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1. 发明授权

US5010313A Chip coil 失效
标题翻译：芯片线圈
公开(公告)号：US5010313A
公开(公告)日：1991-04-23
申请号：US530402
申请日：1990-05-30
申请人： Toshimi Kaneko , Tetsuya Morinaga , Tetsuo Hatakenaka
发明人： Toshimi Kaneko , Tetsuya Morinaga , Tetsuo Hatakenaka
IPC分类号： H01F27/00 , H01F17/04 , H01F27/29
CPC分类号： H01F17/045 , H01F27/292
摘要： A chip coil wherein the coil wound around the core is enclosed with a sleeve core. The upper surfaces of the core and the sleeve core are ground so as to adjust the inductance of the chip coil.
摘要翻译：卷绕在芯上的线圈的芯片线圈被套筒芯封闭。芯体和套筒芯的上表面被研磨以调节芯片线圈的电感。

2. 发明授权

US5936504A Chip-type coil device 失效
标题翻译：片式线圈装置
公开(公告)号：US5936504A
公开(公告)日：1999-08-10
申请号：US84234
申请日：1998-05-25
申请人： Tetsuo Hatakenaka
发明人： Tetsuo Hatakenaka
IPC分类号： H01F27/02 , H01F27/29 , H01F41/04 , H01H27/02 , H01H5/00
CPC分类号： H01F41/046 , H01F27/027 , H01F27/292 , Y10T29/49071 , Y10T29/49076
摘要： A method for accurately and inexpensively producing a chip-type coil device comprises first forming an insulating plate. A plurality of parallel division grooves are then formed in a first direction on the insulating plate on one surface thereof. Thereafter, a conductive layer is formed on the insulating plate, wherein the conductive layer also coats the division grooves. The process then entails forming recess grooves between the division grooves on the insulating plate on which the conductive layer has been formed, and then dividing the insulating plate by forming slots within the division grooves, wherein the slots have widths which are smaller than widths of the division grooves. The method then entails dividing the insulating plate in a second direction to form a plurality of cores, wherein each of the cores comprise at least two leg portions having a first recess therebetween formed by one of the first recess grooves, and further including terminal electrodes on the leg portions formed by the conductive layer. Thereafter, for each of the cores, winding wire is wound around a winding section of the core and the wire is connected to terminal electrodes on the leg portions. The method provides devices which have improved accuracy and strength compared to the conventional devices produced by press molding.
摘要翻译：准确且廉价地制造芯片型线圈装置的方法包括首先形成绝缘板。然后在绝缘板的一个表面上沿第一方向形成多个平行分隔槽。此后，在绝缘板上形成导电层，其中导电层还涂覆有分隔槽。然后，该过程需要在已经形成导电层的绝缘板上的分隔槽之间形成凹槽，然后通过在分隔槽内形成狭缝来分隔绝缘板，其中狭槽的宽度小于分沟。该方法然后需要在第二方向上分隔绝缘板以形成多个芯，其中每个芯包括至少两个腿部，其具有由第一凹槽中的一个形成的第一凹部，并且还包括端子电极由导电层形成的腿部。此后，对于每个芯，绕组线缠绕在芯的绕组部分上，并且线连接到腿部上的端子电极。该方法提供了与通过压制成型生产的常规装置相比具有改进的精度和强度的装置。

3. 发明授权

US5787571A Method of producing coil devices 失效
标题翻译：生产线圈装置的方法
公开(公告)号：US5787571A
公开(公告)日：1998-08-04
申请号：US781715
申请日：1997-01-10
申请人： Tetsuo Hatakenaka
发明人： Tetsuo Hatakenaka
IPC分类号： H01F27/02 , H01F27/29 , H01F41/04 , H01F41/06
CPC分类号： H01F41/046 , H01F27/027 , H01F27/292 , Y10T29/49071 , Y10T29/49076
摘要： A method for accurately and inexpensively producing a chip-type coil device comprises first forming an insulating plate. A plurality of parallel division grooves are then formed in a first direction on the insulating plate on one surface thereof. Thereafter, a conductive layer is formed on the insulating plate, wherein the conductive layer also coats the division grooves. The process then entails forming recess grooves between the division grooves on the insulating plate on which the conductive layer has been formed, and then dividing the insulating plate by forming slots within the division grooves, wherein the slots have widths which are smaller than widths of the division grooves. The method then entails dividing the insulating plate in a second direction to form a plurality of cores, wherein each of the cores comprise at least two leg portions having a first recess therebetween formed by one of the first recess grooves, and further including terminal electrodes on the leg portions formed by the conductive layer. Thereafter, for each of the cores, winding wire is wound around a winding section of the core and the wire is connected to terminal electrodes on the leg portions. The method provides devices which have improved accuracy and strength compared to the conventional devices produced by press molding.
摘要翻译：准确且廉价地制造芯片型线圈装置的方法包括首先形成绝缘板。然后在绝缘板的一个表面上沿第一方向形成多个平行分隔槽。此后，在绝缘板上形成导电层，其中导电层还涂覆有分隔槽。然后，该过程需要在已经形成导电层的绝缘板上的分隔槽之间形成凹槽，然后通过在分隔槽内形成狭缝来分隔绝缘板，其中狭槽的宽度小于分沟。该方法然后需要在第二方向上分隔绝缘板以形成多个芯，其中每个芯包括至少两个腿部，其具有由第一凹槽中的一个形成的第一凹部，并且还包括端子电极由导电层形成的腿部。此后，对于每个芯，绕组线缠绕在芯的绕组部分上，并且线连接到腿部上的端子电极。该方法提供了与通过压制成型生产的常规装置相比具有改进的精度和强度的装置。

4. 发明授权

US06552642B1 Electronic device having electric wires and method of producing same 有权
标题翻译：具有电线的电子装置及其制造方法
公开(公告)号：US06552642B1
公开(公告)日：2003-04-22
申请号：US09317665
申请日：1999-05-24
申请人： Takaomi Toi , Tetsuya Morinaga , Masahiro Bando , Tetsuo Hatakenaka , Kazuo Kasahara , Koki Sasaki , Takayuki Hirotsuji
发明人： Takaomi Toi , Tetsuya Morinaga , Masahiro Bando , Tetsuo Hatakenaka , Kazuo Kasahara , Koki Sasaki , Takayuki Hirotsuji
IPC分类号： H01F2729
CPC分类号： B23K20/023 , B23K2101/40 , H01F17/045 , H01F27/292 , H01F41/10 , H01L2924/0002 , H01L2924/00
摘要： An electronic device such as a chip coil including an electric wire firmly connected to electrodes in a highly reliable fashion is constructed to be mounted on a printed circuit board or substrate in a stable and reliable manner. At both ends of a core of the chip coil, there are provided electrodes having a multilayer structure including a high-conductivity layer made of Ag, Ag—Pd, or a similar material; a solder barrier layer made of Ni; and an easy-soldering layer made of Sn or solder. End portions of the electric wire are embedded in the easy-soldering layer so that the resultant electrode structure has a substantially flat surface. A thermo-compression process is performed so that the end portions of the electric wire are connected to the solder barrier layer via solid welding and to the easy-soldering layer via brazing.
摘要翻译：包括以高度可靠的方式牢固地连接到电极的电线的芯片线圈等电子装置被构造成以稳定可靠的方式安装在印刷电路板或基板上。在芯片线圈的芯的两端，设置有包括由Ag，Ag-Pd或类似材料制成的高导电层的多层结构的电极; 由Ni制成的阻焊层; 以及由Sn或焊料制成的易焊层。电线的端部埋设在易焊接层中，使得所得的电极结构具有基本平坦的表面。进行热压处理，使得电线的端部通过固体焊接与阻焊层连接，并通过钎焊与易焊接层连接。

5. 发明授权

US6119924A Electronic device having electric wires and method of producing same 有权
公开(公告)号：US6119924A
公开(公告)日：2000-09-19
申请号：US432979
申请日：1999-11-03
申请人： Takaomi Toi , Tetsuya Morinaga , Masahiro Bando , Tetsuo Hatakenaka , Kazuo Kasahara , Koki Sasaki , Takayuki Hirotsuji
发明人： Takaomi Toi , Tetsuya Morinaga , Masahiro Bando , Tetsuo Hatakenaka , Kazuo Kasahara , Koki Sasaki , Takayuki Hirotsuji
IPC分类号： B23K20/02 , B23K20/00
CPC分类号： B23K20/023 , B23K2201/40
摘要： An electronic device such as a chip coil including an electric wire firmly connected to electrodes in a highly reliable fashion is constructed to be mounted on a printed circuit board or substrate in a stable and reliable manner. At both ends of a core of the chip coil, there are provided electrodes having a multilayer structure including a high-conductivity layer made of Ag, Ag--Pd, or a similar material; a solder barrier layer made of Ni; and an easy-soldering layer made of Sn or solder. End portions of the electric wire are embedded in the easy-soldering layer so that the resultant electrode structure has a substantially flat surface. A thermo-compression process is performed so that the end portions of the electric wire are connected to the solder barrier layer via solid welding and to the easy-soldering layer via brazing.

6. 发明授权

US06027008A Electronic device having electric wires and method of producing same 失效
公开(公告)号：US06027008A
公开(公告)日：2000-02-22
申请号：US076549
申请日：1998-05-12
申请人： Takaomi Toi , Tetsuya Morinaga , Masahiro Bando , Tetsuo Hatakenaka , Kazuo Kasahara , Koki Sasaki , Takayuki Hirotsuji
发明人： Takaomi Toi , Tetsuya Morinaga , Masahiro Bando , Tetsuo Hatakenaka , Kazuo Kasahara , Koki Sasaki , Takayuki Hirotsuji
IPC分类号： B23K20/02 , H01F17/04 , H01F27/29 , H01F41/10 , H05K3/34 , H01L21/603 , H01L21/607
CPC分类号： B23K20/023 , H01F27/292 , H01F41/10 , B23K2201/40 , H01F17/045 , H01L2924/0002
摘要： An electronic device such as a chip coil including an electric wire firmly connected to electrodes in a highly reliable fashion is constructed to be mounted on a printed circuit board or substrate in a stable and reliable manner. At both ends of a core of the chip coil, there are provided electrodes having a multilayer structure including a high-conductivity layer made of Ag, Ag--Pd, or a similar material; a solder barrier layer made of Ni; and an easy-soldering layer made of Sn or solder. End portions of the electric wire are embedded in the easy-soldering layer so that the resultant electrode structure has a substantially flat surface. A thermo-compression process is performed so that the end portions of the electric wire are connected to the solder barrier layer via solid welding and to the easy-soldering layer via brazing.

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