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1. 发明授权

US5711413A Flat type IC conveyor 失效
标题翻译：扁平型IC输送机
公开(公告)号：US5711413A
公开(公告)日：1998-01-27
申请号：US761796
申请日：1996-12-06
申请人： Akio Nakamura , Tetsuya Okudaira , Yoshihiro Goto
发明人： Akio Nakamura , Tetsuya Okudaira , Yoshihiro Goto
IPC分类号： B65D85/86 , H01L21/673 , B65G21/20
CPC分类号： H01L21/67333
摘要： A flat type IC conveyor capable of conveying flat type ICs while stabilizing the posture of the ICs. A plurality of recess portions accommodating therein flat type ICs are formed lengthwise and widthwise on a flat type IC conveyor. Through holes are respectively defined in the bottom surfaces of the recess portions in a manner of avoiding leads of the ICs. Positioning pins are provided upright on the IC conveyor. A cover includes a plurality of convex portions which are positioned corresponding to the recess portions and direct to project toward package portions of the ICs to be accommodated in the recess portions. The cover also includes holes into which the positioning pins are inserted. When the cover is mounted on the conveyor, the convex portions can prevent the inclination of the ICs in the recess portions.
摘要翻译：平板型IC输送机能够在稳定IC的姿势的同时输送扁平型IC。容纳在其中的平坦型IC的多个凹部形成在扁平型IC输送机上纵向和横向地形成。以避免IC的引线的方式，在凹部的底表面分别限定通孔。定位销直立在IC输送机上。一个盖子包括多个凸起部分，这些凸起部分对应于这些凹部并且直接突出到IC的封装部分以容纳在凹部中。盖子还包括定位销插入其中的孔。当盖子安装在输送机上时，凸起部分可以防止IC在凹部中的倾斜。

2. 发明授权

US5686834A Handling system 失效
标题翻译：处理系统
公开(公告)号：US5686834A
公开(公告)日：1997-11-11
申请号：US717258
申请日：1996-09-20
申请人： Tetsuya Okudaira , Akio Nakamura , Yoshihiro Goto
发明人： Tetsuya Okudaira , Akio Nakamura , Yoshihiro Goto
IPC分类号： G01R31/26 , G01R31/28 , H01L21/66 , H01L21/677 , G01R31/02
CPC分类号： G01R31/2893 , G01R31/2851
摘要： A handling system which carries a carrier carrying a plurality of IC devices, subjects the IC devices to testing, sorts the tested IC devices and stores the tested IC devices, said handling system comprises test units for electrically connecting IC devices to an IC socket for transmitting electrical signals provided by the IC devices to an IC tester; a loader/unloader unit for transferring IC devices to be tested from a container to a carrier, sorting tested IC devices and selectively transferring the tested IC devices from the carrier to containers; and carrier transfer units combined with the test units, respectively, to transfer the carrier from the loader/unloader unit to the corresponding test units and from the corresponding test units to the loader/unloader unit. The number of the test units to be used in combination with the loader/unloader unit being varied according to test time required by the IC tester for testing the IC devices contained in the carrier.
摘要翻译：承载携带承载IC器件进行测试的多个IC器件的载体的处理系统对所测试的IC器件进行分类并存储所测试的IC器件，所述处理系统包括用于将IC器件电连接到用于传输的IC插座的测试单元由IC器件提供给IC测试仪的电信号; 用于将测试的IC器件从容器转移到载体的装载器/卸载器单元，对测试的IC器件进行分类并将测试的IC器件从载体选择性地传送到容器; 以及与测试单元组合的载体传送单元，以将载体从装载机/卸载机单元传送到相应的测试单元，并将相应的测试单元传送到装载机/卸载机单元。与装载机/卸载机组合使用的测试单元的数量根据IC测试仪测试载体中包含的IC器件所需的测试时间而变化。

3. 发明授权

US08841572B2 Switch device and connector 有权
标题翻译：开关设备和连接器
公开(公告)号：US08841572B2
公开(公告)日：2014-09-23
申请号：US13541889
申请日：2012-07-05
申请人： Daiei Iwamoto , Takashi Yuba , Koichi Kiryu , SeungSeok Beak , Akio Nakamura
发明人： Daiei Iwamoto , Takashi Yuba , Koichi Kiryu , SeungSeok Beak , Akio Nakamura
IPC分类号： H01H33/16 , H01H9/44 , H01H1/26 , H01H15/10 , H01H15/24 , H01H13/52
CPC分类号： H01H1/26 , H01H9/443 , H01H13/52 , H01H15/102 , H01H15/24
摘要： A switch device includes first and second contacting portions including first and second fixed contacting portions and first and second movable contacting portions configured to contact the first and second fixed contacting portions, respectively and provided to be adjacent from each other; and a magnet unit provided such that a first pole is positioned to face the first contacting portion and a second pole is positioned to face the second contacting portion to generate magnetic fields between the first fixed contacting portion and the first movable contacting portion and between the second fixed contacting portion and the second movable contacting portion, respectively.
摘要翻译：开关装置包括第一和第二接触部分，第一和第二接触部分包括第一和第二固定接触部分，第一和第二可动接触部分分别被配置成接触第一和第二固定接触部分并被设置为彼此相邻; 以及设置成使得第一极定位成面对第一接触部分并且第二极被定位成面对第二接触部分以在第一固定接触部分和第一可动接触部分之间以及在第二接触部分之间产生磁场的磁体单元固定接触部分和第二可动接触部分。

4. 发明申请

US20130037401A1 SWITCH DEVICE AND CONNECTOR 有权
标题翻译：开关器件和连接器
公开(公告)号：US20130037401A1
公开(公告)日：2013-02-14
申请号：US13541826
申请日：2012-07-05
申请人： Takashi Yuba , Daiei Iwamoto , SeungSeok Beak , Koichi Kiryu , Akio Nakamura
发明人： Takashi Yuba , Daiei Iwamoto , SeungSeok Beak , Koichi Kiryu , Akio Nakamura
IPC分类号： H01R13/70 , H01H33/20
CPC分类号： H01H13/52 , H01H1/24 , H01H9/44 , H01H9/46 , H01H15/102 , H01H15/24
摘要： A switch device includes first and second contacting portions including first and second fixed contacting portions and first and second movable contacting portions, respectively, the first fixed contacting portion and the second fixed contacting portion being configured to be electrically connected to one of a power source and an electronic device while the first movable contacting portion and the second movable contacting portion are configured to be electrically connected to the other of the power source and the electronic device; a first electric arc runner provided near at least one of the first fixed contacting portion and the first movable contacting portion; and a second electric arc runner provided near at least one of the second fixed contacting portion and the second movable contacting portion.
摘要翻译：开关装置包括分别包括第一和第二固定接触部分以及第一和第二可动接触部分的第一和第二接触部分，第一固定接触部分和第二固定接触部分被构造成电连接到电源和电子设备，同时第一可动接触部分和第二可动接触部分被配置为电连接到电源和电子设备中的另一个; 设置在第一固定接触部分和第一可动接触部分中的至少一个附近的第一电弧流道; 以及设置在第二固定接触部分和第二可动接触部分中的至少一个附近的第二电弧流道。

5. 发明授权

US07719516B2 Actuator having an inputting function 有权
标题翻译：具有输入功能的执行器
公开(公告)号：US07719516B2
公开(公告)日：2010-05-18
申请号：US10909329
申请日：2004-08-03
申请人： Noboru Fujii , Takashi Arita , Nobuyoshi Shimizu , Akio Nakamura , Shinichiro Akieda , Shigemi Kurashima
发明人： Noboru Fujii , Takashi Arita , Nobuyoshi Shimizu , Akio Nakamura , Shinichiro Akieda , Shigemi Kurashima
IPC分类号： G09G5/00
CPC分类号： H02K41/0354 , H02K2201/18
摘要： An actuator includes: a magnetic field generator that has different magnetic poles alternately arranged in a plane, with a predetermined position being the center of the magnetic poles; a coil holder that holds a plurality of coils that are radially arranged and face the magnetic field generator, relative motion being caused between the magnetic field generator and the coil holder; and an electromagnetic conversion unit that detects the relative motion and is mounted on either the magnetic field generator or the coil holder.
摘要翻译：致动器包括：具有交替布置在平面中的不同磁极的磁场发生器，其中预定位置是磁极的中心; 保持径向布置并面对磁场发生器的多个线圈的线圈架，在磁场发生器和线圈架之间产生相对运动; 以及电磁转换单元，其检测相对运动并安装在磁场发生器或线圈架上。

6. 发明授权

US07663151B2 Method of fabricating light emitting device and thus-fabricated light emitting device 有权
标题翻译：制造发光器件和由此制造的发光器件的方法
公开(公告)号：US07663151B2
公开(公告)日：2010-02-16
申请号：US11587632
申请日：2005-04-13
申请人： Hitoshi Ikeda , Kingo Suzuki , Akio Nakamura
发明人： Hitoshi Ikeda , Kingo Suzuki , Akio Nakamura
IPC分类号： H01L33/00
CPC分类号： H01L33/22 , H01L33/0079 , H01L33/0095 , H01L33/30
摘要： A light emitting device chip is obtained by dicing a light emitting device wafer having a light emitting layer section 24 based on a double heterostructure in which a first-conductivity-type cladding layer 6, an active layer 5 and an second-conductivity-type cladding layer 4, each of which being composed of a compound semiconductor having a composition allowing lattice matching with GaAs, out of compound semiconductors expressed by formula (AlxGa1-x)yIn1-yP (where, 0≦x≦1, 0≦y≦1), are stacked in this order, and having the (100) surface appeared on the main surface thereof, and GaP transparent semiconductor layers 20, 90 stacked on the light emitting layer section 24 as being agreed with the crystal orientation thereof, so that the {100} surfaces appear on the side faces of the GaP transparent semiconductor layer. Accordingly, there can be provided a method of fabricating a light emitting device having the AlGaInP light emitting layer section and the GaP transparent semiconductor layers, less causative of failures such as edge chipping during the dicing.
摘要翻译：通过基于双异质结构对具有发光层部分24的发光器件晶片进行切割来获得发光器件芯片，其中第一导电型包覆层6，有源层5和第二导电型包层（Al x Ga 1-x）y In 1-y P表示的化合物半导体中的每一个由具有允许与GaAs晶格匹配的组成的化合物半导体构成，其中，0≤x≤1,0< y <= 1）按顺序堆叠，并且在其主表面上出现（100）表面，并且与发光层部分24堆叠在一起的GaP透明半导体层20,90与晶体取向一致，使得{100}表面出现在GaP透明半导体层的侧面上。因此，可以提供一种制造具有AlGaInP发光层部分和GaP透明半导体层的发光器件的方法，其不利于在切割期间的边缘切屑等故障。

7. 发明授权

US07595557B2 Semiconductor device and manufacturing method thereof 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07595557B2
公开(公告)日：2009-09-29
申请号：US11453827
申请日：2006-06-16
申请人： Kazumi Watase , Akio Nakamura , Katsumi Ootani
发明人： Kazumi Watase , Akio Nakamura , Katsumi Ootani
IPC分类号： H01L29/40
CPC分类号： H01L22/14 , G01R31/2853 , H01L23/3114 , H01L23/5228 , H01L2924/0002 , H01L2924/014 , H01L2924/00
摘要： A metal wire for inspection and an electrode for inspection are formed on a region of a semiconductor substrate where a metal wire and an electrode for external connection are not formed. The metal wire for inspection and the electrode for inspection electrically detect an open failure, a short-circuit failure and a leakage failure of the metal wire and a connection failure between an element electrode and the metal wire. A semiconductor wafer is subjected to an electrical test, so that it is possible to detect the aforementioned failures with good accuracy during a manufacturing process.
摘要翻译：在不形成金属线和外部连接用电极的半导体基板的区域上形成检查用金属线和检查用电极。用于检查的金属线和用于检查的电极电检测金属线的开路故障，短路故障和漏电故障以及元件电极和金属线之间的连接故障。对半导体晶片进行电气测试，从而可以在制造过程中以高精度检测上述故障。

8. 发明授权

US07579205B2 Method of fabricating light emitting device and thus-fabricated light emitting device 有权
标题翻译：制造发光器件和由此制造的发光器件的方法
公开(公告)号：US07579205B2
公开(公告)日：2009-08-25
申请号：US11587635
申请日：2005-04-13
申请人： Hitoshi Ikeda , Kingo Suzuki , Akio Nakamura
发明人： Hitoshi Ikeda , Kingo Suzuki , Akio Nakamura
IPC分类号： H01L21/00
CPC分类号： H01L33/30 , H01L24/03 , H01L24/05 , H01L33/22 , H01L2224/48091 , Y10S438/964 , H01L2924/00014
摘要： A light emitting device wafer having a light emitting layer section 24 having an AlGaInP-base double heterostructure, and a GaP light extraction layer 20 disposed on the light emitting layer section so as to allow a first main surface thereof to compose a first main surface of the wafer is fabricated so that the first main surface of the GaP light extraction layer appears as the (100) surface. The first main surface of the GaP light extraction layer 20 composed of the (100) surface is etched using an etching solution for surface roughening to thereby form surface roughening projections 40f. Accordingly, there can be provided a method of fabricating a light emitting device having the GaP light extraction layer agreed with the (100) main surface, capable of readily subjecting the (100) main surface to surface roughening.
摘要翻译：一种发光器件晶片，具有具有AlGaInP基双异质结构的发光层部分24和设置在发光层部分上的GaP光提取层20，以便允许其第一主表面组成第一主表面制造晶片，使得GaP光提取层的第一主表面显示为（100）表面。使用用于表面粗糙化的蚀刻溶液蚀刻由（100）表面构成的GaP光提取层20的第一主表面，从而形成表面粗糙化突起40f。因此，可以提供一种制造具有与（100）主表面一致的GaP光提取层的发光器件的方法，能够容易地使（100）主表面粗糙化。

9. 发明授权

US07416805B2 Fuel cell device and case thereof 失效
标题翻译：燃料电池装置及其壳体
公开(公告)号：US07416805B2
公开(公告)日：2008-08-26
申请号：US10677353
申请日：2003-10-03
申请人： Akio Nakamura , Takashi Arita
发明人： Akio Nakamura , Takashi Arita
IPC分类号： H01M2/00 , H01M2/14 , H01M8/00
CPC分类号： H01M8/2475 , H01M8/248
摘要： A fuel cell device is disclosed that is capable of being made compact when being transported and in storage. The fuel cell device includes a fuel cell unit including a number of fuel cells arranged sequentially in a case. The case includes a holder frame for holding the fuel cells, a first hemi-case, and a second hemi-case. The width of the case is adjustable in the direction in which the fuel cells are arranged in a line. When the fuel cell device is being transported or in storage, the first hemi-case and the second hemi-case are pushed to approach each other, making the size of the case small. When the fuel cell device is used to generate electrical power, the first hemi-case and the second hemi-case are pulled apart from each other and, accordingly, the fuel cells are separated from each other by a springy plate.
摘要翻译：公开了一种燃料电池装置，其能够在运输和存储时被制造得紧凑。燃料电池装置包括燃料电池单元，该燃料电池单元包括在壳体中顺次布置的多个燃料电池。壳体包括用于保持燃料电池的保持架，第一半壳体和第二半壳体。壳体的宽度可以在燃料电池排列成一行的方向上调节。当燃料电池装置被运输或储存时，第一半箱和第二半壳被推动以彼此靠近，使得壳体的尺寸小。当燃料电池装置用于产生电力时，第一半壳体和第二半壳体彼此分离，因此燃料电池通过弹性板彼此分离。

10. 发明申请

US20080179723A1 SEMICONDUCTOR DEVICE INCLUDING A PLURAL CHIPS WITH PROTRUDING EDGES LAMINATED ON A DIE PAD SECTION THAT HAS A THROUGH SECTION 审中-公开
标题翻译：半导体器件，包括一个具有覆盖在一个通过部分的DIE封装部分上层叠的多个焊盘的半导体器件
公开(公告)号：US20080179723A1
公开(公告)日：2008-07-31
申请号：US11947169
申请日：2007-11-29
申请人： Akio Nakamura
发明人： Akio Nakamura
IPC分类号： H01L23/495
CPC分类号： H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/32145 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/83191 , H01L2225/06562 , H01L2924/00014 , H01L2924/181 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor device includes a die pad section having a surface and a back surface, a first semiconductor chip having a surface on which a first electrode section is formed, and a back surface fixed to the surface of the die pad section, a second semiconductor chip having a surface on which a second electrode section is formed, and a back surface fixed to the surface of the first semiconductor chip, lead terminal sections respectively electrically connected to the first and second electrode sections, and a resin encapsulating body that seals the die pad section and the first and second semiconductor chips. An edge portion of the second semiconductor chip protrudes from an edge portion of the first semiconductor chip. An edge portion of the die pad section protrudes from an edge portion of the first semiconductor chip.
摘要翻译：半导体器件包括具有表面和背面的芯片焊盘部分，具有形成有第一电极部分的表面的第一半导体芯片和固定到芯片焊盘部分的表面的后表面，第二半导体芯片具有形成第二电极部分的表面和固定到第一半导体芯片的表面的背面，分别电连接到第一和第二电极部分的引线端子部分和密封芯片焊盘的树脂封装体以及第一和第二半导体芯片。第二半导体芯片的边缘部分从第一半导体芯片的边缘部分突出。芯片焊盘部分的边缘部分从第一半导体芯片的边缘部分突出。

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