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1. 发明授权

US09918970B2 Pharmaceutical composition comprising solifenacin 有权
公开(公告)号：US09918970B2
公开(公告)日：2018-03-20
申请号：US13110295
申请日：2011-05-18
申请人： Tatsunobu Yoshioka , Makoto Murai , Hiroaki Tasaki
发明人： Tatsunobu Yoshioka , Makoto Murai , Hiroaki Tasaki
IPC分类号： A61K31/435 , A61K47/32 , A61K31/439 , A61K47/48
CPC分类号： A61K31/439 , A61K47/32 , A61K47/58 , A61K47/585
摘要： Disclosed is a pharmaceutical composition comprising a complex between solifenacin or a pharmaceutically acceptable salt thereof and an ion exchange resin, and an acrylic based polymer.

2. 发明申请

US20110288118A1 PHARMACEUTICAL COMPOSITION COMPRISING SOLIFENACIN 有权
标题翻译：包含SOLIFENACIN的药物组合物
公开(公告)号：US20110288118A1
公开(公告)日：2011-11-24
申请号：US13110295
申请日：2011-05-18
申请人： Tatsunobu YOSHIOKA , Makoto Murai , Hiroaki Tasaki
发明人： Tatsunobu YOSHIOKA , Makoto Murai , Hiroaki Tasaki
IPC分类号： A61K31/439 , A61P11/00 , A61P11/08 , A61P13/10 , A61P1/00 , A61P1/06 , A61P13/06 , A61P13/00 , A61P11/06
CPC分类号： A61K31/439 , A61K47/32 , A61K47/58 , A61K47/585
摘要： Disclosed is a pharmaceutical composition comprising a complex between solifenacin or a pharmaceutically acceptable salt thereof and an ion exchange resin, and an acrylic based polymer.
摘要翻译：公开了一种药物组合物，其包含索非立新或其药学上可接受的盐与离子交换树脂和丙烯酸类聚合物之间的络合物。

3. 发明授权

US08656581B2 Method of fabricating a circuit apparatus 有权
标题翻译：电路装置的制造方法
公开(公告)号：US08656581B2
公开(公告)日：2014-02-25
申请号：US12563849
申请日：2009-09-21
申请人： Makoto Murai , Yasuhiro Kohara , Ryosuke Usui
发明人： Makoto Murai , Yasuhiro Kohara , Ryosuke Usui
IPC分类号： H05K3/36
CPC分类号： H05K3/243 , H01L23/3128 , H01L23/3142 , H01L23/50 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/85 , H01L2224/05553 , H01L2224/16225 , H01L2224/16237 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48464 , H01L2224/48465 , H01L2224/48599 , H01L2224/48644 , H01L2224/49171 , H01L2224/81801 , H01L2224/85444 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01088 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/351 , H05K3/284 , H05K3/3452 , H05K3/382 , H05K2201/0989 , H05K2203/049 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49222 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method for fabricating a circuit apparatus includes forming a wiring layer, a conductive layer, and a first insulating layer on the wiring substrate, removing the conductive layer in an opening of the first insulating layer so as to expose the wiring layer, forming a gold plating layer on the wiring layer, removing the first insulating layer and the conductive layer, forming a second insulating layer on the wiring substrate, the second insulating layer having an opening through which the gold plating and adjacent wiring layers are exposed, and electrically connecting a circuit element to the gold plating layer.
摘要翻译：一种制造电路装置的方法，包括在布线基板上形成布线层，导电层和第一绝缘层，去除第一绝缘层的开口中的导电层，以露出布线层，形成金在所述布线层上除去所述第一绝缘层和所述导电层，在所述布线基板上形成第二绝缘层，所述第二绝缘层具有开金属镀层和相邻配线层露出的开口，电路元件到镀金层。

4. 发明授权

US5274843A Paging apparatus having a battery saving function 失效
标题翻译：具有省电功能的寻呼装置
公开(公告)号：US5274843A
公开(公告)日：1993-12-28
申请号：US821862
申请日：1992-01-16
申请人： Makoto Murai , Kiyoshi Wagai , Tatsuaki Sekigawa
发明人： Makoto Murai , Kiyoshi Wagai , Tatsuaki Sekigawa
IPC分类号： H04B1/16 , H04W52/02 , H04W88/02 , H04Q3/02
CPC分类号： H04B1/1615 , H04W52/0229 , H04W88/022
摘要： A paging apparatus having a battery saving function comprises a power supply to a radio circuit and a power supply control circuit. Power is turned on periodically in synchronization with the detection of synchronization signals and is turned off responsive to the detection of a predetermined sequence. The power supply to the radio circuit remains turned off without being turned on periodically for a predetermined time period in response to the detection of a specific code addressed to the paging apparatus.
摘要翻译：具有电池节电功能的寻呼装置包括对无线电电路的电源和电源控制电路。与同步信号的检测同步地周期性地接通电力，并且响应于预定序列的检测而断开电源。响应于检测寻址到寻呼装置的特定码，无线电路的电源保持关闭而不会周期性地启动预定时间段。

5. 发明授权

US5105189A Paging apparatus for receiving and displaying messages 失效
标题翻译：用于接收和显示消息的寻呼装置
公开(公告)号：US5105189A
公开(公告)日：1992-04-14
申请号：US553603
申请日：1990-07-18
申请人： Makoto Murai , Tatsuaki Sekigawa
发明人： Makoto Murai , Tatsuaki Sekigawa
IPC分类号： H04Q7/14 , G08B5/22
CPC分类号： G08B5/227
摘要： A paging apparatus includes a first switch for turning on/off a power supply, a second switch, a memory for storing a received message, a display for displaying a message read out from the memory, a switch operation detector for detecting operations for the first and second switches, and a message controller for selectively executing a display mode of displaying the message, a preservation mode of preserving the message in the memory, and a clear mode of clearing the message stored in the memory, in response to a conbination of operations of the first and second switches detected by the switch operation detector.
摘要翻译：寻呼装置包括用于打开/关闭电源的第一开关，第二开关，用于存储接收到的消息的存储器，用于显示从存储器读出的消息的显示器，用于检测第一和第二开关，以及消息控制器，用于响应于操作的结合，选择性地执行显示消息的显示模式，保存存储器中的消息的保存模式以及清除存储在存储器中的消息的清除模式由开关操作检测器检测到的第一和第二开关。

6. 发明授权

US07612445B2 Circuit apparatus and method of fabricating the apparatus 有权
标题翻译：电路装置及其制造方法
公开(公告)号：US07612445B2
公开(公告)日：2009-11-03
申请号：US11740669
申请日：2007-04-26
申请人： Makoto Murai , Yasuhiro Kohara , Ryosuke Usui
发明人： Makoto Murai , Yasuhiro Kohara , Ryosuke Usui
IPC分类号： H01L23/48 , H01L23/06 , H01R43/00
CPC分类号： H05K3/243 , H01L23/3128 , H01L23/3142 , H01L23/50 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/85 , H01L2224/05553 , H01L2224/16225 , H01L2224/16237 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48464 , H01L2224/48465 , H01L2224/48599 , H01L2224/48644 , H01L2224/49171 , H01L2224/81801 , H01L2224/85444 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01088 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/351 , H05K3/284 , H05K3/3452 , H05K3/382 , H05K2201/0989 , H05K2203/049 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49222 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The likelihood of exfoliation of a sealing resin layer at a pad electrode part is reduced so that the reliability of a circuit apparatus is improved. A circuit apparatus includes a wiring layer, a gold plating layer, an insulating resin layer, a circuit element, a conductive member and sealing resin layer. The gold plating layer is formed in an wiring layer area for the pad electrode. The surface outside the area is roughened. The insulating resin layer is formed so as to cover the wiring layer and to have an opening in an area in which the pad electrode is formed. The circuit element is mounted on a predetermined area on the insulating resin layer. The sealing resin layer is formed on the insulating resin layer so as to entirely cover the circuit element and the opening for the pad electrode. The sealing resin layer, in the area for the pad electrode, is in contact with the gold plating layer and the wiring layer.
摘要翻译：密封树脂层在焊盘电极部分的剥离的可能性降低，从而提高了电路设备的可靠性。电路装置包括布线层，镀金层，绝缘树脂层，电路元件，导电构件和密封树脂层。金电镀层形成在焊盘电极的布线层区域中。该地区外面的表面粗糙。绝缘树脂层形成为覆盖布线层，并且在形成焊盘电极的区域中具有开口。电路元件安装在绝缘树脂层上的预定区域上。密封树脂层形成在绝缘树脂层上，以完全覆盖电路元件和焊盘电极的开口。用于焊盘电极的区域中的密封树脂层与镀金层和布线层接触。

7. 发明申请

US20070252270A1 Circuit Apparatus 审中-公开
标题翻译：电路设备
公开(公告)号：US20070252270A1
公开(公告)日：2007-11-01
申请号：US11740639
申请日：2007-04-26
申请人： Yoh Takano , Ryosuke Usui , Makoto Murai
发明人： Yoh Takano , Ryosuke Usui , Makoto Murai
IPC分类号： H01L23/34
CPC分类号： H01L23/3677 , H01L21/4871 , H01L23/3735 , H01L24/45 , H01L24/48 , H01L25/16 , H01L2224/45144 , H01L2224/48227 , H01L2224/48472 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H05K1/0206 , H05K1/056 , H05K3/062 , H05K3/383 , H05K3/4644 , H05K2201/09054 , H05K2201/09509 , H05K2203/0369 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： Heat from a circuit element is effectively conducted to a metal substrate so that reliability of a circuit apparatus is improved. A circuit element is configured such that a wiring layer is formed on a metal substrate. Power devices are mounted on the wiring layer in addition to a circuit element constituting a control unit. Steps are formed by grooves of a predetermined pattern on the primary surface of the metal substrate. High heat dissipation circuit elements generating a relatively large amount of heat (i.e., power devices) are mounted above projections on the metal substrate. Low heat dissipation circuit elements generating a relatively small amount of heat are mounted above the depression in the metal substrate. In other words, the distance between the power device which generates a relatively large amount of heat and the metal substrate opposite to the device is smaller than the distance between the circuit element of the control unit which generates a relatively small amount of heat and the metal substrate opposite to the element.
摘要翻译：电路元件的热量有效地传导到金属基板，从而提高了电路装置的可靠性。电路元件被配置为使得布线层形成在金属基板上。功率器件除了构成控制单元的电路元件之外还安装在布线层上。步骤由金属基板的主表面上的预定图案的凹槽形成。产生相对大量热量的高散热电路元件（即，功率器件）安装在金属基板上的突起上方。产生相对较少热量的低散热电路元件安装在金属基板上的凹陷上方。换句话说，产生相对大量热量的功率器件与与器件相反的金属衬底之间的距离小于产生相对少量热量的控制单元的电路元件与金属之间的距离衬底与元件相对。

8. 发明申请

US20070200220A1 FLEXIBLE SUBSTRATE 审中-公开
标题翻译：柔性基板
公开(公告)号：US20070200220A1
公开(公告)日：2007-08-30
申请号：US11678309
申请日：2007-02-23
申请人： Makoto Murai , Ryosuke Usui
发明人： Makoto Murai , Ryosuke Usui
IPC分类号： H01L23/053
CPC分类号： H01L23/4985 , H01L2924/0002 , H05K1/0366 , H05K1/0393 , H05K2201/029 , H01L2924/00
摘要： A flexible substrate is provided which contains not only flexibility but also rigidity and hear resistance. A flexible substrate includes a first wiring layer, an insulating resin layer, a glass cloth and a second wiring layer. The insulating layer is formed by an insulating material, such as a BT resin, epoxy resin or the like that contains a high elastic modulus, heat resistance and moisture resistance. The film thickness of the insulating resin layer is thinned down to about 60 μm. As a reinforcing material, the glass cloth is embedded in the insulating resin layer. With this structure, the flexible substrate attains flexibility and at the same time in any of the first wiring layer and the second wiring layer, circuit elements can be mounted both on a curved area and a non-curved area of the wiring layers.
摘要翻译：提供了柔性基板，其不仅包含柔性，而且包含刚性和听阻力。挠性基板包括第一布线层，绝缘树脂层，玻璃布和第二布线层。绝缘层由包含高弹性模量，耐热性和耐湿性的BT树脂，环氧树脂等绝缘材料形成。绝缘树脂层的膜厚变薄至约60μm。作为增强材料，玻璃布嵌入绝缘树脂层中。利用这种结构，柔性基板具有灵活性，并且同时在第一布线层和第二布线层中的任一个中，电路元件既可以安装在布线层的弯曲区域和非弯曲区域上。

9. 发明申请

US20050280805A1 Mura defect inspection mask, apparatus and method of inspecting the mura defect, and method of producing a photomask 失效
标题翻译： Mura缺陷检查掩模，检查mura缺陷的装置和方法以及制造光掩模的方法
公开(公告)号：US20050280805A1
公开(公告)日：2005-12-22
申请号：US11139970
申请日：2005-05-31
申请人： Makoto Murai
发明人： Makoto Murai
IPC分类号： G01B11/30 , G01M11/00 , G01N21/88 , G01N21/956 , G03F1/84 , H01L21/027
CPC分类号： G01N21/956
摘要： Plural repetitive patterns 61 are formed on a transparent substrate 62 in the unit of a chip 65. Each of the repetitive patterns has plural pseudo mura defects 66 to which intensities of mura defects occurring in a predetermined repetitive pattern are allocated with being stepwise changed, for respective kinds of the mura defects. The mura defects are a CD Mura based on an abnormality in critical dimension of unit patterns 63 in the repetitive patterns, a Pitch Mura based on an abnormality in interval of the repetitive patterns, a Butting Mura-based on a positional displacement of the repetitive patterns, and a Defect mura based on a pattern defect of unit patterns in the repetitive patterns.
摘要翻译：多个重复图案61以芯片65为单位形成在透明基板62上。每个重复图案具有多个伪mura缺陷66，对于各种mura缺陷，分配以预定重复图案发生的mura缺陷的强度逐步改变。基于重复图案中的单位图案63的临界尺寸的异常，基于重复图案的间隔异常的间隔Mura，基于重复图案的位置偏移的对接Mura，基于Mura缺陷，以及基于重复模式中单位模式的模式缺陷的缺陷缺陷。

10. 发明授权

US06970910B2 Method for participating in network type game, server system for the same, and recording medium upon which program for the same is recorded 失效
标题翻译：用于参与网络型游戏的方法，用于其的服务器系统以及记录有相同程序的记录介质
公开(公告)号：US06970910B2
公开(公告)日：2005-11-29
申请号：US09982743
申请日：2001-10-18
申请人： Makoto Murai
发明人： Makoto Murai
IPC分类号： A63F13/12 , A63F13/00 , H04L29/06 , G06F15/16 , A63F9/24
CPC分类号： H04L67/38
摘要： A moving image for a game which is conducted at a specific location are distributed in real time, so as to implement a network participation type game which has an enhanced feeling of reality. By this game being distributed as a moving image in real time via a transmission line such as the Internet or a telephone line network, and by an unspecified number of people entering into conversation via terminal devices which receive this game, the game conducted at the specific location is executed, and thereby the feeling of reality is increased. Furthermore by including, in this game which is distributed as a moving image, reference time information which absorbs the time difference between the game which is conducted at the specific location and the game which is conducted upon the terminal device, players can participate in this game simultaneously in real time.
摘要翻译：在特定位置进行的游戏的运动图像被实时地分布，以实现具有增强的现实感的网络参与型游戏。通过这样的游戏，通过诸如因特网或电话线网络之类的传输线，以及通过接收该游戏的终端设备进入对话的未指定数量的人被实时地作为运动图像分发，执行位置，从而增加了现实感。此外，通过在作为动态图像分发的游戏中包含吸收在特定位置进行的游戏与在终端装置之间进行的游戏之间的时差的参考时间信息，玩家可以参与该游戏同时实时。

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