions of the resin are removed by dissolving the filler particles, thereby roughening the first and second surface regions of the resin. First and second mounting pads are formed to be contacted with the roughened first and second surface regions of the resin, respectively.
    • 提供了一种多层PWB的制造方法,其实现了安装焊盘和位于表面通孔中的预浸料层的固化树脂之间令人满意的粘附强度。 第一表面通孔形成在第一子板中,第二表面通孔形成在第二子板中。 然后,将第一和第二子板层叠在一起,同时将包括预浸料层的内部结构放置在第一和第二底板之间。 第一和第二表面通孔填充有预浸料层中所含的树脂。 填料颗粒被埋在分别位于第一和第二表面通孔中的树脂的第一和第二表面区域中。 通过溶解填料颗粒来除去掩埋在树脂的第一和第二表面区域中的填料颗粒,从而使树脂的第一和第二表面区域变粗糙。 第一和第二安装垫分别形成为与树脂的粗糙化的第一和第二表面区域接触。