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    • 9. 发明授权
    • Method for surface treatment of copper foil
    • 铜箔表面处理方法
    • US06419811B2
    • 2002-07-16
    • US09833059
    • 2001-04-12
    • Hisanori ManabeMasasto TakamiMasaru Hirose
    • Hisanori ManabeMasasto TakamiMasaru Hirose
    • C23C2800
    • H05K3/384C25D1/04C25D3/38C25D3/58C25D5/16C25D5/48H05K2201/0355H05K2203/0307H05K2203/0723
    • Disclosed is a process of treating the surface of copper foil without using harmful elements such as arsenic, selenium and tellurium unlike in the prior art. It is possible to, in an easy way, obtain a uniform rough condition and low roughness and produce a high peel strength to such resin base materials as polyimide resin which is weak in peel strength. The process comprises a roughening treatment involving a cathodic electrolysis of at least one side of copper foil near or above the limiting current density in an electrolytic bath containing titanium ions and tungsten ions and prepared by adding sulfuric acid and copper sulfate so as to have copper protrusions deposited and then coating the depositions with copper or copper alloy in a cathodic electrolysis, followed by giving to the surface of the above-mentioned copper or the copper alloy at least one rust-proofing treatment.
    • 公开了不使用现有技术中不使用砷,硒,碲等有害元素来处理铜箔表面的方法。 可以以简单的方式获得均匀粗糙条件和低粗糙度,并且对剥离强度差的聚酰亚胺树脂等树脂基材产生高剥离强度。 该方法包括在含有钛离子和钨离子的电解浴中涉及铜箔的至少一侧的极限电流密度的上述阴极电解的粗糙化处理,并且通过添加硫酸和硫酸铜制成铜突起 沉积,然后在阴极电解中用铜或铜合金涂覆沉积物,然后给予上述铜或铜合金的表面至少一次防锈处理。