会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明授权
    • Substrate holding apparatus and polishing apparatus
    • 基板保持装置和抛光装置
    • US07311585B2
    • 2007-12-25
    • US11312571
    • 2005-12-21
    • Tetsuji TogawaOsamu NabeyaMakoto FukushimaKunihiko SakuraiHiroshi YoshidaTeruhiko Ichimura
    • Tetsuji TogawaOsamu NabeyaMakoto FukushimaKunihiko SakuraiHiroshi YoshidaTeruhiko Ichimura
    • B24B1/00
    • B24B37/30B24B41/061B24B49/105
    • The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.
    • 本发明涉及一种用于将基板(例如半导体晶片)保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。 根据本发明的基板保持装置包括其中具有容纳空间的顶环主体和可在顶环体中的容纳空间内垂直移动的可垂直移动的构件。 具有弹性膜的邻接构件附接到可垂直移动构件的下表面。 邻接构件的弹性膜包括邻接部分,其具有向外突出的凸缘,与基底直接或间接接触;以及连接部分,其从邻接部分的凸缘的基部向上延伸并连接到 垂直活动件。 连接部由具有高于邻接部的材料的柔软性的材料制成。
    • 3. 发明申请
    • Substrate holding apparatus and polishing apparatus
    • 基板保持装置和抛光装置
    • US20080119121A1
    • 2008-05-22
    • US11987978
    • 2007-12-06
    • Tetsuji TogawaOsamu NabeyaMakoto FukushimaKunihiko SakuraiHiroshi YoshidaTeruhiko Ichimura
    • Tetsuji TogawaOsamu NabeyaMakoto FukushimaKunihiko SakuraiHiroshi YoshidaTeruhiko Ichimura
    • B24B7/04B24B29/02
    • B24B37/30B24B41/061B24B49/105
    • The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.
    • 本发明涉及一种用于将基板(例如半导体晶片)保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。 根据本发明的基板保持装置包括其中具有容纳空间的顶环主体和可在顶环体中的容纳空间内垂直移动的可垂直移动的构件。 具有弹性膜的邻接构件附接到可垂直移动构件的下表面。 邻接构件的弹性膜包括邻接部分,其具有向外突出的凸缘,与基底直接或间接接触;以及连接部分,其从邻接部分的凸缘的基部向上延伸并连接到 垂直活动件。 连接部由具有高于邻接部的材料的柔软性的材料制成。
    • 5. 发明申请
    • SUBSTRATE HOLDING APPARATUS AND POLISHING APPARATUS
    • 基板控制装置和抛光装置
    • US20100056028A1
    • 2010-03-04
    • US12613016
    • 2009-11-05
    • Tetsuji TOGAWAOsamu NabeyaMakoto FukushimaKunihiko SakuraiHiroshi YoshidaTeruhiko Ichimura
    • Tetsuji TOGAWAOsamu NabeyaMakoto FukushimaKunihiko SakuraiHiroshi YoshidaTeruhiko Ichimura
    • B24B41/06
    • B24B37/30B24B41/061B24B49/105
    • The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.
    • 本发明涉及一种用于将基板(例如半导体晶片)保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。 根据本发明的基板保持装置包括其中具有容纳空间的顶环主体和可在顶环体中的容纳空间内垂直移动的可垂直移动的构件。 具有弹性膜的邻接构件附接到可垂直移动构件的下表面。 邻接构件的弹性膜包括邻接部分,其具有向外突出的凸缘,与基底直接或间接接触;以及连接部分,其从邻接部分的凸缘的基部向上延伸并连接到 垂直活动件。 连接部由具有高于邻接部的材料的柔软性的材料制成。
    • 6. 发明授权
    • Substrate holding apparatus and polishing apparatus
    • 基板保持装置和抛光装置
    • US07632173B2
    • 2009-12-15
    • US11987978
    • 2007-12-06
    • Tetsuji TogawaOsamu NabeyaMakoto FukushimaKunihiko SakuraiHiroshi YoshidaTeruhiko Ichimura
    • Tetsuji TogawaOsamu NabeyaMakoto FukushimaKunihiko SakuraiHiroshi YoshidaTeruhiko Ichimura
    • B24B1/00
    • B24B37/30B24B41/061B24B49/105
    • The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.
    • 本发明涉及一种用于将基板(例如半导体晶片)保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。 根据本发明的基板保持装置包括其中具有容纳空间的顶环主体和可在顶环体中的容纳空间内垂直移动的可垂直移动的构件。 具有弹性膜的邻接构件附接到可垂直移动构件的下表面。 邻接构件的弹性膜包括邻接部分,其具有向外突出的凸缘,与基底直接或间接接触;以及连接部分,其从邻接部分的凸缘的基部向上延伸并连接到 垂直活动件。 连接部由具有高于邻接部的材料的柔软性的材料制成。
    • 7. 发明申请
    • Substrate holding device and polishing device
    • 基板保持装置和抛光装置
    • US20050107015A1
    • 2005-05-19
    • US10497151
    • 2002-12-06
    • Tetsuji TogawaOsamu NabeyaMakoto FukushimaKunihiko SakuraiHiroshi YoshidaTeruhiko Ichimura
    • Tetsuji TogawaOsamu NabeyaMakoto FukushimaKunihiko SakuraiHiroshi YoshidaTeruhiko Ichimura
    • B24B41/06B24B5/00
    • B24B37/30B24B41/061B24B49/105
    • The present invention relates to a substrate holding apparatus for holding a substrate (W) such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. A substrate holding apparatus according to the present invention comprises a top ring body (2) having a receiving space therein, and a vertically movable member (206) which is vertically movable within the receiving space in the top ring body. An abutment member (209) having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane (291) of the abutment member comprises an abutment portion (291b), having a flange (291a) projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion (291c) extending upwardly from a base portion (291d) of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than the abutment portion.
    • 本发明涉及一种用于将基板(W)例如半导体晶片保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。 根据本发明的基板保持装置包括其中具有容纳空间的顶环主体(2)和可在顶环体中的容纳空间内垂直移动的可垂直移动构件(206)。 具有弹性膜的抵接构件(209)附接到可升降构件的下表面。 邻接构件的弹性膜(291)包括邻接部分(291b),其具有向外突出的与基底直接或间接接触的凸缘(291a),以及从基底向上延伸的连接部分(291c) 邻接部分的凸缘的基部(291d)并且连接到可垂直移动的构件。 连接部分由具有高于邻接部分的柔性的材料制成。
    • 8. 发明授权
    • Substrate holding device and polishing device
    • 基板保持装置和抛光装置
    • US07033260B2
    • 2006-04-25
    • US10497151
    • 2002-12-06
    • Tetsuji TogawaOsamu NabeyaMakoto FukushimaKunihiko SakuraiHiroshi YoshidaTeruhiko Ichimura
    • Tetsuji TogawaOsamu NabeyaMakoto FukushimaKunihiko SakuraiHiroshi YoshidaTeruhiko Ichimura
    • B24B1/00
    • B24B37/30B24B41/061B24B49/105
    • The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.
    • 本发明涉及一种用于将基板(例如半导体晶片)保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。 根据本发明的基板保持装置包括其中具有容纳空间的顶环主体和可在顶环体中的容纳空间内垂直移动的可垂直移动的构件。 具有弹性膜的邻接构件附接到可垂直移动构件的下表面。 邻接构件的弹性膜包括邻接部分,其具有向外突出的凸缘,与基底直接或间接接触;以及连接部分,其从邻接部分的凸缘的基部向上延伸并连接到 垂直活动件。 连接部由具有高于邻接部的材料的柔软性的材料制成。