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    • 1. 发明申请
    • NITRIDE SEMICONDUCTOR ULTRAVIOLET LIGHT-EMITTING ELEMENT
    • 氮化物半导体超紫外线发光元件
    • US20140021442A1
    • 2014-01-23
    • US14009954
    • 2011-04-21
    • Tetsuhiko InazuCyril PernotAkira Hirano
    • Tetsuhiko InazuCyril PernotAkira Hirano
    • H01L33/40
    • H01L33/405H01L33/32
    • An active layer including an AlGaN semiconductor layer having a band gap energy of 3.4 eV or higher and a p-type cladding layer configured of a p-type AlGaN semiconductor layer and located above the active layer are formed in a first region on the n-type cladding layer, the first region being in a plane parallel to a surface of the n-cladding layer configured of an n-type AlGaN semiconductor layer. An n-electrode metal layer making Ohmic contact with the n-type cladding layer is formed on an adjacent region to the first region in a second region which is a region other than the first region on the n-type cladding layer. A first reflective metal layer reflecting ultraviolet light emitted from the active layer is formed on a surface of the n-type cladding layer in the second region other than the adjacent region. The n-electrode metal layer is arranged between the first region and a region in which the first reflective metal layer contacts the surface of the n-type cladding layer.
    • 在n型半导体器件的第1区域形成有包含具有3.4eV以上的带隙能量的AlGaN半导体层和位于有源层上方的p型AlGaN半导体层构成的p型覆层的有源层, 所述第一区域在与n型AlGaN半导体层构成的n包层的表面平行的平面内。 在与n型包覆层上的第一区域以外的区域的第二区域中,在与第一区域相邻的区域上形成与n型覆层形成欧姆接触的n电极金属层。 反射从有源层发射的紫外光的第一反射金属层形成在除了相邻区域之外的第二区域中的n型包覆层的表面上。 n电极金属层配置在第一区域与第一反射金属层与n型包覆层的表面接触的区域之间。
    • 2. 发明授权
    • Nitride semiconductor ultraviolet light-emitting element
    • 氮化物半导体紫外线发光元件
    • US09112115B2
    • 2015-08-18
    • US14009954
    • 2011-04-21
    • Tetsuhiko InazuCyril PernotAkira Hirano
    • Tetsuhiko InazuCyril PernotAkira Hirano
    • H01L29/06H01L33/40H01L33/32
    • H01L33/405H01L33/32
    • An active layer including an AlGaN semiconductor layer having a band gap energy of 3.4 eV or higher and a p-type cladding layer configured of a p-type AlGaN semiconductor layer and located above the active layer are formed in a first region on the n-type cladding layer, the first region being in a plane parallel to a surface of the n-cladding layer configured of an n-type AlGaN semiconductor layer. An n-electrode metal layer making Ohmic contact with the n-type cladding layer is formed on an adjacent region to the first region in a second region which is a region other than the first region on the n-type cladding layer. A first reflective metal layer reflecting ultraviolet light emitted from the active layer is formed on a surface of the n-type cladding layer in the second region other than the adjacent region. The n-electrode metal layer is arranged between the first region and a region in which the first reflective metal layer contacts the surface of the n-type cladding layer.
    • 在n型半导体器件的第1区域形成有包含具有3.4eV以上的带隙能量的AlGaN半导体层和位于有源层上方的p型AlGaN半导体层构成的p型覆层的有源层, 所述第一区域在与n型AlGaN半导体层构成的n包层的表面平行的平面内。 在与n型包覆层上的第一区域以外的区域的第二区域中,在与第一区域相邻的区域上形成与n型覆层形成欧姆接触的n电极金属层。 反射从有源层发射的紫外光的第一反射金属层形成在除了相邻区域之外的第二区域中的n型包覆层的表面上。 n电极金属层配置在第一区域与第一反射金属层与n型包覆层的表面接触的区域之间。
    • 3. 发明申请
    • NITRIDE SEMICONDUCTOR ULTRAVIOLET LIGHT-EMITTING ELEMENT
    • 氮化物半导体超紫外线发光元件
    • US20130328013A1
    • 2013-12-12
    • US14001342
    • 2011-03-23
    • Tetsuhiko InazuCyril PernotAkira Hirano
    • Tetsuhiko InazuCyril PernotAkira Hirano
    • H01L33/10
    • H01L33/10H01L33/32H01L33/382H01L33/405H01L2933/0016
    • A nitride semiconductor ultraviolet light-emitting element is formed by laminating at least an n-type cladding layer configured of an n-type AlGaN semiconductor layer, an active layer including an AlGaN semiconductor layer having band gap energy of 3.4 eV or larger, and a p-type cladding layer configured of a p-type AlGaN semiconductor layer. A p-type contact layer configured of a p-type AlGaN semiconductor layer that absorbs ultraviolet light emitted from the active layer is formed on the p-type cladding layer. The p-type contact layer has an opening portion penetrating through to a surface of the p-type cladding layer. A p-electrode metal layer that makes Ohmic contact or non-rectifying contact with the p-type contact layer is formed on the p-type contact layer so as not to completely block the opening portion. A reflective metal layer for reflecting the ultraviolet light is formed at least on the opening portion and covers the surface of the p-type cladding layer that is exposed through the opening portion either directly or through a transparent insulating layer that allows the ultraviolet light to pass therethrough.
    • 氮化物半导体紫外线发光元件是通过层叠由n型AlGaN半导体层构成的至少n型包覆层,包含具有3.4eV以上的带隙能量的AlGaN半导体层的有源层,以及 p型覆层,由p型AlGaN半导体层构成。 在p型覆层上形成由p型AlGaN半导体层构成的p型接触层,该p型接触层吸收从有源层发射的紫外线。 p型接触层具有穿透p型包层的表面的开口部。 在p型接触层上形成与p型接触层进行欧姆接触或非整流接触的p电极金属层,以不完全阻挡开口部。 至少在开口部分上形成用于反射紫外光的反射金属层,并且通过开口部分直接或通过允许紫外光通过的透明绝缘层覆盖p型包覆层的表面 通过。
    • 4. 发明授权
    • Nitride semiconductor ultraviolet light-emitting element
    • 氮化物半导体紫外线发光元件
    • US08822976B2
    • 2014-09-02
    • US14001342
    • 2011-03-23
    • Tetsuhiko InazuCyril PernotAkira Hirano
    • Tetsuhiko InazuCyril PernotAkira Hirano
    • H01L29/06H01L33/40H01L33/10H01L33/38H01L33/32
    • H01L33/10H01L33/32H01L33/382H01L33/405H01L2933/0016
    • A nitride semiconductor ultraviolet light-emitting element is formed by laminating at least an n-type cladding layer configured of an n-type AlGaN semiconductor layer, an active layer including an AlGaN semiconductor layer having band gap energy of 3.4 eV or larger, and a p-type cladding layer configured of a p-type AlGaN semiconductor layer. A p-type contact layer configured of a p-type AlGaN semiconductor layer that absorbs ultraviolet light emitted from the active layer is formed on the p-type cladding layer. The p-type contact layer has an opening portion penetrating through to a surface of the p-type cladding layer. A p-electrode metal layer that makes Ohmic contact or non-rectifying contact with the p-type contact layer is formed on the p-type contact layer so as not to completely block the opening portion. A reflective metal layer for reflecting the ultraviolet light is formed at least on the opening portion and covers the surface of the p-type cladding layer that is exposed through the opening portion either directly or through a transparent insulating layer that allows the ultraviolet light to pass therethrough.
    • 氮化物半导体紫外线发光元件是通过层叠由n型AlGaN半导体层构成的至少n型包覆层,包含具有3.4eV以上的带隙能量的AlGaN半导体层的有源层,以及 p型覆层,由p型AlGaN半导体层构成。 在p型覆层上形成由p型AlGaN半导体层构成的p型接触层,该p型接触层吸收从有源层发射的紫外线。 p型接触层具有穿透p型包层的表面的开口部。 在p型接触层上形成与p型接触层进行欧姆接触或非整流接触的p电极金属层,以不完全阻挡开口部。 至少在开口部分上形成用于反射紫外光的反射金属层,并且通过开口部分直接或通过允许紫外光通过的透明绝缘层覆盖p型包覆层的表面 通过。