专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08944659B2 Methods for assembling electronic devices using embedded light guide structures 有权
标题翻译：使用嵌入式导光结构组装电子设备的方法
公开(公告)号：US08944659B2
公开(公告)日：2015-02-03
申请号：US13401692
申请日：2012-02-21
申请人： Teodor Dabov , Casey J. Feinstein , David A. Pakula , Stephen Brian Lynch
发明人： Teodor Dabov , Casey J. Feinstein , David A. Pakula , Stephen Brian Lynch
IPC分类号： F21V8/00
CPC分类号： G02B6/0081 , C09J5/00 , C09J2203/318 , C09J2205/31 , G02B6/001 , G02B6/0086 , G02B6/102
摘要： Electronic devices may include assemblies of structures such as electronic device assemblies connected using light-cured liquid adhesive such as ultraviolet-light-cured adhesive. Light guide structures may be mounted in the assemblies. During manufacture of an electronic device, ultraviolet light may be injected into a light guide structure to cure the light-cured liquid adhesive. A light guide structure may include portions that prevent escape of ultraviolet light and portions that allow ultraviolet light to escape into the light-cured liquid adhesive. Light guide structures may include masked portions, rigid support members, and one or more openings. Openings in a light guide structure may allow the light-cured liquid adhesive to be injected into an assembly through the openings. An adhesive applicator may be used to apply the adhesive to portions of the assembly. An external light source may be used to inject light that cures the adhesive into the light guide structures.
摘要翻译：电子设备可以包括诸如使用诸如紫外光固化粘合剂的光固化液体粘合剂连接的电子设备组件的结构的组件。导光结构可以安装在组件中。在制造电子装置时，可以将紫外光注入导光结构中以固化光固化液体粘合剂。光导结构可以包括防止紫外线逸出的部分和允许紫外线逸出到光固化液体粘合剂中的部分。导光结构可以包括掩模部分，刚性支撑构件和一个或多个开口。在导光结构中的开口可允许光固化的液体粘合剂通过开口注入到组件中。可以使用粘合剂施加器将粘合剂施加到组件的部分。外部光源可以用于将固化粘合剂的光注入光导结构中。

2. 发明申请

US20130215638A1 Methods For Assembling Electronic Devices Using Embedded Light Guide Structures 有权
标题翻译：使用嵌入式光导体结构组装电子设备的方法
公开(公告)号：US20130215638A1
公开(公告)日：2013-08-22
申请号：US13401692
申请日：2012-02-21
申请人： Teodor Dabov , Casey J. Feinstein , David A. Pakula , Stephen Brian Lynch
发明人： Teodor Dabov , Casey J. Feinstein , David A. Pakula , Stephen Brian Lynch
IPC分类号： F21V8/00 , B32B38/10 , B32B37/12
CPC分类号： G02B6/0081 , C09J5/00 , C09J2203/318 , C09J2205/31 , G02B6/001 , G02B6/0086 , G02B6/102
摘要： Electronic devices may include assemblies of structures such as electronic device assemblies connected using light-cured liquid adhesive such as ultraviolet-light-cured adhesive. Light guide structures may be mounted in the assemblies. During manufacture of an electronic device, ultraviolet light may be injected into a light guide structure to cure the light-cured liquid adhesive. A light guide structure may include portions that prevent escape of ultraviolet light and portions that allow ultraviolet light to escape into the light-cured liquid adhesive. Light guide structures may include masked portions, rigid support members, and one or more openings. Openings in a light guide structure may allow the light-cured liquid adhesive to be injected into an assembly through the openings. An adhesive applicator may be used to apply the adhesive to portions of the assembly. An external light source may be used to inject light that cures the adhesive into the light guide structures.
摘要翻译：电子设备可以包括诸如使用诸如紫外光固化粘合剂的光固化液体粘合剂连接的电子设备组件的结构的组件。导光结构可以安装在组件中。在制造电子装置时，可以将紫外光注入导光结构中以固化光固化液体粘合剂。光导结构可以包括防止紫外线逸出的部分和允许紫外线逸出到光固化液体粘合剂中的部分。导光结构可以包括掩模部分，刚性支撑构件和一个或多个开口。在导光结构中的开口可允许光固化的液体粘合剂通过开口注入到组件中。可以使用粘合剂施加器将粘合剂施加到组件的部分。外部光源可以用于将固化粘合剂的光注入光导结构中。

3. 发明授权

US09578769B2 Components of an electronic device and methods for their assembly 有权
标题翻译：电子设备的组件及其组装方法
公开(公告)号：US09578769B2
公开(公告)日：2017-02-21
申请号：US13610782
申请日：2012-09-11
申请人： Charles B. Woodhull , David A. Pakula , Tang Y. Tan , Douglas Joseph Weber , Christopher D. Prest , Dale N. Memering , Bryan P. Kiple
发明人： Charles B. Woodhull , David A. Pakula , Tang Y. Tan , Douglas Joseph Weber , Christopher D. Prest , Dale N. Memering , Bryan P. Kiple
IPC分类号： H01Q1/42 , H05K5/04 , B23P11/00 , B23P17/00 , G03F1/38 , H01Q1/24 , H04M1/02 , H05K5/02 , H05K13/00 , C25D11/02 , C25D7/00 , C25D11/12 , H05K5/03 , C25D11/34 , B23C5/10 , B23C5/00 , B23P17/02 , H04M1/11 , C25D11/24
CPC分类号： H05K5/04 , B23C5/00 , B23C5/1081 , B23C2220/04 , B23C2220/16 , B23C2220/20 , B23C2220/28 , B23C2220/48 , B23C2226/31 , B23C2226/315 , B23P11/00 , B23P17/00 , B23P17/02 , C25D7/00 , C25D11/02 , C25D11/022 , C25D11/12 , C25D11/246 , C25D11/34 , G03F1/38 , H01Q1/243 , H01Q1/42 , H04M1/0249 , H04M1/0254 , H04M1/11 , H05K5/02 , H05K5/0217 , H05K5/0243 , H05K5/0247 , H05K5/03 , H05K13/00 , Y10T29/47 , Y10T29/49002 , Y10T29/49826 , Y10T156/10 , Y10T156/1064 , Y10T407/1906 , Y10T409/300896 , Y10T409/303752 , Y10T409/30952
摘要： Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
摘要翻译：公开了电子设备外壳的各种部件及其组装方法。壳体可以通过将两个或更多个不同部分组装并连接在一起而形成。壳体的部分可以使用一个或多个联接构件联接在一起。联接构件可以使用双射模制工艺来形成，其中第一射击形成联接构件的结构部分，并且第二射击形成联接构件的化妆品部分。

4. 发明授权

US08927881B2 Insert molded cowling structures 有权
标题翻译：插入模制整流罩结构
公开(公告)号：US08927881B2
公开(公告)日：2015-01-06
申请号：US13607440
申请日：2012-09-07
申请人： Michael B. Wittenberg , Sawyer I. Cohen , Jared M. Kole , Shayan Malek , David A. Pakula , Ashutosh Y. Shukla
发明人： Michael B. Wittenberg , Sawyer I. Cohen , Jared M. Kole , Shayan Malek , David A. Pakula , Ashutosh Y. Shukla
IPC分类号： H05K7/14
CPC分类号： H01Q1/243
摘要： Electronic devices may be provided with electronic components and cowling structures that secure the electronic components. A cowling structure may include a metal portion and an insulating portion that has been insert-molded onto the metal portion. The metal portion and the insert-molded insulating portion may each have an opening that receives a screw. The screws may pass through the respective opening and attach to a substrate. The substrate may be a transparent cover layer for a device display. The cowling structure may press the electronic components against the transparent substrate layer. The device may include an antenna. The insert-molded insulating portion may extend from an edge of the metal portion in the direction of the antenna. The insert-molded insulating portion may prevent one of the screws from forming an electrical connection with the metal portion.
摘要翻译：电子设备可以设置有固定电子部件的电子部件和整流罩结构。整流罩结构可以包括已经插入模制到金属部分上的金属部分和绝缘部分。金属部分和嵌入成型的绝缘部分可以各自具有容纳螺钉的开口。螺钉可以穿过相应的开口并附着到基底上。衬底可以是用于器件显示的透明覆盖层。整流罩结构可以将电子部件压靠在透明基板层上。该装置可以包括天线。插入成型的绝缘部分可以沿着天线的方向从金属部分的边缘延伸。插入成型的绝缘部分可以防止其中一个螺钉与金属部分形成电连接。

5. 发明授权

US08862182B2 Coupling reduction for electromechanical actuator 有权
标题翻译：机电执行器的联轴器减速
公开(公告)号：US08862182B2
公开(公告)日：2014-10-14
申请号：US13602009
申请日：2012-08-31
申请人： Ashutosh Y. Shukla , David A. Pakula , Sawyer I. Cohen
发明人： Ashutosh Y. Shukla , David A. Pakula , Sawyer I. Cohen
IPC分类号： H04M1/00
CPC分类号： H02K41/0356 , Y10T83/606
摘要： A portable electronic device comprises an electromechanical module having an actuator for positioning a mechanical element between first and second positions, and a controller coupled to the electromechanical module. The controller is configured to detect a mechanical event coupling to the electromechanical module, select an actuation signal to position the mechanical element in a safe position between the first and second positions, and transmit the selected signal, such that the mechanical element is positioned in the safe position during the event.
摘要翻译：便携式电子设备包括具有用于在第一和第二位置之间定位机械元件的致动器的机电模块以及耦合到机电模块的控制器。控制器被配置为检测耦合到机电模块的机械事件，选择致动信号以将机械元件定位在第一和第二位置之间的安全位置，并且传送所选择的信号，使得机械元件位于活动期间的安全位置。

6. 发明申请

US20140063265A1 Electronic Device Camera Module With Alignment Structures 有权
标题翻译：具有对准结构的电子装置相机模块
公开(公告)号：US20140063265A1
公开(公告)日：2014-03-06
申请号：US13605837
申请日：2012-09-06
申请人： Ashutosh Y. Shukla , Kenta K. Williams , Shashikant G. Hegde , Tang Yew Tan , David A. Pakula
发明人： Ashutosh Y. Shukla , Kenta K. Williams , Shashikant G. Hegde , Tang Yew Tan , David A. Pakula
IPC分类号： H04N5/225 , H04N17/00 , G03B13/18
CPC分类号： G03B13/18 , G03B17/12 , G03B2217/002 , H04N5/225 , H04N5/2257 , H04N17/00
摘要： An electronic device may include a camera module. Control circuitry within the electronic device may use an image sensor within the camera module to acquire digital images. The camera module may have lens structures that are supported by lens support structures such as a lens barrel and lens carrier. An actuator such as a voice coil motor may control the position of the lens support structures relative to internal support structures such as upper and lower spacer members. Springs may be used to couple the lens support structures to the internal support structures. Outer wall structures in the camera module such as a ferromagnetic shield structures may surround and enclose at least some of the internal support structures. The outer wall structures may have openings. The internal support structures may have pins or other alignment structures that protrude through the openings.
摘要翻译：电子设备可以包括相机模块。电子设备内的控制电路可以使用相机模块内的图像传感器来获取数字图像。相机模块可以具有透镜支架结构支撑的透镜结构，例如透镜镜筒和透镜支架。诸如音圈马达的致动器可以控制透镜支撑结构相对于诸如上部和下部间隔件的内部支撑结构的位置。弹簧可用于将透镜支撑结构连接到内部支撑结构。相机模块中的诸如铁磁屏蔽结构的外壁结构可围绕并包围至少一些内部支撑结构。外壁结构可以具有开口。内部支撑结构可以具有突出穿过开口的销或其它对准结构。

7. 发明授权

US08610822B2 Camera alignment and mounting structures 有权
标题翻译：相机对准和安装结构
公开(公告)号：US08610822B2
公开(公告)日：2013-12-17
申请号：US12794664
申请日：2010-06-04
申请人： Trent Weber , Scott Myers , David A. Pakula , Matthew Hill , Erik L. Wang , Richard Hung Minh Dinh
发明人： Trent Weber , Scott Myers , David A. Pakula , Matthew Hill , Erik L. Wang , Richard Hung Minh Dinh
IPC分类号： H04N5/225
CPC分类号： G03B17/02 , B23K26/351 , H04N5/2251
摘要： An electronic device may be provided with a housing. A camera module may be mounted within the housing. The housing may have a camera window with which a lens in the camera module is aligned. To rotationally and laterally align the camera module with respect to the camera window and the electronic device housing, an alignment structure may be mounted to the housing in alignment with the camera window and housing. The alignment structure may be formed form a ring-shaped structure with an opening. The alignment structures may have sidewalls that form an alignment groove for the camera module. The camera window may be formed from a circular opening in a layer of opaque material deposited on a transparent housing member such as a planar layer of glass. During the process, a laser tool may be used to trim the opening in the opaque material.
摘要翻译：电子设备可以设置有壳体。相机模块可以安装在壳体内。外壳可以具有相机窗口，照相机模块中的透镜与其对准。为了相对于照相机窗口和电子设备外壳旋转和横向对准照相机模块，对准结构可以安装到壳体上，与摄像机窗口和外壳对准。对准结构可以形成为具有开口的环形结构。对准结构可以具有形成相机模块的对准凹槽的侧壁。相机窗口可以由沉积在诸如平面玻璃层的透明外壳构件上的不透明材料层中的圆形开口形成。在该过程中，可以使用激光工具来修整不透明材料中的开口。

8. 发明申请

US20130321237A1 COMPONENTS OF AN ELECTRONIC DEVICE AND METHODS FOR THEIR ASSEMBLY 有权
公开(公告)号：US20130321237A1
公开(公告)日：2013-12-05
申请号：US13610782
申请日：2012-09-11
申请人： Charles B. Woodhull , David A. Pakula , Tang Y. Tan , Douglas Joseph Weber , Christopher D. Prest , Dale N. Memering , Bryan P. Kiple
发明人： Charles B. Woodhull , David A. Pakula , Tang Y. Tan , Douglas Joseph Weber , Christopher D. Prest , Dale N. Memering , Bryan P. Kiple
IPC分类号： H01Q1/42
CPC分类号： H05K5/04 , B23C5/00 , B23C5/1081 , B23C2220/04 , B23C2220/16 , B23C2220/20 , B23C2220/28 , B23C2220/48 , B23C2226/31 , B23C2226/315 , B23P11/00 , B23P17/00 , B23P17/02 , C25D7/00 , C25D11/02 , C25D11/022 , C25D11/12 , C25D11/246 , C25D11/34 , G03F1/38 , H01Q1/243 , H01Q1/42 , H04M1/0249 , H04M1/0254 , H04M1/11 , H05K5/02 , H05K5/0217 , H05K5/0243 , H05K5/0247 , H05K5/03 , H05K13/00 , Y10T29/47 , Y10T29/49002 , Y10T29/49826 , Y10T156/10 , Y10T156/1064 , Y10T407/1906 , Y10T409/300896 , Y10T409/303752 , Y10T409/30952
摘要： Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

9. 发明申请

US20130320823A1 COMPONENTS OF AN ELECTRONIC DEVICE AND METHODS FOR THEIR ASSEMBLY 有权
公开(公告)号：US20130320823A1
公开(公告)日：2013-12-05
申请号：US13610773
申请日：2012-09-11
申请人： Bryan P. Kiple , Charles B. Woodhull , David A. Pakula , Tang Y. Tan
发明人： Bryan P. Kiple , Charles B. Woodhull , David A. Pakula , Tang Y. Tan
IPC分类号： H05K5/02 , H05K5/03
CPC分类号： H05K5/04 , B23C5/00 , B23C5/1081 , B23C2220/04 , B23C2220/16 , B23C2220/20 , B23C2220/28 , B23C2220/48 , B23C2226/31 , B23C2226/315 , B23P11/00 , B23P17/00 , B23P17/02 , C25D7/00 , C25D11/02 , C25D11/022 , C25D11/12 , C25D11/246 , C25D11/34 , G03F1/38 , H01Q1/243 , H01Q1/42 , H04M1/0249 , H04M1/0254 , H04M1/11 , H05K5/02 , H05K5/0217 , H05K5/0243 , H05K5/0247 , H05K5/03 , H05K13/00 , Y10T29/47 , Y10T29/49002 , Y10T29/49826 , Y10T156/10 , Y10T156/1064 , Y10T407/1906 , Y10T409/300896 , Y10T409/303752 , Y10T409/30952
摘要： Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

10. 发明申请

US20130318766A1 COMPONENTS OF AN ELECTRONIC DEVICE AND METHODS FOR THEIR ASSEMBLY 有权
公开(公告)号：US20130318766A1
公开(公告)日：2013-12-05
申请号：US13610778
申请日：2012-09-11
申请人： Bryan P. Kiple , Charles B. Woodhull , David A. Pakula , Tang Y. Tan , Michael P. Coleman , Thomas Johannessen , Richard W. Heley
发明人： Bryan P. Kiple , Charles B. Woodhull , David A. Pakula , Tang Y. Tan , Michael P. Coleman , Thomas Johannessen , Richard W. Heley
IPC分类号： B23P11/00 , B23P17/00
CPC分类号： H05K5/04 , B23C5/00 , B23C5/1081 , B23C2220/04 , B23C2220/16 , B23C2220/20 , B23C2220/28 , B23C2220/48 , B23C2226/31 , B23C2226/315 , B23P11/00 , B23P17/00 , B23P17/02 , C25D7/00 , C25D11/02 , C25D11/022 , C25D11/12 , C25D11/246 , C25D11/34 , G03F1/38 , H01Q1/243 , H01Q1/42 , H04M1/0249 , H04M1/0254 , H04M1/11 , H05K5/02 , H05K5/0217 , H05K5/0243 , H05K5/0247 , H05K5/03 , H05K13/00 , Y10T29/47 , Y10T29/49002 , Y10T29/49826 , Y10T156/10 , Y10T156/1064 , Y10T407/1906 , Y10T409/300896 , Y10T409/303752 , Y10T409/30952
摘要： Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式