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    • 3. 发明授权
    • Split-gate non-volatile memory cell having improved overlap tolerance and method therefor
    • 分离门非易失性存储单元具有改进的重叠公差及其方法
    • US08163615B1
    • 2012-04-24
    • US13052529
    • 2011-03-21
    • Ted R. WhiteGowrishankar L. ChindaloreBrian A. Winstead
    • Ted R. WhiteGowrishankar L. ChindaloreBrian A. Winstead
    • H01L21/336
    • H01L29/42332H01L21/28273H01L27/11524H01L29/42328H01L29/7881
    • A method for forming a split-gate non-volatile memory (NVM) cell includes forming a first gate layer over a semiconductor substrate; forming a conductive layer over the first gate layer; patterning the first gate layer and the conductive layer to form a first sidewall, wherein the first sidewall comprises a sidewall of the first gate layer and a sidewall of the conductive layer; forming a first dielectric layer over the conductive layer and the semiconductor substrate, wherein the first dielectric layer overlaps the first sidewall; forming a second gate layer over the first dielectric layer, wherein the second gate layer is formed over the conductive layer and the first gate layer and overlaps the first sidewall; and patterning the first gate layer and the second gate layer to form a first gate and a second gate, respectively, of the split-gate NVM cell, wherein the second gate overlaps the first gate and a portion of the conductive layer remains between the first gate and the second gate.
    • 一种分离栅极非易失性存储器(NVM)单元的形成方法包括在半导体衬底上形成第一栅极层; 在所述第一栅极层上形成导电层; 图案化第一栅极层和导电层以形成第一侧壁,其中第一侧壁包括第一栅极层的侧壁和导电层的侧壁; 在所述导电层和所述半导体衬底之上形成第一电介质层,其中所述第一电介质层与所述第一侧壁重叠; 在所述第一介电层上形成第二栅极层,其中所述第二栅极层形成在所述导电层和所述第一栅极层上并与所述第一侧壁重叠; 以及图案化所述第一栅极层和所述第二栅极层,以分别形成所述分裂栅极NVM单元的第一栅极和第二栅极,其中所述第二栅极与所述第一栅极重叠,并且所述导电层的一部分保留在所述第一栅极 门和第二门。
    • 7. 发明授权
    • Semiconductor device with stressors and method therefor
    • 具有应力的半导体器件及其方法
    • US07479422B2
    • 2009-01-20
    • US11373536
    • 2006-03-10
    • Brian A. WinsteadTed R. WhiteDa Zhang
    • Brian A. WinsteadTed R. WhiteDa Zhang
    • H01L21/336
    • H01L21/823807H01L21/823814H01L21/823878H01L29/165H01L29/66628H01L29/66636H01L29/7848
    • A method for forming a semiconductor device includes providing a substrate region having a first material and a second material overlying the first material, wherein the first material has a different lattice constant from a lattice constant of the second material. The method further includes etching a first opening on a first side of a gate and etching a second opening on a second side of the gate. The method further includes creating a first in-situ p-type doped epitaxial region in the first opening and the second opening, wherein the first in-situ doped epitaxial region is created using the second material. The method further includes creating a second in-situ n-type doped expitaxial region overlying the first in-situ p-type doped epitaxial region in the first opening and the second opening, wherein the second in-situ n-type doped epitaxial region is created using the second material.
    • 一种形成半导体器件的方法包括提供具有第一材料和覆盖第一材料的第二材料的衬底区域,其中第一材料具有与第二材料的晶格常数不同的晶格常数。 该方法还包括蚀刻栅极的第一侧上的第一开口并蚀刻栅极的第二侧上的第二开口。 该方法还包括在第一开口和第二开口中产生第一原位p型掺杂外延区域,其中使用第二材料产生第一原位掺杂外延区域。 该方法还包括在第一开口和第二开口中形成覆盖第一原位p型掺杂外延区域的第二原位n型掺杂截留区域,其中第二原位n型掺杂外延区域是 使用第二种材料创建。
    • 9. 发明授权
    • Electronic device including a heterojunction region
    • 电子装置包括异质结区域
    • US08390026B2
    • 2013-03-05
    • US11559642
    • 2006-11-14
    • Brian A. WinsteadTed R. White
    • Brian A. WinsteadTed R. White
    • H01L29/78H01L21/04
    • H01L21/84H01L27/1203H01L29/1054H01L29/4966H01L29/517H01L29/518H01L29/78687
    • An electronic device can include a first transistor having a first channel region further including a heterojunction region that, in one aspect, is at most approximately 5 nm thick. In another aspect, the first transistor can include a p-channel transistor including a gate electrode having a work function mismatched with the associated channel region, and the heterojunction region can lie along a surface of a semiconductor layer closer to a substrate than an opposing surface of the substrate. The electronic device can also include an n-channel transistor, and the subthreshold carrier depth of the p-channel and n-channel transistors can have approximately a same value as compared to each other. A process of forming the electronic device can include forming a compound semiconductor layer having an energy band gap greater than approximately 1.2 eV.
    • 电子器件可以包括具有第一沟道区的第一晶体管,该第一沟道区还包括在一个方面为至多约5nm厚的异质结区。 在另一方面,第一晶体管可以包括p沟道晶体管,其包括具有与相关沟道区不匹配的功函数的栅极,并且异质结区可以沿着比相对表面更靠近衬底的半导体层的表面 的基底。 电子设备还可以包括n沟道晶体管,并且p沟道和n沟道晶体管的亚阈值载流子深度可以具有与彼此相差大致相同的值。 形成电子器件的方法可以包括形成具有大于约1.2eV的能带隙的化合物半导体层。