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1. 发明申请

US20100328815A1 MAGNETIC DISK DEVICE 审中-公开
标题翻译：磁盘设备
公开(公告)号：US20100328815A1
公开(公告)日：2010-12-30
申请号：US12811673
申请日：2009-01-29
申请人： Tetsuya Nakatsuka , Masato Nakamura , Satoshi Kaneko
发明人： Tetsuya Nakatsuka , Masato Nakamura , Satoshi Kaneko
IPC分类号： G11B5/127
CPC分类号： G11B25/043 , G11B33/122 , G11B33/1466 , H01R13/73
摘要： Due to a difference in coefficient of linear expansion between the constituent material of the flange and the constituent material of the base of the feedthrough, the solder material which joins these materials is unable to withstand the thermomechanical loading that is generated between these heterogeneous materials during their actual usage for a long period and, as a result, cracks formed in the solder-joined portion therebetween create low-density gas leakage paths that reduce actual lifespan to less than 5 years. Disclosed is a magnetic disk device comprising a magnetic disk, a magnetic head for recording and reproducing information onto and from the magnetic disk, a base, a feedthrough solder-joined to the base, and a solder-joined portion for joining the base and the feedthrough, wherein a recess portion is provided in the perimeter edge of the solder-joined portion of the base.
摘要翻译：由于法兰的构成材料与馈通基体的构成材料之间的线膨胀系数不同，与这些材料接合的焊料材料不能承受在它们之间产生的这些异质材料之间的热机械载荷实际使用长时间，结果，在焊料接合部分形成的裂纹产生低密度气体泄漏路径，将实际寿命缩短到5年以下。公开了一种磁盘装置，包括磁盘，用于在磁盘上记录和再现信息的磁头，基座，连接到基座的馈通焊料以及用于将基座和馈通，其中在基底的焊料接合部分的周边边缘中设置有凹部。

2. 发明授权

US06774490B2 Electronic device 失效
标题翻译：电子设备
公开(公告)号：US06774490B2
公开(公告)日：2004-08-10
申请号：US10395231
申请日：2003-03-25
申请人： Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Masato Nakamura , Yuji Fujita , Toshiharu Ishida , Masahide Okamoto , Koji Serizawa , Toshihiro Hachiya , Hideki Mukuno
发明人： Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Masato Nakamura , Yuji Fujita , Toshiharu Ishida , Masahide Okamoto , Koji Serizawa , Toshihiro Hachiya , Hideki Mukuno
IPC分类号： H01L2848
CPC分类号： H01L24/32 , B23K35/262 , B23K2101/36 , H01L24/33 , H01L24/73 , H01L24/81 , H01L2224/05155 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/131 , H01L2224/13144 , H01L2224/1319 , H01L2224/16225 , H01L2224/16227 , H01L2224/291 , H01L2224/29109 , H01L2224/29111 , H01L2224/2929 , H01L2224/29299 , H01L2224/293 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/15311 , H01L2924/15738 , H01L2924/1576 , H01L2924/16152 , H01L2924/181 , H01L2924/20106 , H05K3/3463 , Y10T428/12528 , H01L2924/00014 , H01L2224/13099 , H01L2924/00012 , H01L2924/01026 , H01L2924/01028 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199
摘要： An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0-2.0 mass %, In: 0.1-10 mass %, and Sn: remaining amount.
摘要翻译：电子设备能够改善电子设备中的抗冲击性或抗冲击性，并且提高半导体器件芯片接合Si芯片等中引起大变形的热冲击作用的焊点的可靠性，凸块安装的BGA，CSP，WPP，倒装芯片等，功率模块作用大的应力等等。电子设备具有电路板和电连接到电路板的电极的电子部件。电路板的电极和电子部件的电极通过使用由Cu：0-2.0质量％，In：0.1-10质量％和Sn：剩余量组成的无铅焊料进行焊接而连接。

3. 发明授权

US08020747B2 Soldering method and soldering apparatus 有权
标题翻译：焊接方法和焊接设备
公开(公告)号：US08020747B2
公开(公告)日：2011-09-20
申请号：US12498909
申请日：2009-07-07
申请人： Tetsuya Nakatsuka , Masato Nakamura
发明人： Tetsuya Nakatsuka , Masato Nakamura
IPC分类号： B23K1/06
CPC分类号： B23K1/012 , B23K1/0016 , B23K1/0053 , B23K1/06 , B23K3/087 , B23K37/0408 , B23K37/047 , B23K2101/42 , H05K3/3436 , H05K2203/0285 , Y02P70/613
摘要： Along with miniaturization of a solder connection portion in a bump repair or a local reflow, a void generated at the time of soldering remains in a solder to remarkably reduce connection strength, and there occurs a non-connection phenomenon in which the solder connection portion and a solder paste are melted, but are not fused with each other. During melting of a solder, a target component is clamped, ultrasonic oscillation is directly applied only to the target component. Further, start of solidification of the solder connection portion is detected by change of an electric impedance of a transducer while applying the ultrasonic oscillation, and the clamp is released before a substrate is warped.
摘要翻译：随着焊接修补或局部回流中焊料连接部分的小型化，在焊接时产生的空隙留在焊料中，显着降低连接强度，并且发生焊接连接部分和焊膏熔化，但不融合。在焊料熔化期间，目标部件被夹紧，超声波振荡仅直接施加于目标部件。此外，通过在施加超声波振荡的同时换能器的电阻抗的变化来检测焊料连接部的凝固的开始，并且在基板翘曲之前释放夹具。

4. 发明申请

US20100006624A1 SOLDERING METHOD AND SOLDERING APPARATUS 有权
标题翻译：焊接方法和焊接设备
公开(公告)号：US20100006624A1
公开(公告)日：2010-01-14
申请号：US12498909
申请日：2009-07-07
申请人： Tetsuya Nakatsuka , Masato Nakamura
发明人： Tetsuya Nakatsuka , Masato Nakamura
IPC分类号： B23K1/06 , B23K3/04
CPC分类号： B23K1/012 , B23K1/0016 , B23K1/0053 , B23K1/06 , B23K3/087 , B23K37/0408 , B23K37/047 , B23K2101/42 , H05K3/3436 , H05K2203/0285 , Y02P70/613
摘要： Along with miniaturization of a solder connection portion in a bump repair or a local reflow, a void generated at the time of soldering remains in a solder to remarkably reduce connection strength, and there occurs a non-connection phenomenon in which the solder connection portion and a solder paste are melted, but are not fused with each other. During melting of a solder, a target component is clamped, ultrasonic oscillation is directly applied only to the target component. Further, start of solidification of the solder connection portion is detected by change of an electric impedance of a transducer while applying the ultrasonic oscillation, and the clamp is released before a substrate is warped.
摘要翻译：随着焊接修补或局部回流中焊料连接部分的小型化，在焊接时产生的空隙留在焊料中，显着降低连接强度，并且发生焊接连接部分和焊膏熔化，但不融合。在焊料熔化期间，目标部件被夹紧，超声波振荡仅直接施加到目标部件。此外，通过在施加超声波振荡的同时换能器的电阻抗的变化来检测焊料连接部的凝固的开始，并且在基板翘曲之前释放夹具。

5. 发明授权

US06555052B2 Electron device and semiconductor device 失效
公开(公告)号：US06555052B2
公开(公告)日：2003-04-29
申请号：US09799486
申请日：2001-03-07
申请人： Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Masato Nakamura , Yuji Fujita , Toshiharu Ishida , Masahide Okamoto , Koji Serizawa , Toshihiro Hachiya , Hideki Mukuno
发明人： Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Masato Nakamura , Yuji Fujita , Toshiharu Ishida , Masahide Okamoto , Koji Serizawa , Toshihiro Hachiya , Hideki Mukuno
IPC分类号： C22C1302
CPC分类号： H01L24/32 , B23K35/262 , B23K2101/36 , H01L24/33 , H01L24/73 , H01L24/81 , H01L2224/05155 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/131 , H01L2224/13144 , H01L2224/1319 , H01L2224/16225 , H01L2224/16227 , H01L2224/291 , H01L2224/29109 , H01L2224/29111 , H01L2224/2929 , H01L2224/29299 , H01L2224/293 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/15311 , H01L2924/15738 , H01L2924/1576 , H01L2924/16152 , H01L2924/181 , H01L2924/20106 , H05K3/3463 , Y10T428/12528 , H01L2924/00014 , H01L2224/13099 , H01L2924/00012 , H01L2924/01026 , H01L2924/01028 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199
摘要： An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0˜2.0 mass %, In: 0.1˜10 mass %, and Sn: remaining amount.

6. 发明授权

US09325603B2 Network performance estimating apparatus and network performance estimating method, network configuration checking method, communication managing apparatus, and data communication method 有权
标题翻译：网络性能估计装置和网络性能估计方法，网络配置检查方法，通信管理装置和数据通信方法
公开(公告)号：US09325603B2
公开(公告)日：2016-04-26
申请号：US14445258
申请日：2014-07-29
申请人： Masato Nakamura
发明人： Masato Nakamura
IPC分类号： H04L12/26 , H04L12/24 , H04L12/40 , H04L12/403 , H04L12/417 , H04L12/407
CPC分类号： H04L43/50 , H04L12/40019 , H04L12/4035 , H04L12/407 , H04L12/417 , H04L41/0866 , H04L43/00 , Y04S40/162 , Y04S40/168
摘要： A network performance estimating apparatus includes a network-configuration depicting unit configured to generate, from a designed network, network configuration information indicating a connection relation of ports among communication apparatuses and store, as attribute information, apparatus identification information including input peculiar information for each communication apparatus name and apparatus type of the communication apparatuses, a communication-apparatus-attribute-information acquiring unit configured to acquire, communication performance of the communication apparatuses specified by the apparatus identification information from peculiar information in which apparatus model names and communication performance are stored in association with each other, a token-circulation-order determining unit configured to determine, from the network configuration information, token circulation order indicating order in a designed network, and a performance estimating unit configured to calculate communication performance of the designed network using the token circulation order and the communication performance of the communication apparatuses.
摘要翻译：网络性能估计装置包括网络配置描绘单元，被配置为从设计的网络生成指示通信装置之间的端口的连接关系的网络配置信息，作为属性信息存储包括用于每个通信的输入特有信息的装置识别信息设备名称和设备类型，通信设备属性信息获取单元，被配置为从存储设备型号名称和通信性能的特殊信息中获取由设备识别信息指定的通信设备的通信性能相关联的令牌循环顺序确定单元，被配置为从网络配置信息确定指示在设计网络中的顺序的令牌循环顺序，以及配置了性能估计单元使用令牌循环顺序和通信装置的通信性能来计算设计网络的通信性能。

7. 发明授权

US08687481B2 Communication system, management apparatus, communication apparatus and computer program 失效
标题翻译：通信系统，管理装置，通信装置和计算机程序
公开(公告)号：US08687481B2
公开(公告)日：2014-04-01
申请号：US12593079
申请日：2007-04-04
申请人： Hiroshi Sakurada , Masato Nakamura
发明人： Hiroshi Sakurada , Masato Nakamura
IPC分类号： H04J3/06
CPC分类号： H04L12/422 , H04J3/0667 , H04J3/0673 , H04J3/14
摘要： In a ring type network, a master node sends a measurement packet to a slave node in the backward direction and the forward direction, receives the measurement packet which has been circulated among a plurality of slave nodes, stores a received time of the backward direction measurement packet and a sending time of the forward direction measurement packet according to time-keeping of an internal clock, sends a measurement result notifying packet showing a sending time and a received time of the measurement packet to the slave node; each slave node receives the backward direction measurement packet and the forward direction measurement packet, sends the received measurement packet to the next node, stores the received time of the backward direction measurement packet and the sending time of the forward direction measurement packet according to the time-keeping of the internal clock, receives a measurement result notifying packet, calculates a time correction value using the sending time and the received time of the measurement packet shown in the measurement result notifying packet and the sending time and the received time of the measurement packet stored, and corrects a time of the internal clock using the calculated time correction value.
摘要翻译：在环型网络中，主节点向后向和向前向从节点发送测量分组，接收多个从节点之间已经循环的测量分组，存储后向测量的接收时间分组和根据内部时钟的时间保持的前向测量分组的发送时间，将表示测量分组的发送时间和接收时间的测量结果通知分组发送给从节点; 每个从节点接收反向测量分组和正向测量分组，将接收到的测量分组发送到下一个节点，根据时间存储反向测量分组的接收时间和正向测量分组的发送时间记录内部时钟，接收测量结果通知包，使用测量结果通知包中显示的测量包的发送时间和接收时间以及测量包的发送时间和接收时间来计算时间校正值使用计算出的时间校正值来存储和校正内部时钟的时间。

8. 发明申请

US20130128576A1 LIGHT-EMITTING DEVICE AND ILLUMINATION DEVICE 有权
标题翻译：发光装置和照明装置
公开(公告)号：US20130128576A1
公开(公告)日：2013-05-23
申请号：US13813830
申请日：2011-07-29
申请人： Akinobu Seki , Hiroshi Takatori , Kyouhei Yamada , Masato Nakamura , Masayo Takizawa , Noriyuki Kawahara
发明人： Akinobu Seki , Hiroshi Takatori , Kyouhei Yamada , Masato Nakamura , Masayo Takizawa , Noriyuki Kawahara
IPC分类号： F21V13/08 , F21V7/00
CPC分类号： F21V13/08 , F21V5/02 , F21V5/04 , F21V7/00 , F21V7/0091 , F21V13/02 , F21V17/06 , F21V17/164 , F21Y2115/10 , G02B7/022 , G02B19/0028 , G02B19/0047 , G02B19/0061 , H01L33/58
摘要： A light-emitting device combining a first luminous flux control member having a total reflection surface and emitting light from an emission surface in a narrow angle range centered mainly on an optical axis, and a second luminous flux control member arranged to surround the total reflection surface of the first luminous flux control member. The second luminous flux control member (102) of the light-emitting device is provided with a second incidence surface (126a) and a second emitting surface (126b). Of the light emitted from the light-emitting element (200), the light incident to the second incidence surface (126a) is within a range of angles θ larger than a largest angle to the optical axis of the light incident to the first luminous flux control member (101). The second emitting surface (126b) controls the light incident to the second incidence surface (126a) to have light distribution characteristics different from those of the light emitted from the first luminous flux control member (101), and emits the light.
摘要翻译：一种发光装置，其组合具有全反射面的第一光束控制构件和以主要以光轴为中心的窄角度范围的发射面发射光;以及第二光束控制构件，被配置为包围全反射面的第一光束控制构件。发光装置的第二光束控制构件（102）设置有第二入射面（126a）和第二发射面（126b）。从发光元件（200）发射的光中，入射到第二入射面（126a）的光在与入射到第一光通量的光的光轴的最大角度的角度θ以内控制构件（101）。第二发射表面（126b）控制入射到第二入射表面（126a）的光具有与从第一光束控制构件（101）发射的光不同的光分布特性，并发射光。

9. 发明授权

US08361650B2 Sealing gasket for alkaline dry cell 有权
标题翻译：用于碱性干电池的密封垫圈
公开(公告)号：US08361650B2
公开(公告)日：2013-01-29
申请号：US11991754
申请日：2006-07-11
申请人： Masato Nakamura , Yuji Tsuchida , Yukiyoshi Murakami
发明人： Masato Nakamura , Yuji Tsuchida , Yukiyoshi Murakami
IPC分类号： H01M2/08
CPC分类号： H01M2/06 , H01M2/0413 , H01M2/0421 , H01M2/08 , H01M6/06
摘要： [Problems] A sealing gasket for an alkaline dry cell formed from a 6-12 nylon resin by injection molding, which is inhibited from cracking that occurs at inserting a current collector through a central boss portion of a gasket and thereby reliably reduces occurrence of liquid leakage while retaining the advantages due to the use of the 6-12 nylon resin.[Means for Solving the Problems] A polyhexamethylene dodecamide resin is used as a resin material of injection molding, and one part or the whole of the same kind of recycled material which was once used in injection molding is used as the resin material of a section including at least the boss portion.
摘要翻译： [问题]通过注射成型由6-12尼龙树脂形成的碱性干电池用密封垫，其通过垫圈的中心凸台部插入集电体而抑制裂纹，从而可靠地减少液体的发生泄漏同时保留了使用6-12尼龙树脂的优点。解决问题的方法使用聚六亚甲基十二酰胺树脂作为注射成型用树脂材料，将一次或全部同样种类的再注入成型的回收材料用作部分的树脂材料至少包括凸起部分。

10. 发明申请

US20120229745A1 LIQUID CRYSTAL DISPLAY DEVICE 有权
标题翻译：液晶显示装置
公开(公告)号：US20120229745A1
公开(公告)日：2012-09-13
申请号：US13371798
申请日：2012-02-13
申请人： Kazuyuki Harada , Hiroyuki Kimura , Junichi Kobayashi , Masato Nakamura
发明人： Kazuyuki Harada , Hiroyuki Kimura , Junichi Kobayashi , Masato Nakamura
IPC分类号： G02F1/1337
CPC分类号： G02F1/133784 , G02F1/133707 , G02F1/134309 , G02F2001/134372
摘要： In one embodiment, a liquid crystal display device includes a first substrate and a second substrate. The first substrate includes a switching element, a first electrode, a second electrode electrically connected with the switching element and facing the first electrode. In the second electrode, a plurality of slits in a V shape is formed along a first direction. The first and second substrates include first and second alignment films, respectively. The slit in the V shape includes a central portion, a first end connected with one end of the first central portion, a second end connected with the other end of the first central portion, a second central portion, a third end connected with one end of the second central portion, and a fourth end connected with the other end of the second central portion. The first end and the third end are connected each other.
摘要翻译：在一个实施例中，液晶显示装置包括第一基板和第二基板。第一基板包括开关元件，第一电极，与开关元件电连接并面向第一电极的第二电极。在第二电极中，沿着第一方向形成有V形的多个狭缝。第一和第二基板分别包括第一和第二取向膜。 V形的狭缝包括中心部分，与第一中心部分的一端连接的第一端，与第一中心部分的另一端连接的第二端，第二中心部分，与一端连接的第三端并且与第二中心部分的另一端连接的第四端。第一端和第三端彼此连接。

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