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1. 发明申请

US20080113501A1 Methods of Forming Semiconductor Constructions 有权
标题翻译：形成半导体结构的方法
公开(公告)号：US20080113501A1
公开(公告)日：2008-05-15
申请号：US11971747
申请日：2008-01-09
申请人： Terrence McDaniel , Scott Southwick , Fred Fishburn
发明人： Terrence McDaniel , Scott Southwick , Fred Fishburn
IPC分类号： H01L21/44
CPC分类号： H01L27/10885 , H01L27/10852 , H01L27/10894 , H01L27/10897 , H01L28/90
摘要： The invention includes methods of forming semiconductor constructions in which electrically conductive structures are formed between bitlines to electrically connect with storage node contacts. The bitlines can be formed within trenches having faceted top portions. The invention also includes semiconductor structures containing trenches with faceted top portions, and containing bitlines within the trenches.
摘要翻译：本发明包括形成半导体结构的方法，其中在位线之间形成导电结构以与存储节点接触电连接。位线可以形成在具有多边形顶部的沟槽内。本发明还包括含有具有多面顶部的沟槽并且在沟槽内包含位线的半导体结构。

2. 发明申请

US20060228880A1 Semiconductor structures, and methods of forming semiconductor constructions 有权
标题翻译：半导体结构以及形成半导体结构的方法
公开(公告)号：US20060228880A1
公开(公告)日：2006-10-12
申请号：US11099972
申请日：2005-04-06
申请人： Terrence McDaniel , Scott Southwick , Fred Fishburn
发明人： Terrence McDaniel , Scott Southwick , Fred Fishburn
IPC分类号： H01L21/4763
CPC分类号： H01L27/10885 , H01L27/10852 , H01L27/10894 , H01L27/10897 , H01L28/90
摘要： The invention includes methods of forming semiconductor constructions in which electrically conductive structures are formed between bitlines to electrically connect with storage node contacts. The bitlines can be formed within trenches having faceted top portions. The invention also includes semiconductor structures containing trenches with faceted top portions, and containing bitlines within the trenches.
摘要翻译：本发明包括形成半导体结构的方法，其中在位线之间形成导电结构以与存储节点接触电连接。位线可以形成在具有多边形顶部的沟槽内。本发明还包括含有具有多面顶部的沟槽并且在沟槽内包含位线的半导体结构。

3. 发明申请

US20080105913A1 Semiconductor Structures 审中-公开
标题翻译：半导体结构
公开(公告)号：US20080105913A1
公开(公告)日：2008-05-08
申请号：US11971785
申请日：2008-01-09
申请人： Terrence McDaniel , Scott Southwick , Fred Fishburn
发明人： Terrence McDaniel , Scott Southwick , Fred Fishburn
IPC分类号： H01L27/108
CPC分类号： H01L27/10885 , H01L27/10852 , H01L27/10894 , H01L27/10897 , H01L28/90
摘要： The invention includes methods of forming semiconductor constructions in which electrically conductive structures are formed between bitlines to electrically connect with storage node contacts. The bitlines can be formed within trenches having faceted top portions. The invention also includes semiconductor structures containing trenches with faceted top portions, and containing bitlines within the trenches.
摘要翻译：本发明包括形成半导体结构的方法，其中在位线之间形成导电结构以与存储节点接触电连接。位线可以形成在具有多边形顶部的沟槽内。本发明还包括含有具有多面顶部的沟槽并且在沟槽内包含位线的半导体结构。

4. 发明申请

US20060189128A1 Method of forming a conductive line and a method of forming a conductive contact adjacent to and insulated from a conductive line 有权
公开(公告)号：US20060189128A1
公开(公告)日：2006-08-24
申请号：US11412524
申请日：2006-04-27
申请人： Scott Southwick , Alex Schrinsky , Terrence McDaniel
发明人： Scott Southwick , Alex Schrinsky , Terrence McDaniel
IPC分类号： H01L21/4763
CPC分类号： H01L21/76885 , H01L21/76834 , H01L21/76897 , H01L27/10885
摘要： This invention includes methods of forming conductive lines, and methods of forming conductive contacts adjacent conductive lines. In one implementation, a method of forming a conductive line includes forming a conductive line within an elongated trench within first insulative material over a semiconductive substrate. The conductive line is laterally spaced from opposing first insulative material sidewall surfaces of the trench. The conductive line includes a second conductive material received over a different first conductive material. The second conductive material is recessed relative to an elevationally outer surface of the first insulative material proximate the trench. A second insulative material different from the first insulative material is formed within the trench over a top surface of the conductive line and within laterally opposing spaces received between the first insulative material and the conductive line. In one implementation, a conductive contact is formed adjacent to and insulated from the conductive line.

5. 发明申请

US20060040465A1 Methods of forming conductive lines and methods of forming conductive contacts adjacent conductive lines 有权
标题翻译：形成导线的方法和在导电线附近形成导电接触的方法
公开(公告)号：US20060040465A1
公开(公告)日：2006-02-23
申请号：US10925158
申请日：2004-08-23
申请人： Scott Southwick , Alex Schrinsky , Terrence McDaniel
发明人： Scott Southwick , Alex Schrinsky , Terrence McDaniel
IPC分类号： H01L21/76
CPC分类号： H01L21/76885 , H01L21/76834 , H01L21/76897 , H01L27/10885
摘要： This invention includes methods of forming conductive lines, and methods of forming conductive contacts adjacent conductive lines. In one implementation, a method of forming a conductive line includes forming a conductive line within an elongated trench within first insulative material over a semiconductive substrate. The conductive line is laterally spaced from opposing first insulative material sidewall surfaces of the trench. The conductive line includes a second conductive material received over a different first conductive material. The second conductive material is recessed relative to an elevationally outer surface of the first insulative material proximate the trench. A second insulative material different from the first insulative material is formed within the trench over a top surface of the conductive line and within laterally opposing spaces received between the first insulative material and the conductive line. In one implementation, a conductive contact is formed adjacent to and insulated from the conductive line.
摘要翻译：本发明包括形成导线的方法，以及在导线附近形成导电触点的方法。在一个实施方案中，形成导线的方法包括在第一绝缘材料内的细长沟槽内在半导体衬底上形成导电线。导电线与沟槽的相对的第一绝缘材料侧壁表面横向隔开。导电线包括接收在不同的第一导电材料上的第二导电材料。第二导电材料相对于靠近沟槽的第一绝缘材料的正面外表面凹陷。不同于第一绝缘材料的第二绝缘材料形成在导电线的顶表面之下的沟槽内并且在第一绝缘材料和导电线之间的横向相对的空间内。在一个实施方案中，导电接触形成为与导电线相邻并与其绝缘。

6. 发明申请

US20120175918A1 FOLDING TABLE AND CHAIR SET WITH PORTABLE CARRYING CASE 审中-公开
标题翻译：折叠桌和椅子与便携式携带
公开(公告)号：US20120175918A1
公开(公告)日：2012-07-12
申请号：US13346535
申请日：2012-01-09
申请人： Scott Southwick , E. Vince Rhoton , Joel Bennett , Brandon Smith , Mitch Johnson , David C. Winter , Wendell Peery
发明人： Scott Southwick , E. Vince Rhoton , Joel Bennett , Brandon Smith , Mitch Johnson , David C. Winter , Wendell Peery
IPC分类号： A47B3/14 , B23P11/00 , B29C49/00
CPC分类号： A47B3/0911 , A47C4/52 , B29C49/00 , B29L2031/7418 , Y10T29/49826
摘要： A table and chair set may include a table, a plurality of chairs and a storage case. The table may include a folding table top that has a footprint in the folded position. The chairs may be folding chairs that have a footprint generally equal to or slightly smaller than the footprint of the table in the folded position. The case may include an interior cavity that is sized and configured to receive at least a portion of the table and the chair in the folded positions, the cavity having a size generally equal to or slightly larger than the footprint of the folding table and the folding chair in the folded positions.
摘要翻译：桌子和椅子可以包括桌子，多个椅子和收纳盒。桌子可以包括在折叠位置具有占地面积的折叠桌面。椅子可以是折叠椅，其具有通常等于或略小于桌子在折叠位置的占地面积的占地面积。壳体可以包括内部空腔，其尺寸和构造成在折叠位置容纳桌子和椅子的至少一部分，空腔具有大致等于或稍大于折叠桌面的覆盖面的尺寸，并且折叠椅子处于折叠位置。

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