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    • 6. 发明授权
    • Plasma processing apparatus
    • 等离子体处理装置
    • US06726802B2
    • 2004-04-27
    • US10211498
    • 2002-08-02
    • Takamitsu TaderaTatsushi YamamotoMasaki HirayamaTadahiro Ohmi
    • Takamitsu TaderaTatsushi YamamotoMasaki HirayamaTadahiro Ohmi
    • H05H100
    • H01J37/32211H01J37/32192H01J37/32266
    • A plasma processing apparatus includes a slot plate having a slot-formed region for passing microwave from a waveguide to a microwave entrance window, and a slot plate drive unit driving the slot plate to change the position of the slot plate with respect to the microwave entrance window. The slot plate is thus moved with respect to the microwave entrance window to change at least one of the position, number and area of slot openings where the microwave is passed. The plasma processing apparatus accordingly ensures uniform plasma processing even if the process condition significantly changes when films on a large-area substrate or wafer to be processed are made of different materials or a stacked-layer film composed of layers of different materials is to be processed.
    • 等离子体处理装置包括:槽板,其具有用于将微波从波导传递到微波入口窗口的槽形区域;以及槽板驱动单元,其驱动槽板以改变槽板相对于微波入口的位置 窗口。 狭缝板因此相对于微波入口窗移动,以改变微波通过的槽口的位置,数量和面积中的至少一个。 因此,等离子体处理装置即使在待处理的大面积基板或晶片上的膜由不同的材料制成或由不同材料的层构成的叠层膜将被处理时,即使处理条件显着变化,也能确保均匀的等离子体处理 。
    • 8. 发明授权
    • Backing plate used for sputtering apparatus and sputtering method
    • 用于溅射装置和溅射方法的背板
    • US06776879B2
    • 2004-08-17
    • US10058341
    • 2002-01-28
    • Tatsushi YamamotoTakamitsu Tadera
    • Tatsushi YamamotoTakamitsu Tadera
    • C23C1434
    • H01J37/3435C23C14/3407C23C14/35H01J37/3497
    • It is an object of the invention to provide a backing plate used for the sputtering apparatus and a sputtering method which can improve film deposition rate and film quality without increasing the size of the target with respect to the substrate. High sputtering power is applied to a target portion opposite to a location where a thin film is formed on a surface of a substrate, thereby a thin film having even film thickness and film quality can be formed without increasing the size of the target. Further, a cooling medium flow passage can eliminate temperature unevenness caused by different sputtering powers to be applied to a target surface. The problem caused by the temperature rise can be solved and the film deposition speed can be enhanced by increasing the sputtering power which can be applied to the target. Consequently, it is possible to improve productivity of the substrate.
    • 本发明的目的是提供一种用于溅射装置的背板和可以在不增加靶相对于基板的尺寸的情况下提高成膜速度和薄膜质量的溅射方法。 将高溅射功率施加到与基板表面上形成薄膜的位置相对的目标部分,由此可以形成具有均匀的膜厚度和膜质量的薄膜,而不增加靶的尺寸。 此外,冷却介质流路可以消除由施加到目标表面的不同溅射功率引起的温度不均匀。 可以解决由温度上升引起的问题,并且可以通过增加可应用于靶的溅射功率来提高成膜速度。 因此,可以提高基板的生产率。
    • 9. 发明授权
    • Plasma process device
    • 等离子体处理装置
    • US06446573B2
    • 2002-09-10
    • US09925572
    • 2001-08-09
    • Masaki HirayamaTadahiro OhmiTatsushi YamamotoTakamitsu Tadera
    • Masaki HirayamaTadahiro OhmiTatsushi YamamotoTakamitsu Tadera
    • C23C1600
    • C23C16/45565C23C16/511H01J37/3244
    • A plasma process device capable of forming homogeneous plasma and coping with a large size substrate less costly can be obtained. The plasma process device includes a processing chamber, microwave guiding means, a shower plate and a reaction gas supply passage. The microwave guiding means guides a microwave into the processing chamber. The shower plate has a gas inlet hole to supply to the processing chamber a reaction gas attaining a plasma state by the microwave, and a lower surface facing the processing chamber and an upper surface positioned on the opposite side of the lower surface. The reaction gas supply passage is positioned on the upper surface of the shower plate and supplies the reaction gas to the gas inlet hole. A wall surface of the reaction gas supply passage includes an upper surface of the shower plate and a conductor wall surface opposing the upper surface.
    • 可以获得能够形成均匀等离子体并且应对较大成本的大尺寸基板的等离子体处理装置。 等离子体处理装置包括处理室,微波引导装置,喷淋板和反应气体供应通道。 微波引导装置引导微波进入处理室。 淋浴板具有气体入口孔,以通过微波向处理室供应达到等离子体状态的反应气体,以及面向处理室的下表面和位于下表面相对侧的上表面。 反应气体供给通路位于喷淋板的上表面,将反应气体供给到气体导入孔。 反应气体供给通道的壁面包括淋浴板的上表面和与上表面相对的导体壁表面。
    • 10. 发明授权
    • Plasma process device
    • 等离子体处理装置
    • US06286454B1
    • 2001-09-11
    • US09583161
    • 2000-05-30
    • Masaki HirayamaTadahiro OhmiTatsushi YamamotoTakamitsu Tadera
    • Masaki HirayamaTadahiro OhmiTatsushi YamamotoTakamitsu Tadera
    • C23C1600
    • C23C16/45565C23C16/511H01J37/3244
    • A plasma process device capable of forming homogeneous plasma and coping with a large size substrate less costly can be obtained. The plasma process device includes a processing chamber, microwave guiding device, a shower plate and a reaction gas supply passage. The microwave guiding device guides a microwave into the processing chamber. The shower plate has a gas inlet hole to supply to the processing chamber a reaction gas attaining a plasma state by the microwave, and a lower surface facing the processing chamber and an upper surface positioned on the opposite side of the lower surface. The reaction gas supply passage is a positioned on the upper surface of the shower plate and supplies the reaction gas to the gas inlet hole. A wall surface of the reaction gas supply passage includes an upper surface of the shower plate and a conductor wall surface opposing the upper surface.
    • 可以获得能够形成均匀等离子体并且应对较大成本的大尺寸基板的等离子体处理装置。 等离子体处理装置包括处理室,微波引导装置,喷淋板和反应气体供给通道。 微波引导装置引导微波进入处理室。 淋浴板具有气体入口孔,以通过微波向处理室供应达到等离子体状态的反应气体,以及面向处理室的下表面和位于下表面相对侧的上表面。 反应气体供给通道位于淋浴板的上表面上,并将反应气体供给到气体入口孔。 反应气体供给通道的壁面包括淋浴板的上表面和与上表面相对的导体壁表面。