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    • 5. 发明授权
    • Substrate for magnetic recording medium
    • 磁记录介质基板
    • US07242553B2
    • 2007-07-10
    • US10935519
    • 2004-09-07
    • Tetsuya OsakaToru AsahiTokihiko YokoshimaToshihiro Tsumori
    • Tetsuya OsakaToru AsahiTokihiko YokoshimaToshihiro Tsumori
    • G11B5/66G11B5/70
    • G11B5/667G11B5/00G11B5/7315G11B5/74G11B5/8404G11B2005/001G11B2005/0029
    • When a soft magnetic layer for a double layer type perpendicular magnetic recording medium is formed by a plating method, there is the problem of the occurrence of an isolated pulse noise called spike noise so that signal reproduction characteristics are lost. In order to solve this problem, provided are a surface-treated substrate for a magnetic recording medium comprising a substrate having a diameter of not more than 90 mm, and a soft magnetic plating layer comprising an alloy of at least two metals selected from the group consisting of Co, Ni and Fe, which is provided above the substrate, wherein the soft magnetic layer has a coercivity of less than 20 oersted (Oe) in a direction that is parallel to a substrate surface, and wherein a ratio of saturation magnetization to residual magnetization in a direction that is parallel to a surface of the substrate is from 4:1 to 4:3; and a magnetic recording medium comprising the magnetic recording medium substrate.
    • 当通过电镀法形成双层型垂直磁记录介质的软磁性层时,存在称为尖峰噪声的孤立脉冲噪声的问题,从而丢失了信号再现特性。 为了解决这个问题,提供了一种用于磁记录介质的经表面处理的基板,其包括直径不大于90mm的基板,以及软磁性镀层,该软磁性镀层包含选自以下的至少两种金属 由Co,Ni和Fe构成,其设置在衬底上方,其中软磁性层在平行于衬底表面的方向上具有小于20奥斯特(Oe)的矫顽力,并且其中饱和磁化强度与 在平行于衬底表面的方向上的剩余磁化强度为4:1至4:3; 以及包括磁记录介质基板的磁记录介质。
    • 6. 发明授权
    • Preparation of soft magnetic thin film
    • 软磁薄膜的制备
    • US07135103B2
    • 2006-11-14
    • US10816834
    • 2004-04-05
    • Tetsuya OsakaTokihiko Yokoshima
    • Tetsuya OsakaTokihiko Yokoshima
    • C25D5/18
    • C25D3/562C25D5/18C25D5/50C25D17/002
    • A soft magnetic thin film of CoFe alloy having a high Br and low Hc is prepared by furnishing a plating tank including cathode and anode compartments which are separated by a diaphragm or salt bridge so as to permit charge transfer, but inhibit penetration of Fe ions, feeding a plating solution containing Co ions and divalent Fe ions to the cathode compartment, feeding an electrolyte solution to the anode compartment, immersing a substrate in the plating solution, immersing an anode in the electrolyte solution, electroplating, and heat treating the plated film at 100–550° C.; or by immersing a substrate and a soluble anode in a plating solution containing Co ions and divalent Fe ions, electroplating, and heat treating the plated film at 100–550° C.
    • 制备具有高Br和低Hc的CoFe合金的软磁性薄膜,其包括通过隔膜或盐桥隔开的阴极和阳极隔室的镀槽,以允许电荷转移,但抑制Fe离子的渗透, 将含有Co离子和二价Fe离子的电镀液供给到阴极室,将电解质溶液供给到阳极室,将基板浸渍在电镀液中,将阳极浸渍在电解液中,电镀,并对镀膜进行热处理 100-550°C。 或者将基板和可溶性阳极浸渍在含有Co离子和二价Fe离子的电镀溶液中,电镀,并在100-550℃下热处理该镀膜。
    • 8. 发明申请
    • Preparation of soft magnetic thin film
    • 软磁薄膜的制备
    • US20050082171A1
    • 2005-04-21
    • US10816834
    • 2004-04-05
    • Tetsuya OsakaTokihiko Yokoshima
    • Tetsuya OsakaTokihiko Yokoshima
    • C25D3/56C25D5/18C25D5/50C25D17/00
    • C25D3/562C25D5/18C25D5/50C25D17/002
    • A soft magnetic thin film of CoFe alloy having a high Br and low Hc is prepared by furnishing a plating tank including cathode and anode compartments which are separated by a diaphragm or salt bridge so as to permit charge transfer, but inhibit penetration of Fe ions, feeding a plating solution containing Co ions and divalent Fe ions to the cathode compartment, feeding an electrolyte solution to the anode compartment, immersing a substrate in the plating solution, immersing an anode in the electrolyte solution, electroplating, and heat treating the plated film at 100-550° C.; or by immersing a substrate and a soluble anode in a plating solution containing Co ions and divalent Fe ions, electroplating, and heat treating the plated film at 100-550° C.
    • 制备具有高Br和低Hc的CoFe合金的软磁性薄膜,其包括通过隔膜或盐桥隔开的阴极和阳极隔室的镀槽,以允许电荷转移,但抑制Fe离子的渗透, 将含有Co离子和二价Fe离子的电镀液供给到阴极室,将电解质溶液供给到阳极室,将基板浸渍在电镀液中,将阳极浸渍在电解液中,电镀,并对镀膜进行热处理 100-550°C。 或者将基板和可溶性阳极浸渍在含有Co离子和二价Fe离子的电镀溶液中,电镀,并在100-550℃下热处理该镀膜。