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1. 发明专利

JP2012142393A Method for adhering rare earth compound and apparatus for adhering rare earth compound 审中-公开
标题翻译：加入稀土化合物的方法和装置稀土化合物的装置
公开(公告)号：JP2012142393A
公开(公告)日：2012-07-26
申请号：JP2010293507
申请日：2010-12-28
申请人： Tdk Corp , Tdk株式会社
发明人： SASAKI HIDEKI , ENDO SEIICHI , MARO HITOSHI , YUGE TOSHIRO , MORIMOTO KEIICHI , TAKAHASHI YUTAKA , KIUCHI KIYOKAZU , KOZU TSUTOMU
IPC分类号： H01F41/02 , B22F3/24 , C22C33/02
摘要： PROBLEM TO BE SOLVED: To provide a method for adhering rare earth compound capable of controlling adhesion amount of liquid containing a rare earth compound to a sintered magnet body and suppressing an increase in manufacturing costs of the rare earth sintered magnet body.SOLUTION: The method for adhering rare earth compound comprises an adhering step for adhering a rare earth compound-containing liquid 3 containing rare earth compound to an end face of the sintered magnet body 2 and a side face of the sintered magnet body 2 at the end face side by immersing the sintered magnet body 2 in the rare earth compound-containing liquid 3 at a predetermined depth; a transferring step for pressing the end face of the sintered magnet body 2 against a member 11 to be transferred in which the rare earth compound-containing liquid 3 can be adhered thereto and transferring a part of the rare earth compound-containing liquid 3 adhered to the end face of the sintered magnet body 2 to the member 11 to be transferred; and a side face-scraping step for scraping the part of the rare earth compound-containing liquid 3 adhered to the side face of the sintered magnet body 2 by blades 6, 6.
摘要翻译：待解决的问题：提供一种能够将能够控制含有稀土化合物的液体的粘附量的稀土化合物粘附到烧结磁体上并抑制稀土烧结磁体的制造成本增加的方法。解决方案：稀土化合物的附着方法包括将含有稀土类化合物的含稀土类化合物的液体3粘附到烧结磁体2的端面和烧结磁体2的侧面的粘合工序通过将烧结磁体2浸渍在含稀土类化合物的液体3中的预定深度处，在端面侧; 转印步骤，用于将烧结磁体2的端面压靠在其上可附着含稀土化合物的液体3并转移附着于稀土化合物的液体3的一部分的待转印部件11上烧结磁体2的端面到要被转印的构件11上; 以及用于通过刀片6,6刮擦粘附到烧结磁体2的侧面的含稀土化合物的液体3的一部分的侧面刮削步骤。（C）2012，JPO＆INPIT

2. 发明专利

JP2011129871A Method of manufacturing rare earth sintered magnet, and coating device 有权
标题翻译：制造稀土烧结磁体的方法和涂层装置
公开(公告)号：JP2011129871A
公开(公告)日：2011-06-30
申请号：JP2010186589
申请日：2010-08-23
申请人： Tdk Corp , Tdk株式会社
发明人： SASAKI HIDEKI , KURAHASHI TAKAHIDE , MARO HITOSHI , MORIMOTO KEIICHI , ENDO SEIICHI , BABA FUMITAKA , TANAKA SATORU
IPC分类号： H01F41/02 , B05B13/02 , B05B15/04 , B05D5/12 , B05D7/24 , B22F3/24 , C22C38/00 , H01F1/053 , H01F1/08
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a rare earth sintered magnet in which the surface of a sintered body can be efficiently and uniformly coated with a rare earth compound. SOLUTION: The method of manufacturing the rare earth sintered magnet includes: a coating process of coating the sintered body with slurry including the rare earth compound; a rotating process of holding one end in the longitudinal directional of the sintered body and the other end on the opposite side to the one end, and rotating the sintered body on a straight line which is parallel to the longitudinal direction of the sintered body and passes the sintered body, as an axis of rotation; a drying process of coating the sintered body with the slurry and drying the slurry while rotating the sintered body; and a heat treatment process of heat-treating the sintered body having the slurry dried. In the coating process, the slurry is supplied to the sintered body from a direction orthogonal to the axis of rotation while the sintered body is rotated to coat the sintered body with the slurry. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造稀土烧结磁体的方法，其中可以用稀土化合物有效均匀地涂覆烧结体的表面。解决方案：制造稀土烧结磁体的方法包括：用包括稀土化合物的浆料涂覆烧结体的涂布工艺; 将烧结体的长度方向的一端保持一端，将另一端与该端部的另一端相反的旋转工序，将该烧结体旋转在与烧结体的长度方向平行的直线上并通过烧结体作为旋转轴; 将烧结体用浆料进行涂布并在烧结体旋转的同时进行干燥的干燥工序; 以及将具有浆料干燥的烧结体进行热处理的热处理工艺。在涂布过程中，将浆料从与旋转轴线正交的方向供给到烧结体，同时使烧结体旋转以用浆料涂覆烧结体。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2006231217A Coater and apparatus for manufacturing magnetic tape 审中-公开
标题翻译：用于制造磁带的涂料和装置
公开(公告)号：JP2006231217A
公开(公告)日：2006-09-07
申请号：JP2005050299
申请日：2005-02-25
申请人： Tdk Corp , Tdk株式会社
发明人： SHIMIZU YUTAKA , MOBARA KUNIMASA , IJIMA HISAKAZU , TAKEUCHI TASUKE , ENDO SEIICHI , MORIMOTO KEIICHI
IPC分类号： B05C13/02 , B05C5/02 , G11B5/842
摘要： PROBLEM TO BE SOLVED: To provide a coater by which a coating liquid can be applied on the surface of a belt-like body so as to have uniform thickness.
SOLUTION: The coater is provided with: a backup roll 3 for supporting the belt-like body on the back surface side while being rotated according to the moving speed of the belt-like body; a rotation mechanism 4 the rotary shaft 42b of which is connected to a center shaft 32 of the backup roll 3 while interposing a magnetic coupling 6 between them to rotate the backup roll 3; and a discharge mechanism 5 for discharging the coating liquid toward the surface of the belt-like body moving while being supported by the backup roll 3, so that the coating liquid can be applied on the surface of the belt-like body.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种涂布机，通过该涂布机可以在带状体的表面上施加涂布液以具有均匀的厚度。解决方案：涂布机设置有：支承辊3，用于根据带状体的移动速度在背面侧支撑带状体; 旋转机构4，其旋转轴42b连接到支承辊3的中心轴32，同时在它们之间插入磁性联接器6以使支承辊3旋转; 以及用于在由支承辊3支撑的同时使涂布液向带状体的表面移动的排出机构5，从而可以将涂布液施加在带状体的表面上。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2006007404A Slitter device and manufacturing method for electrode 有权
标题翻译：电极切片装置及制造方法
公开(公告)号：JP2006007404A
公开(公告)日：2006-01-12
申请号：JP2004192203
申请日：2004-06-29
申请人： Tdk Corp , Tdk株式会社
发明人： KATAI KAZUO , MIYAKI YOUSUKE , ENDO SEIICHI
IPC分类号： B26D1/24 , B26D1/20 , H01M4/139
CPC分类号： H01M4/0404 , B26D1/0006 , B26D1/225 , B26D1/245 , B26D2001/002 , B26D2001/0046 , B26D2001/0053 , B26D2007/0075 , H01M4/04 , Y10T83/04 , Y10T83/4757 , Y10T83/4778
摘要： PROBLEM TO BE SOLVED: To sufficiently restrain cut chips of a collector from being melted on an upper blade side surface at the time of cutting a sheet-typed electrode, and sufficiently restrain generation of burrs at the cut surface of the collector.
SOLUTION: A rotating shaft 2 on which one or more upper blades 4 are installed and a rotating shaft 5 to which one or more lower blades 7 are installed are disposed in parallel to each other so that a periphery side surface 4a of the upper blade 4 and a periphery side surface 7a of the lower blade 7 are brought into contact with each other to obtain a prescribed bite depth. The thickness of the upper blade 4 is ≥1 mm, a blade top angle of the upper blade 4 is 75 to 88°, the hardness of the upper blade 4 and the lower blade 7 is ≤6.9×10
3 to 8.8×10
3 N/mm
2 , a gap between the hardness of the upper blade 4 and the hardness of the lower blade 7 is ≤4.9×10
2 N/mm
2 , surface roughness of the upper blade 4 and the lower blade 7 is ≤4 μm, and the gap between the surface roughness of the upper blade 4 and the surface roughness of the lower blade 7 is ≤2 μm.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了在切割片状电极时充分抑制集电体的切屑在上刀面侧熔化，并充分抑制在集电体的切割面产生毛刺。解决方案：安装有一个或多个上叶片4的旋转轴2和安装有一个或多个下叶片7的旋转轴5彼此平行地设置，使得其中的上刀片4和下刀片7的周边侧面7a彼此接触以获得规定的咬入深度。上刀片4的厚度为≥1mm，上刀片4的刀片顶角为75〜88°，上刃4和下刃7的硬度为≤6.9×10 < SP>至8.8×10 3 N / mm 2 ，上刀片4的硬度与下刀片7的硬度之间的间隙为≤4.9×10 < SP> 2 N / mm 2 ，上刀片4和下刀片7的表面粗糙度≤4μm，上刀片4的表面粗糙度与下刀片7的表面粗糙度≤2μm。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2005101265A Lamination chip forming member and method for manufacturing lamination chip electronic part 审中-公开
标题翻译：层压芯片成型及制造层压电子零件的方法
公开(公告)号：JP2005101265A
公开(公告)日：2005-04-14
申请号：JP2003333041
申请日：2003-09-25
申请人： Tdk Corp , Tdk株式会社
发明人： MORIMOTO KEIICHI , KAWAKAMI YOSHIO , ENDO SEIICHI , SASAKI HIDEKI , NIITSUMA JINYO
IPC分类号： H01F41/04
摘要： PROBLEM TO BE SOLVED: To provide a lamination chip forming member which is usable for a large current, and a method for manufacturing a lamination chip electronic part obtained by laminating the lamination chip forming members.
SOLUTION: In the lamination chip forming members and the method for manufacturing the lamination chip electronic part obtained by laminating the lamination chip forming members, the method comprises the step of forming a second member having a second electric characteristic on the surface of a first member having a first electric characteristic, the step of forming a third member which has a third electric characteristic and is electrically connected to the second member on the upper face of the second member, the double layer step of coating a slurry-like material so as to cover the second member and the third member to form a fourth member having a fourth electric characteristic, the drying step of drying the fourth member, and the polishing step of polishing the fourth member so that an upper face of the third member and an upper face of the fourth member are extended flush with each other.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供可用于大电流的层叠芯片形成部件，以及通过层压层叠芯片形成部件而获得的层压芯片电子部件的制造方法。解决方案：在层叠芯片形成部件和通过层压层压芯片形成部件而获得的层压芯片电子部件的制造方法中，该方法包括在第一电极部件的表面上形成具有第二电特性的第二部件的步骤具有第一电特性的第一构件，形成具有第三电特性并与第二构件的上表面上的第二构件电连接的第三构件的步骤，将浆料状材料涂覆的双层步骤为了覆盖第二构件和第三构件以形成具有第四电特性的第四构件，干燥第四构件的干燥步骤以及抛光第四构件的抛光步骤，使得第三构件的上表面和第四构件的上表面彼此平齐地延伸。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2005086056A Lamination chip forming member and method for manufacturing lamination chip electronic component 审中-公开
标题翻译：层压芯片成型及制造层压电子元器件的方法
公开(公告)号：JP2005086056A
公开(公告)日：2005-03-31
申请号：JP2003317916
申请日：2003-09-10
申请人： Tdk Corp , Tdk株式会社
发明人： MORIMOTO KEIICHI , KAWAKAMI YOSHIO , ENDO SEIICHI , SASAKI HIDEKI , NIITSUMA JINYO
IPC分类号： H01G4/12 , H01F41/04 , H01G4/30
摘要： PROBLEM TO BE SOLVED: To provide a lamination chip forming member having an excellent lamination property and a method for manufacturing a lamination chip electronic part in which the member is laminated.
SOLUTION: In the lamination chip forming member and the method for manufacturing the lamination chip electronic part in which the lamination chip forming member is laminated, the method comprises: a stratified step of coating a slurry-like material on the surface of a first member having a first electric characteristic and a second member having a second electric characteristic formed on the surface of the first member and a predetermined pattern shape, so as to be thicker than the thickness of the second member, to form a third member having a third electric characteristic; a drying step of drying the third member; and a polishing step of polishing the third member until the surface of the second member is exposed.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供具有优异的层压性能的层压片形成部件和层压芯片电子部件的制造方法，其中层压该部件。解决方案：在层叠芯片形成部件和层压芯片形成部件层压的层叠芯片电子部件的制造方法中，所述方法包括：在层叠芯片形成部件的表面上涂布浆状材料的分层工序具有第一电特性的第一构件和具有形成在第一构件的表面上并具有预定图案形状的第二电特性的第二构件，以便比第二构件的厚度厚，以形成具有第二构件的第三构件，第三电特性; 干燥第三构件的干燥步骤; 以及抛光第三部件直到第二部件的表面露出的抛光步骤。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2006255493A Coating apparatus and apparatus for manufacturing magnetic tape 审中-公开
标题翻译：涂装装置和制造磁带的装置
公开(公告)号：JP2006255493A
公开(公告)日：2006-09-28
申请号：JP2005072267
申请日：2005-03-15
申请人： Tdk Corp , Tdk株式会社
发明人： SHIMIZU YUTAKA , MOBARA KUNIMASA , IJIMA HISAKAZU , TAKEUCHI TASUKE , ENDO SEIICHI , MORIMOTO KEIICHI
IPC分类号： B05C13/02 , B05C5/02 , G11B5/842
摘要： PROBLEM TO BE SOLVED: To provide a coating apparatus in which a coating liquid is applied on a belt-like surface to be uniformly thick while preventing the occurrence of crack or wrinkle on the belt-like body.
SOLUTION: The coating apparatus is constituted so that the coating liquid is applied on the surface of a resin film 201 by providing a backup roll 3 rotating with the movement of the resin film 201 and supporting the back surface side of the resin film 201, a discharge mechanism 4 for discharging the coating liquid for forming a coating film to the surface of the resin film 201 moved with the support of the backup roll 3 and a sticking mechanism 5 for sticking the coating liquid for bringing the resin film 201 into close contact with the backup roll 3 to the back surface of the resin film 201 in the upstream side of the discharge position of the coating liquid in the moving direction of the resin film 201.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种涂布装置，其中将涂布液施加在带状表面上以均匀地厚，同时防止在带状体上发生裂纹或褶皱。＆lt;解决方案＆gt;解决方案：涂覆装置构成为通过设置随着树脂膜201的移动旋转并支撑树脂膜的背面侧的支撑辊3，将涂布液涂布在树脂膜201的表面上 201是用于将用于形成涂膜的涂布液排出到由支承辊3的支撑件移动的树脂膜201的表面的排出机构4和用于将用于使树脂膜201进入的涂布液粘贴的粘贴机构5 在树脂膜201的移动方向上的涂布液的排出位置的上游侧的树脂膜201的背面与支承辊3紧密接触。（C）2006，JPO＆NCIPI

8. 发明专利

JP2005199381A Punching method and punching device 审中-公开
标题翻译：打孔方法和打孔装置
公开(公告)号：JP2005199381A
公开(公告)日：2005-07-28
申请号：JP2004007796
申请日：2004-01-15
申请人： Tdk Corp , Tdk株式会社
发明人： MIYAHARA KUNIO , SUZUKI KOICHI , ISHIKAWA YUJI , OTSUKA MASAYUKI , ENDO SEIICHI
IPC分类号： B26D7/06 , B26F1/40 , H01G13/00 , H01M4/139
CPC分类号： Y02E60/122
摘要： PROBLEM TO BE SOLVED: To provide a punching device with simple configuration which can reduce detachment of a coated film on a workpiece, dust generation, and bending of metal foils constituting a current collector, and also to provide a method using the same.
SOLUTION: The punching method comprises punching the workpiece 9 fixed to a die with a punch using a punching die 1 equipped with the die 5, 7 and the punch 3, and the device using the same is provided. The workpiece is punched with the punch through a sheet member 17, so that working force applied to the workpiece is reduced and generation of bending of the foils on a cut surface of the workpiece is prevented. In addition the detachment of the coated film on the workpiece is prevented and dust or the like caused by the punching is prevented from adhering to the die.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：解决的问题：提供一种具有简单结构的冲压装置，其能够减少构成集电体的金属箔的工件上的涂膜的分离，粉尘产生和弯曲，并且还提供使用其的方法。解决方案：冲压方法包括使用配备有模具5,7和冲头3的冲压模具冲压固定在模具上的工件9，并且提供使用该模具的装置。工件用冲头冲压穿过薄片部件17，从而减少了施加到工件上的加工力，并且防止了在工件的切割面上产生弯折。此外，防止了涂膜在工件上的脱离，并且防止了由冲压引起的灰尘等附着在模具上。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2003272595A Manufacturing method for electrochemical device, manufacturing equipment, and electrochemical device 审中-公开
标题翻译：电化学装置的制造方法，制造设备和电化学装置
公开(公告)号：JP2003272595A
公开(公告)日：2003-09-26
申请号：JP2002078771
申请日：2002-03-20
申请人： Tdk Corp , Tdk株式会社
发明人： KAWAKAMI YOSHIO , ENDO SEIICHI , SAITO AKIRA , MARO HITOSHI
IPC分类号： H01G9/02 , H01G11/52 , H01G13/00 , H01M2/18 , H01M10/05 , H01M10/0585
CPC分类号： Y02E60/13
摘要： PROBLEM TO BE SOLVED: To provide a method efficiently manufacturing an electrochemical device preventing shrinkage exceeding a fixed value even at temperature causing heat shrinkage, preventing short circuit between positive and negative sheets, not having bad effect on the ionic conductivity of a separator, having high safety causing no hard short-circuit and having high capacity, and to provide manufacturing equipment for the electrochemical device and to provide the electrochemical device. SOLUTION: In the manufacture of the electrochemical device having a stacked body formed by stacking a positive electrode and a negative electrode through the separator, at least the positive electrode and/or the negative electrode are/is interposed between the separators, and when parts of the periphery parts of the separators are melt-bonded to form the bag-shaped separator, the width of the bonded part in the periphery part of the separator is specified to 0.3 mm or less. COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了提供即使在导致热收缩的温度下也能有效地制造电化学装置来防止收缩率超过固定值的方法，防止正片和负片之间的短路，对隔膜的离子电导率没有不良影响具有高安全性，不会发生硬的短路并具有高容量，并且提供用于电化学装置的制造设备并提供电化学装置。解决方案：在具有层叠体的电化学装置的制造中，通过分隔层堆积正极和负极而形成，至少将正极和/或负极夹在隔板之间，并且当分隔件的周边部分的一部分熔融粘合以形成袋状隔板时，将隔膜周边部分中的接合部分的宽度规定为0.3mm以下。版权所有（C）2003，JPO

10. 发明专利

JP2012142425A Slurry supply device and coating device 有权
标题翻译：浆料供应装置和涂料装置
公开(公告)号：JP2012142425A
公开(公告)日：2012-07-26
申请号：JP2010293935
申请日：2010-12-28
申请人： Tdk Corp , Tdk株式会社
发明人： SASAKI HIDEKI , ENDO SEIICHI , MARO HITOSHI , YUGE TOSHIRO , MORIMOTO KEIICHI , TAKAHASHI YUTAKA , KOZU TSUTOMU , KIUCHI KIYOKAZU
IPC分类号： H01F41/02 , B05C5/00 , B05C11/10 , B05C13/02 , B22F3/24
摘要： PROBLEM TO BE SOLVED: To reduce variation in the thickness of a slurry by location of a sintered compact when the sintered compact is coated with a slurry containing a rare earth compound.SOLUTION: A nozzle head 80 includes a slurry outflow passage 82, a cavity 83, a slurry introduction passage 88, and a slurry supply passage 89. The cavity 83 is surrounded by a plurality of wall surfaces so as to store the slurry therein, and the slurry outflow passage 82 is opening thereto. The wall surfaces on both sides of the cavity 83 in the width direction have such a shape as two curved surfaces are connected by one plane, respectively. The slurry supply passage 89 is connected to intersect the slurry introduction passage 88.
摘要翻译：要解决的问题：当烧结体用含有稀土化合物的浆料涂覆时，通过烧结体的位置来减小浆料厚度的变化。解决方案：喷嘴头80包括浆料流出通道82，空腔83，浆料引入通道88和浆料供应通道89.空腔83被多个壁表面包围以便将浆料并且浆料流出通道82向其打开。空腔83的宽度方向两侧的壁面分别具有两个弯曲面的形状，通过一个平面连接。浆料供给通道89连接成与浆料引入通道88相交。版权所有：（C）2012，JPO＆INPIT

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